Abstract: A substrate processing system includes: a processing module including a processing chamber and a substrate support provided inside the processing chamber, the substrate support having a substrate support surface and a ring support surface for supporting a ring; a vacuum transfer module connected to the processing module and including a transfer robot for transferring the ring; a ring storage module connected to the vacuum transfer module to store the ring; a temperature adjuster provided in the ring storage module to adjust a temperature of the ring; a controller that sequentially execute: adjusting the temperature of the ring by the temperature adjuster before loading the ring into the processing module; and transferring, by the transfer robot, the ring, the temperature of which has been adjusted by the temperature adjuster, so as to place the ring on the substrate support.

Abstract: A substrate processing system includes a vacuum transfer module, a substrate processing module connected to the vacuum transfer module and including: a substrate processing chamber; a stage disposed in the substrate processing chamber; a first ring and a second ring disposed so as to surround a substrate placed on the stage; and a lifter configured to vertically move the first ring and the second ring with respect to the stage; a storage module connected to the vacuum transfer module and including a vertically movable ring storage; and a controller configured to selectively execute a simultaneous transfer mode in which the first ring and the second ring are simultaneously transferred between the substrate processing module and the storage module, and a sole transfer mode in which the second ring is solely transferred between the substrate processing module and the storage module.

Abstract: A substrate processing system includes a vacuum transfer module; a plasma process module; a transfer robot in the vacuum transfer module; a stage in the plasma process module; a first ring disposed on the stage and a second ring disposed on the first ring to surround a substrate that is placed on the stage, the second ring having an inner diameter smaller than an inner diameter of the first ring; actuators to move support pins vertically to raise the first and the second rings and a transfer jig; and a controller configured to selectively execute a simultaneous transfer mode in which the transfer robot is caused to simultaneously transfer the first ring and the second ring and a sole transfer mode in which the transfer robot is caused to transfer only the second ring.

Abstract: A storage container for accommodating an annular member having a notch on at least one of an outer circumference and an inner circumference thereof is disclosed. The storage container comprises a base plate on which the annular member is placed. The base plate comprises a plurality of guide pins that protrude from the base plate and are configured to position the annular member. The plurality of guide pins include a pin engaged with the notch.

Abstract: A mounting table includes a base and an electrostatic chuck provided on the base. The base has first and second top surface on which the electrostatic chuck and a focus ring are respectively provided. The second top surface is provided below the first top surface. A coolant path in the base has central and peripheral paths extending below the first and second top surfaces, respectively. The peripheral path has a portion extending along a side surface toward the first top surface. The mounting surface has central and peripheral regions. The mounting surface has protrusions formed in a dot shape. The protrusions are formed such that a contact area between the protrusions of the peripheral region and the backside of an object per unit area becomes greater than a contact area between the protrusions of the central region and the backside of the object per unit area.

Abstract: A substrate processing apparatus includes: a processing chamber; a support base; an electrostatic chuck; a chiller; a first channel; a second channel; a bypass channel; and a flow rate control valve. The first channel connects the chiller and a coolant entrance of the support base and the second channel connects the chiller and a coolant exit of the support base. The bypass channel branches from a midway of the first channel and is connected to a midway of the second channel. The flow rate control valve controls a flow rate of coolant flowing through the bypass channel.

Abstract: A substrate mounting table includes a mounting table main body, a mounting unit provided at an upper portion of the mounting table main body, a heat source transferring a (cold) heat to the upper portion of the mounting table main body, and a heat transfer control part. The heat transfer control part includes a cavity portion provided in the mounting table main body to correspond to the mounted substrate, and a solid member filled in the cavity portion and having pores communicating with one another. The heat transfer control part controls a heat transfer level from the heat source by supplying or exhausting a heat transfer gas to or from the cavity portion. A controller controls the supplying and the exhausting of the heat transfer gas to and from the cavity portion by a heat transfer gas supply unit and a heat transfer gas exhaust unit, respectively.