Patents by Inventor Toshiyuki Kohsaka

Toshiyuki Kohsaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080087634
    Abstract: A manufacturing method of a semiconductor device includes forming a metal mask on a substrate or on a layer provided on the substrate, and removing at least one of the substrate and the layer provided on the substrate selectively through a dry etching treatment with use of the metal mask. The metal mask has a first open pattern and a second open pattern. The first open pattern is opened at a given area of the metal pattern. The second open pattern is opened at an area dividing the metal mask.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 17, 2008
    Applicant: EUDYNA DEVICES
    Inventors: Toshiyuki Kohsaka, Tsutomu Komatani