Patents by Inventor Toshiyuki MAKABE
Toshiyuki MAKABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230215753Abstract: A substrate processing system includes a vacuum transfer module; a plasma process module; a transfer robot in the vacuum transfer module; a stage in the plasma process module; a first ring disposed on the stage and a second ring disposed on the first ring to surround a substrate that is placed on the stage, the second ring having an inner diameter smaller than an inner diameter of the first ring; actuators to move support pins vertically to raise the first and the second rings and a transfer jig; and a controller configured to selectively execute a simultaneous transfer mode in which the transfer robot is caused to simultaneously transfer the first ring and the second ring and a sole transfer mode in which the transfer robot is caused to transfer only the second ring.Type: ApplicationFiled: March 13, 2023Publication date: July 6, 2023Inventors: Norihiko AMIKURA, Masatomo KITA, Toshiyuki MAKABE, Shin MATSUURA, Nobutaka SASAKI, Gyeong min PARK
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Publication number: 20220243336Abstract: A storage container for accommodating an annular member having a notch on at least one of an outer circumference and an inner circumference thereof is disclosed. The storage container comprises a base plate on which the annular member is placed. The base plate comprises a plurality of guide pins that protrude from the base plate and are configured to position the annular member. The plurality of guide pins include a pin engaged with the notch.Type: ApplicationFiled: February 1, 2022Publication date: August 4, 2022Applicant: Tokyo Electron LimitedInventors: Norihiko AMIKURA, Masatomo KITA, Toshiyuki MAKABE
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Patent number: 10714370Abstract: A mounting table includes a base and an electrostatic chuck provided on the base. The base has first and second top surface on which the electrostatic chuck and a focus ring are respectively provided. The second top surface is provided below the first top surface. A coolant path in the base has central and peripheral paths extending below the first and second top surfaces, respectively. The peripheral path has a portion extending along a side surface toward the first top surface. The mounting surface has central and peripheral regions. The mounting surface has protrusions formed in a dot shape. The protrusions are formed such that a contact area between the protrusions of the peripheral region and the backside of an object per unit area becomes greater than a contact area between the protrusions of the central region and the backside of the object per unit area.Type: GrantFiled: February 27, 2014Date of Patent: July 14, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Taketoshi Tomioka, Taku Gohira, Toshiyuki Makabe
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Patent number: 9721822Abstract: Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.Type: GrantFiled: March 6, 2015Date of Patent: August 1, 2017Assignees: Tokyo Electron Limited, Sumitomo Osaka Cement Co., Ltd.Inventors: Yasuharu Sasaki, Kenji Masuzawa, Toshiyuki Makabe, Mamoru Kosakai, Takashi Satou, Kazunori Ishimura, Ryuuji Hayahara, Hitoshi Kouno
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Patent number: 9410753Abstract: A method which changes the temperature control range of a heater of a substrate processing apparatus. The temperature control range of a heater is changed or extended by changing the flow rate of the coolant flowing through a coolant channel from a first flow rate to a second flow rate which is smaller than the first flow rate, to change a first thermal conductivity of a mounting table to a second thermal conductivity which is smaller than the first thermal conductivity. The upper limit of the temperature control range is lower than the heat resistant temperature of a material of an adhesive of the mounting table.Type: GrantFiled: February 21, 2013Date of Patent: August 9, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Toshiyuki Makabe, Taketoshi Okajo
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Publication number: 20150179492Abstract: Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.Type: ApplicationFiled: March 6, 2015Publication date: June 25, 2015Inventors: Yasuharu Sasaki, Kenji Masuzawa, Toshiyuki Makabe, Mamoru Kosakai, Takashi Satou, Kazunori Ishimura, Ryuuji Hayahara, Hitoshi Kouno
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Patent number: 8981263Abstract: Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.Type: GrantFiled: December 8, 2010Date of Patent: March 17, 2015Assignees: Tokyo Electron Limited, Sumitomo Osaka Cement Co., Ltd.Inventors: Yasuharu Sasaki, Kenji Masuzawa, Toshiyuki Makabe, Mamoru Kosakai, Takashi Satou, Kazunori Ishimura, Ryuuji Hayahara, Hitoshi Kouno
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Publication number: 20140238609Abstract: A mounting table includes a base and an electrostatic chuck provided on the base. The base has first and second top surface on which the electrostatic chuck and a focus ring are respectively provided. The second top surface is provided below the first top surface. A coolant path in the base has central and peripheral paths extending below the first and second top surfaces, respectively. The peripheral path has a portion extending along a side surface toward the first top surface. The mounting surface has central and peripheral regions. The mounting surface has protrusions formed in a dot shape. The protrusions are formed such that a contact area between the protrusions of the peripheral region and the backside of an object per unit area becomes greater than a contact area between the protrusions of the central region and the backside of the object per unit area.Type: ApplicationFiled: February 27, 2014Publication date: August 28, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Taketoshi TOMIOKA, Taku GOHIRA, Toshiyuki MAKABE
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Publication number: 20130228323Abstract: A substrate processing apparatus includes: a processing chamber; a support base; an electrostatic chuck; a chiller; a first channel; a second channel; a bypass channel; and a flow rate control valve. The first channel connects the chiller and a coolant entrance of the support base and the second channel connects the chiller and a coolant exit of the support base. The bypass channel branches from a midway of the first channel and is connected to a midway of the second channel. The flow rate control valve controls a flow rate of coolant flowing through the bypass channel.Type: ApplicationFiled: February 21, 2013Publication date: September 5, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Toshiyuki MAKABE, Taketoshi OKAJO
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Publication number: 20120281334Abstract: Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.Type: ApplicationFiled: December 8, 2010Publication date: November 8, 2012Applicants: SUMITOMO OSAKA CEMENT CO., LTD., TOKYO ELECTRON LIMITEDInventors: Yasuharu Sasaki, Kenji Masuzawa, Toshiyuki Makabe, Mamoru Kosakai, Takashi Satou, Kazunori Ishimura, Ryuuji Hayahara, Hitoshi Kouno
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Publication number: 20100122774Abstract: A substrate mounting table includes a mounting table main body, a mounting unit provided at an upper portion of the mounting table main body, a heat source transferring a (cold) heat to the upper portion of the mounting table main body, and a heat transfer control part. The heat transfer control part includes a cavity portion provided in the mounting table main body to correspond to the mounted substrate, and a solid member filled in the cavity portion and having pores communicating with one another. The heat transfer control part controls a heat transfer level from the heat source by supplying or exhausting a heat transfer gas to or from the cavity portion. A controller controls the supplying and the exhausting of the heat transfer gas to and from the cavity portion by a heat transfer gas supply unit and a heat transfer gas exhaust unit, respectively.Type: ApplicationFiled: November 5, 2009Publication date: May 20, 2010Applicant: TOKYO ELECTRON LIMITEDInventors: Toshiyuki MAKABE, Taketoshi Okajo