Patents by Inventor Toshiyuki Kudo

Toshiyuki Kudo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11067602
    Abstract: To maintain the horizontalness of a probe card even, if the number of measured DUTs is increased. An electrical connecting apparatus according to the present, disclosure comprises a support member having a lower surface region in which a level part is formed and a wiring board provided adjacent to the lower surface of the support member, and to be connected to a testing device side. The electrical connecting apparatus comprises: a connection unit having multiple connection terminals; a probe substrate electrically connecting multiple probes to the connection terminals; multiple anchors arranged on the upper surface of the probe substrate; and multiple supports functioning as supports between corresponding ones of the anchors and the support member via the wiring board and the connection unit.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: July 20, 2021
    Assignee: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Toshiyuki Kudo, Takayuki Narumi, Yoshinori Kikuchi, Takao Yasuta
  • Publication number: 20200191829
    Abstract: To maintain the horizontalness of a probe card even, if the number of measured DUTs is increased. An electrical connecting apparatus according to the present, disclosure comprises a support member having a lower surface region in which a level part is formed and a wiring board provided adjacent to the lower surface of the support member, and to be connected to a testing device side. The electrical connecting apparatus comprises: a connection unit having multiple connection terminals; a probe substrate electrically connecting multiple probes to the connection terminals; multiple anchors arranged on the upper surface of the probe substrate; and multiple supports functioning as supports between corresponding ones of the anchors and the support member via the wiring board and the connection unit.
    Type: Application
    Filed: November 8, 2019
    Publication date: June 18, 2020
    Applicant: KABUSHI KAISHA NIHON MICRONICS
    Inventors: TOSHIYUKI KUDO, TAKAYUKI NARUMI, YOSHINORI KIKUCHI, TAKAO YASUTA
  • Patent number: 9622344
    Abstract: A multi-layer wiring board includes wiring layers stacked on a substrate with an insulating layer between each layer. A wire formed in the wiring layer consists of a first layer and a second layer to form a double layered structure. The first layer is made of a first conductive material and the second layer is made of a second conductive material having relative magnetic permeability of 10 or more and larger than that of the first conductive material. The characteristic impedance of the wire is adjusted to a value closer to 50 ohms than that of a wire which has the same thickness as of the wire with the double layered structure, and is made only of the first conductive material.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: April 11, 2017
    Assignee: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Tatsuo Inoue, Takayasu Sugai, Toshiyuki Kudo, Toshinori Omori
  • Patent number: 9110098
    Abstract: Provided is a probe card capable of effectively placing electronic parts. A probe card according to the present invention includes a plurality of probes that come into contact with a plurality of electrodes of a device, a probe board including the plurality of probes provided thereon, a wiring board that is placed facing a surface of the probe board opposite to a surface including the probes provided thereon, a connector that includes a connection pin and a holder, in which the connection pin electrically connects a line of the probe board and a line of the wiring board, and the holder holds the connection pin between the probe board and the wiring board, and a first electronic part that is mounted on a probe board side surface of the wiring board and placed in a mounting space formed by a through hole or a recess provided in the holder.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: August 18, 2015
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Katsushi Mikuni, Yoshinori Kikuchi, Yoshihito Onuma, Toshiyuki Kudo
  • Publication number: 20150107884
    Abstract: The object of the present invention is to provide a multi-layer wiring board which is easy to adjust the characteristic impedance and is able to adapt to the narrow-pitch tendency of terminals, and a process for manufacturing the same.
    Type: Application
    Filed: February 28, 2013
    Publication date: April 23, 2015
    Applicant: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Tatsuo Inoue, Takayasu Sugai, Toshiyuki Kudo, Toshinori Omori
  • Patent number: 8680880
    Abstract: An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.
    Type: Grant
    Filed: December 14, 2009
    Date of Patent: March 25, 2014
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Hidehiro Kiyofuji, Tetsuya Iwabuchi, Toshiyuki Kudo, Seiji Kanazawa
  • Publication number: 20140028341
    Abstract: Provided is a probe card capable of effectively placing electronic parts. A probe card according to the present invention includes a plurality of probes that come into contact with a plurality of electrodes of a device, a probe board including the plurality of probes provided thereon, a wiring board that is placed facing a surface of the probe board opposite to a surface including the probes provided thereon, a connector that includes a connection pin and a holder, in which the connection pin electrically connects a line of the probe board and a line of the wiring board, and the holder holds the connection pin between the probe board and the wiring board, and a first electronic part that is mounted on a probe board side surface of the wiring board and placed in a mounting space formed by a through hole or a recess provided in the holder.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 30, 2014
    Inventors: Katsushi MIKUNI, Yoshinori KIKUCHI, Yoshihito ONUMA, Toshiyuki KUDO
  • Patent number: 8365130
    Abstract: A computer program generates a wire routing pattern that connects one driver with a plurality of receivers. The overlapping length of each vector pair, which consists of any two vectors headed from the driver to the receivers, is calculated. One vector pair that has the greatest overlapping length is selected. For the selected vector pair, three kinds of common nodes are created, each of which is used to make a common path part of the way to the receivers, to generate three kinds of renewed vector patterns. The operations are repeated and plural candidate routing patters are acquired. One candidate routing pattern having the smallest total wiring length is selected as the optimum routing pattern. If there exist plural patterns that have the same smallest total wiring length, one pattern can be selected that has the smallest one of the greatest. D-R path lengths.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: January 29, 2013
    Assignee: Micronics Japan Co., Ltd.
    Inventors: Katsushi Mikuni, Toshiyuki Kudo, Masatoshi Yokouchi, Issei Sakurada, Tatsuo Inoue
  • Publication number: 20120167032
    Abstract: A computer program generates a wire routing pattern that connects one driver with a plurality of receivers. The overlapping length of each vector pair, which consists of any two vectors headed from the driver to the receivers, is calculated. One vector pair that has the greatest overlapping length is selected. For the selected vector pair, three kinds of common nodes are created, each of which is used to make a common path part of the way to the receivers, to generate three kinds of renewed vector patterns. The operations are repeated and plural candidate routing patters are acquired. One candidate routing pattern having the smallest total wiring length is selected as the optimum routing pattern. If there exist plural patterns that have the same smallest total wiring length, one pattern can be selected that has the smallest one of the greatest D-R path lengths.
    Type: Application
    Filed: December 28, 2011
    Publication date: June 28, 2012
    Applicant: MICRONICS JAPAN CO., LTD.
    Inventors: Katsushi Mikuni, Toshiyuki Kudo, Masatoshi Yokouchi, Issei Sakurada, Tatsuo Inoue
  • Publication number: 20100164520
    Abstract: An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.
    Type: Application
    Filed: December 14, 2009
    Publication date: July 1, 2010
    Applicant: Kabushiki Kaisha Nihon Micronics
    Inventors: Hidehiro KIYOFUJI, Tetsuya IWABUCHI, Toshiyuki KUDO, Seiji KANAZAWA
  • Publication number: 20100152419
    Abstract: A DNA which encodes a fused protein containing an insulin precursor of the overexpression secretion type for producing transgenic insulin, and a method of producing insulin with the use of this DNA.
    Type: Application
    Filed: February 12, 2008
    Publication date: June 17, 2010
    Inventors: Seiji Sato, Masa-aki Kondo, Toshiyuki Kudo, Ko-suke Endo
  • Publication number: 20080280542
    Abstract: The present invention provides a cleaning apparatus capable of removing foreign matters attached to a tip of a probe effectively without impairing the durability of the probe. The cleaning apparatus for the probe comprises a base plate having a rough surface and a surface layer formed to conform to and cover the rough surface for the purpose of providing a polishing surface for the probe and having lower hardness than hardness of the probe tip of the probe.
    Type: Application
    Filed: May 5, 2008
    Publication date: November 13, 2008
    Applicant: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Yuji Miyagi, Tetsuya Iwabuchi, Toshiyuki Kudo
  • Patent number: 7037684
    Abstract: The invention relates to a DNA that enables co-expression of a protein disulfide isomerase and a polypeptide having disulfide bonds. The invention further relates to a process of producing polypeptides using the DNA and a process of enhancing the efficiency of formation of correct disulfide bond in an expression system of a gene recombinant polypeptide having disulfide bonds.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: May 2, 2006
    Assignees: Itoham Foods Inc.
    Inventors: Shigezo Udaka, Seiji Sato, Toshiyuki Kudo, Shusaku Oka, Naohiko Higashikuni, Masaaki Kondo
  • Patent number: 6952686
    Abstract: An electronic safekeeping method, including displaying a contractual coverage of a contract at a covenantee terminal connected to a contractor server storing information of the contractual coverage; inputting contract agreement information representing whether agreeing to the contractual coverage or not, at the covenantee terminal; inputting safekeeping agreement information representing whether agreeing to a safekeeping of the contractual coverage or not, at the covenantee terminal, when the contract agreement information agreeing to the contractual coverage is inputted; requesting a contract safekeeping server to store the contractual coverage, when the safekeeping agreement information agreeing to the safekeeping is inputted; issuing a contract ID for identifying the contract at the contract safekeeping server in accordance with the request; and transferring the issued contract ID from the contract safekeeping server to the covenantee terminal and the contractor server.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: October 4, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Toshiyuki Kudo
  • Patent number: 6841361
    Abstract: This invention relates to a DNA encoding a fusion protein of formula (I) [Y]-[X1]-[B-chain]-[X2]-[Linker]-[X3]-[A-chain]??(I) wherein Y is a leader peptide sequence for the expression and secretion of the protein, comprising at least one amino acid residue; X1 is an amino acid sequence which is cleavable enzymatically or chemically; B-chain is the amino acid sequence of insulin B chain; X2 is an amino acid sequence which is cleavable enzymatically; Linker is a linker sequence comprising at least one amino acid residue; X3 is an amino acid sequence which is cleavable enzymatically; and A- chain is the amino acid sequence of insulin A chain, and to a method for producing insulin using an expression system containing the DNA in high efficiency and high yield.
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: January 11, 2005
    Assignee: Itoham Foods Inc.
    Inventors: Shusaku Oka, Seiji Sato, Naohiko Higashikuni, Masaaki Kondo, Toshiyuki Kudo, Shigeaki Watanabe, Yoshihiro Waki, Hirotaka Yuki
  • Publication number: 20040018596
    Abstract: The present invention relates to a DNA which enables co-expression of a protein disulfide isomerase and a polypeptide having disulfide bonds,
    Type: Application
    Filed: September 13, 2002
    Publication date: January 29, 2004
    Inventors: Shigezo Udaka, Seiji Sato, Toshiyuki Kudo, Shusaku Oka, Naohiko Higashikuni, Masaaki Kondo
  • Patent number: 6506595
    Abstract: This invention relates to a DNA comprising a nucleotide sequence encoding a fusion protein, wherein the fusion protein comprises: a sequence of signal peptide for Bacillus cell wall protein (CWP); a tag sequence for separation and purification of the fusion protein; a linker sequence; a sequence for chemical or enzymatic cleavage; and an exogenous polypeptide sequence, the sequences being linked in order, the signal peptide, tag and linker being optional sequences; and wherein the nucleotide sequence encoding a fusion protein is ligated to 3′-end of a nucleic acid sequence comprising a Bacillus promoter region; to a vector comprising the DNA; to a bacterium belonging to the genus Bacillus comprising the vector; and to a process for preparation of a useful polypeptide by culture of the bacterium.
    Type: Grant
    Filed: March 26, 1999
    Date of Patent: January 14, 2003
    Assignees: Itoham Foods Inc.
    Inventors: Seiji Sato, Naohiko Higashikuni, Toshiyuki Kudo, Masaaki Kondo
  • Publication number: 20010021515
    Abstract: This invention relates to a DNA comprising a nucleotide sequence encoding a fusion protein, wherein the fusion protein comprises: a sequence of signal peptide for Bacillus cell wall protein (CWP); a tag sequence for separation and purification of the fusion protein; a linker sequence; a sequence for chemical or enzymatic cleavage; and an exogenous polypeptide sequence, said sequences being linked in order, said signal peptide, tag and linker being optional sequences; and wherein said nucleotide sequence encoding a fusion protein is ligated to 3′-end of a nucleic acid sequence comprising a Bacillus promoter region; to a vector comprising the DNA; to a bacterium belonging to the genus Bacillus comprising the vector; and to a process for preparation of a useful polypeptide by culture of the bacterium.
    Type: Application
    Filed: March 26, 1999
    Publication date: September 13, 2001
    Inventors: SEIJI SATO, NAOHIKO HIGASHIKUNI, TOSHIYUKI KUDO, MASAAKI KONDO
  • Patent number: 5661011
    Abstract: The present invention provides PCR primers with which sexing of bovine embryos can be easily attained and provides a practical, rapid and reliable method for determining the sex of bovine embryos using these primers. The methods for determining the sex of the bovine embryos are characterized by discriminating PCR products which are obtained by amplifying specific DNA sequences by PCR with pairs of male-specific and gender-neutral primers. These primers are derived from DNAs which specifically hybridize to the bovine male genome and from DNAs which gender-neutrally hybridize to both bovine male and female genomes.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: August 26, 1997
    Assignee: Itoham Foods, Inc.
    Inventors: Toshiyuki Kudo, Yoshiaki Itagaki, Seiji Sato, Shizuyo Sutou, Toyoo Nakamura
  • Patent number: 5461145
    Abstract: The present invention provides PCR primers with which sexing of bovine embryos can be easily attained and provides a practical, rapid and reliable method for determining the sex of bovine embryos using these primers. The methods for determining the sex of the bovine embryos are characterized by discriminating PCR products which are obtained by amplifying specific DNA sequences by PCR with pairs of male-specific and gender-neutral primers. These primers are derived from DNAs which specifically hybridize to the bovine male genome and from DNAs which gender-neutrally hybridize to both bovine male and female genomes.
    Type: Grant
    Filed: December 2, 1992
    Date of Patent: October 24, 1995
    Assignee: Itoham Foods Inc.
    Inventors: Toshiyuki Kudo, Yoshiaki Itagaki, Seiji Sato, Shizuyo Sutou, Toyoo Nakamura