Abstract: The optical element is a long optical element obtained by detaching a long main body part connected to a runner part via a gate part including an optical part from the gate part and chipping the detached main body, the optical part including at least a first optical surface to allow light to pass there through or to reflect light. The first optical surface has a curved surface that is curved on the short direction at least at the longitudinal end, while the first edge of the first optical surface side on the end surface of gate part side in the main body part is curved according to the curved surface example of the first optical surface. The boundary surface between the main body part and the gate part is formed so as to be narrower than the end surface of the gate part side of the main body part.

Abstract: An optical element has a first surface, a second surface on the opposite side of the first surface, an optical surface, and a protruding part. The protruding part is held in a prescribed position by being in contact with a holding member. The protruding part comprises a first protruding part and a second protruding part. The first protruding part comprises a first contact part that is a convex circular arc shape on at least one longitudinal plane and partly comes into contact with the holding member. The second protruding part comprises a second contact part that is a convex circular arc shape on at least one longitudinal plane and partly comes into contact with the holding member.

Abstract: The optical element is a long optical element obtained by detaching a long main body part connected to a runner part via a gate part including an optical part from the gate part and chipping the detached main body, the optical part including at least a first optical surface to allow light to pass there through or to reflect light. The first optical surface has a curved surface that is curved on the short direction at least at the longitudinal end, while the first edge of the first optical surface side on the end surface of gate part side in the main body part is curved according to the curved surface example of the first optical surface. The boundary surface between the main body part and the gate part is formed so as to be narrower than the end surface of the gate part side of the main body part.

Abstract: An optical element has a first surface, a second surface on the opposite side of the first surface, an optical surface, and a protruding part. The protruding part is held in a prescribed position by being in contact with a holding member. The protruding part comprises a first protruding part and a second protruding part, The first protruding part comprises a first contact part that is a convex circular arc shape on at least one longitudinal plane and partly comes into contact with the holding member. The second protruding part comprises a second contact part that is a convex circular arc shape on at least one longitudinal plane and partly comes into contact with the holding member.

Abstract: There is provided a punching unit capable of punching holes in high-performance by increasing a punching force and by rotating a punch. A guide hole that guides the punch in the vertical direction is formed to have a narrow upper part, a wider lower part and inclined surfaces between them. An actuation pin engages with a cam and the punch moves up and down to punch a hole when a cam member reciprocates. The actuation pin abuts with the inclined surface of the guide hole at the punching position, so that the punch is rotated and a cam inclined angle is reduced by an inclined angle of the guide hole, allowing a large punching force.

Abstract: Disclosed is an apparatus for manufacturing a resin molded article having a hollow section inside for an optical element, by injecting a molten resin into a cavity. The apparatus has: a pressurized fluid injection device, which forms the hollow section by injecting a pressurized fluid into the molten resin injected into the cavity; and a bias device which biases a movable part in the same direction as a mold clamping direction. The movable part is moved with respect to a first mold or a second mold, in an opposite direction to the mold clamping direction against the bias force applied by the bias device, with a pressure increased in the mold by the injecting the pressurized fluid into the cavity. The moving is moved, in the same direction as the mold clamping direction, by discharge of the pressurized fluid.

Abstract: A paper cutting device, for cutting multiple sheets of paper stacked in layers on a table, comprises a paper retainer (2) descending from an upper side along a guide and a cutter (3) diagonally ascending from the lower side. A receiving part (18) is mounted on the lower surface of a paper retaining frame (20). The receiving part (18) is formed by joining a base plate (36) with a large elastic modulus such as a metal to a resin receiving plate (37). A slip prevention structure is installed on the junction surfaces of the base plate (36) and the receiving plate (37) to suppress the extension/retraction of the receiving part of the paper retainer so as to prevent wrinkles from occurring in the paper near a blade receiving surface when the paper is cut off.

Abstract: Provided is: a resin molded article for an optical element wherein high surface precision is kept since an abnormal appearance-formed portion such as a hesitation mark is effectively formed outside an optical surface without cutting off the portion and an optical surface itself can be less likely to be influenced by shrinkage with hardening such as sink; a method and device for manufacturing the same; and a scanning optical device. The resin molded article for an optical element which comprises first surface portion at a part of the surface of a resin molded base and comprises a hollow portion found by injecting a fluid into the inside of the base from the outside.

Abstract: There is provided a punching unit having a structure permitting to reduce a force required for punching, permitting to lessen parts and permitting to punch holes through a member to be perforated at arbitrary positions thereof. The punching unit has a holder that holds one or plurality of sets of punches and dies. The holder is movable in an array direction in which a plurality of holes to be perforated through the member is arrayed. An eccentric cam is disposed above the holder in parallel with the array direction. The punches within the holder are driven toward the dies by rotating the eccentric cam regardless of moving positions of the holder. Thus, the punching unit can perforate a number of holes greater than the number of punches held within the holder by sequentially moving the holder and by rotating the eccentric cam.

Abstract: To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

Abstract: The invention provides a rotary-type punching unit that solves a problem of a prior art rotary-type punching unit that its punching torque is highly peaked in beginning and ending punching, thus disabling to punch a heavy paper or the like and degrading the quality level of punch holes. A blade surface of a punch of the invention is formed as an inclined surface inclined with respect to the outer peripheral surface of a punch shaft or of a die shaft such that a leading edge thereof is higher than a trailing edge with an inclination angle within a range of 5° to 15° (preferably 10°). A die surface of the die is formed into a surface of a circular arc centering on a rotational axis of the shafts. Thereby, the peaks of the punching torque are reduced and the quality level of the punch hole is kept high.

Abstract: To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

Abstract: To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

Abstract: There is provided a punching unit capable of punching holes in high-performance by increasing a punching force and by rotating a punch while keeping the same basic structure with that of a prior art unit. A guide hole that guides the punch in the vertical direction is formed to have a narrow upper part, a wider narrow part and inclined surfaces between them. An actuation pin engages with a cam and the punch moves up and down to punch a hole when a cam member reciprocates. The actuation pin abuts with the inclined surface of the guide hole at the punching position, so that the punch is rotated and a cam inclined angle is reduced by an inclined angle of the guide hole, allowing a large punching force.

Abstract: A failure analysis apparatus 10 is composed of an inspection information acquirer 11 for acquiring a failure observed image P2 of a semiconductor device, a layout information acquirer 12 for acquiring layout information, and a failure analyzer 13 for analyzing a failure. The failure analyzer 13 extracts as a candidate interconnection for a failure, an interconnection passing an analysis region, out of a plurality of interconnections, using interconnection information to describe a configuration of interconnections in the semiconductor device by a pattern data group of interconnection patterns in respective layers, and, for extracting the candidate interconnection, it performs an equipotential trace of the interconnection patterns using the pattern data group, thereby extracting the candidate interconnection.

Abstract: To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

Abstract: There is provided a punching unit that is readily adjusted, is capable of always punching high quality holes through sheets and is steadily capable of discharging punch chips. A punch shaft and a die shaft are disposed vertically in parallel between side plates and these very punch shaft and the die shaft compose structural members (reinforcing members) of the punching unit. The die shaft has a die shaft body formed into a hollow cylinder and is provided with dies that correspond to the punches of the punch shaft at an outer peripheral surface thereof while fitting into die holes penetrating to the hollow section. A chip discharging screw plate fixed to the right side plate is disposed in the hollow section of the die shaft. Punch chips are transported along slopes of the chip discharging screw plate and discharged out of an opening when the die shaft rotates.

Abstract: A failure analysis apparatus 10 is composed of an inspection information acquirer 11 for acquiring a failure observed image P2 of a semiconductor device, a layout information acquirer 12 for acquiring layout information, and a failure analyzer 13 for analyzing a failure. The failure analyzer 13 extracts candidate nets passing at least one of analysis regions set from the failure observed image, out of a plurality of nets in the semiconductor device, and passage counts of the respective candidate nets through the analysis regions, selects a candidate net with the largest passage count as a first failure net, and selects a second failure net with attention to analysis regions where the first failure net does not pass. This substantializes a semiconductor failure analysis apparatus, failure analysis method, and failure analysis program capable of securely and efficiently performing the analysis of the failure of the semiconductor device using the failure observed image.

Abstract: A paper cutting device for cutting multiple sheets of paper stacked in layers on a table. The paper cutting device comprises a paper retainer (2) lowering from an upper side along a guide and a cutter (3) diagonally rising from the lower side. A receiving part (18) is mounted on the lower surface of a paper retaining frame (20). The receiving part (18) is formed by joining a base plate (36) with a large elastic modulus such as a metal to a resin receiving plate (37). A slip prevention means is installed on the joining surfaces of the base plate (36) and the receiving plate (37) to suppress the extension/retraction of the receiving part of the paper retainer so as to prevent wrinkles from occurring on the paper near a blade receiving surface when the paper is cut off.

Abstract: In the case where a lens unit where two ore more transparent resin lenses are combined is constituted, at least one transparent resin lens contains infrared absorbent. When the lens unit is assembled, an infrared laser is emitted to a joined portion between the transparent resin lens and the other transparent resin lens. As a result, the emitted infrared ray is absorbed by the infrared absorbent, so that the transparent resin lenses are welded to each other. An opaque lens barrel which holds the entire lens unit and the transparent resin lenses are joined by welding.