Patents by Inventor Toshiyuki Kitagawa

Toshiyuki Kitagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090059470
    Abstract: According to the configuration and the manufacturing method of forming a moisture proof agent on both surfaces of a circuit substrate after soldering a capacitor connection pin in a vertical direction to the circuit substrate, and electrically connecting the capacitor so as to be in a perpendicular direction to the length direction of the capacitor connection pin at the upper space of the circuit substrate, the possibility of the moisture proof agent attaching to the capacitor is eliminated, the productivity enhances since the moisture proof agent can be easily formed on both surfaces of the circuit substrate, and a capacitor unit of miniaturized and low height configuration is realized since the capacitor is mounted in the horizontal direction in the upper space with respect to the circuit substrate.
    Type: Application
    Filed: March 13, 2007
    Publication date: March 5, 2009
    Applicant: MATUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Kazuki Morita, Tatehiko Inoue, Shusaku Kawasaki, Toshiyuki Kitagawa, Tooru Ninomiya
  • Patent number: 6631071
    Abstract: A reliable capacitor module is provided which can solve the following problem: when a plurality of capacitors is mounted on a wiring board, the wiring board is distorted and deformed by the weight and cracks appear on mounting holes and the main body of the wiring board. The bottoms of metallic cases of the capacitors are fit in recesses formed on a mounting plate. In this state, lead wires drawn from the upper surfaces of the capacitors are electrically connected via the wiring board. With this configuration, a weight load of the plurality of capacitors is not applied at all, thereby preventing distortion and deformation of the wiring board and vibration causing cracks on the main body of the wiring board.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: October 7, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Kitagawa, Tatehiko Inoue, Isao Masumoto, Koji Tsuyuki
  • Publication number: 20030133251
    Abstract: A reliable capacitor module is provided which can solve the following problem: when a plurality of capacitors is mounted on a wiring board, the wiring board is distorted and deformed by the weight and cracks appear on mounting holes and the main body of the wiring board. The bottoms of metallic cases of the capacitors are fit in recesses formed on a mounting plate. In this state, lead wires drawn from the upper surfaces of the capacitors are electrically connected via the wiring board. With this configuration, a weight load of the plurality of capacitors is not applied at all, thereby preventing distortion and deformation of the wiring board and vibration causing cracks on the main body of the wiring board.
    Type: Application
    Filed: January 14, 2003
    Publication date: July 17, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Kitagawa, Tatehiko Inoue, Isao Masumoto, Koji Tsuyuki
  • Patent number: 6083426
    Abstract: A conductive paste having excellent printing properties, which can be used for manufacturing heat-resistant conductors and resistive elements, is described. Such a conductive paste can be obtained by preparing as a binder a polyimide precursor whose weight average degree of polymerization (n) ranges from 5 to 20, and mixing it with a solvent and a conductive powder. The polyimide precursor preferably is included in the range from 50 to 80 weight parts to 100 weight parts of the solvent. A polar solvent, or a mixed solvent including a polar solvent and a nonpolar solvent can be used. A preferable mixed solvent is a mixture of N-methyl-2-pyrrolidone and diethylene glycol dimethyl ether, in which the mixing volume ratio is preferably ranging from 2:8 to 9:1, more preferably, 2:8 to 3:7.
    Type: Grant
    Filed: June 8, 1999
    Date of Patent: July 4, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yukihiro Shimasaki, Yusuke Ozaki, Masanaru Hasegawa, Toshiyuki Kitagawa
  • Patent number: 5469962
    Abstract: This invention relates to packing methods and materials for packing electrolytic capacitors and the like. This invention provides packing methods whereby capacitors are held in a container tray with a good order and with no rotational movement of capacitor and packing materials wherein packing of electrolytic capacitors solves the problem of capacitor rotation and allows the capacitors to be easily taken out of the container tray. According to this invention, an electrolytic capacitor loaded container tray is taken out of a receptacle and the electrolytic capacitors held in the container tray in an orderly manner can be smoothly picked up for automatic mounting on printed wiring boards.
    Type: Grant
    Filed: June 24, 1994
    Date of Patent: November 28, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Kitagawa, Hideharu Nagai, Junkichi Kawamura, Hitoshi Mizuguchi
  • Patent number: 5099991
    Abstract: Electrolytic capacitors 14 having terminals 15, 16 on one base face and a fixing frame at the other end part are inserted in bags made of air-bubble plastic sheet of tubular shape whose one end is welded to form an end and further having a terminal-protection part 13 made by folding the end part of the bag and welded to the welded part 12, and the bags 11 containing the electrolytic capacitor 14 are compactly packed in a box 18 of corrugated cardboard in alternating direction and flaps 191, 191, 192, 192 are closed and sealed; the electrolytic capacitors 14 having delicate terminals 15, 16 are safely and compactly packed in the box 18, and the terminals 15, 16 and the bent part of the fixing frames 17, are safely isolated by the bag.
    Type: Grant
    Filed: October 3, 1990
    Date of Patent: March 31, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Kitagawa, Hideharu Nagai, Tooru Yamaguchi, Fumiaki Kawaguchi
  • Patent number: 4947846
    Abstract: The present invention is characterized by a construction wherein a magnet is provided either to the connector or the ECG electrode, and a magnetic material or a magnet to the other, and both are stuck by magnetic attraction. Subsequently, a water penetration prevention sealing material, comprising a closed-cell type foam material, is interposed between the electrode case and the connector. Due to this construction, electric signals do not leak into the water and the connector is not pressed against the electrode.
    Type: Grant
    Filed: February 6, 1989
    Date of Patent: August 14, 1990
    Assignee: TDK Corporation
    Inventors: Toshiyuki Kitagawa, Namio Katoh
  • Patent number: 4320370
    Abstract: A thermo-sensitive reed switch in which the thermo-sensitive magnetic element is slit parallel to the reeds in the element.
    Type: Grant
    Filed: April 28, 1980
    Date of Patent: March 16, 1982
    Assignee: TDK Electronics Company, Ltd.
    Inventors: Tomio Itou, Toshiyuki Kitagawa