Abstract: A semiconductor integrated circuit device capable of suppressing variations in transistor characteristics due to the well proximity effect is provided. Standard cell rows are arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction. In the standard cell rows, positions of the N well and the P region in the vertical direction are switched every other row. Adjacent standard cell rows share the P region or the N well. A distance from a PMOS transistor located at an end of a standard cell row to an end of an N well is greater than or equal to a width of an N well shared by standard cell rows.

Abstract: A sheet material accumulating apparatus for accumulating a sheet material W into an accumulated bundle P by arranging it in a mutually overlapping state is configured to be able to suppress an enlargement, a higher tallness, more complication, etc. of the apparatus and attain a curtailment of various costs, including a manufacture cost.

Abstract: A cell according to the present invention comprises a plurality of terminals capable of transmitting an input signal or an output signal and serving as a minimum unit in designing a semiconductor integrated circuit, wherein the plurality of terminals is located on routing grids lined in a Y direction which is a direction vertical to a power-supply wiring of the cell used in automatic placement & routing and has a shape extended in an X direction which is a direction in parallel with the power-supply wiring, more specifically such a shape that, for example, a longer-side dimension of the terminal is equal to “a routing grid interval in the X direction+a wiring width. According to the constitution, a cell area is reduced, which advantageously leads to the reduction of a chip area.

Abstract: A cell according to the present invention comprises a plurality of terminals capable of transmitting an input signal or an output signal and serving as a minimum unit in designing a semiconductor integrated circuit, wherein the plurality of terminals is located on routing grids lined in a Y direction which is a direction vertical to a power-supply wiring of the cell used in automatic placement & routing and has a shape extended in an X direction which is a direction in parallel with the power-supply wiring, more specifically such a shape that, for example, a longer-side dimension of the terminal is equal to “a routing grid interval in the X direction+a wiring width. According to the constitution, a cell area is reduced, which advantageously leads to the reduction of a chip area.

Abstract: A sheet material accumulating apparatus for accumulating a sheet material W into an accumulated bundle P by arranging it in a mutually overlapping state is configured to be able to suppress an enlargement, a higher tallness, more complication, etc. of the apparatus and attain a curtailment of various costs, including a manufacture cost.

Abstract: Provided are a sheet material accumulating method and a sheet material accumulating apparatus capable of performing a proper accumulation of a sheet material that does not produce a defective in the next process even when an overlap condition of a conveyed sheet material, such as a printed sheet, varies. Provided is a sheet material accumulating method for accumulating the sheet material W continuously conveyed from the above while a part of the sheet material W is overlapped, with the sheet material standing on a lower horizontal table 7, including the steps of: detecting a backpressure F that a bundle of sheet materials applied to a holder 8 for preventing a head side collapse of a bundle of sheet materials accumulated on the table during an accumulation process; and controlling a movement of the holder in an accumulation direction so that a backpressure may maintain a predetermined magnitude.

Abstract: A semiconductor integrated circuit device capable of suppressing variations in transistor characteristics due to the well proximity effect is provided. Standard cell rows are arranged in a vertical direction, each standard cell row including standard cells arranged in a horizontal direction. In the standard cell rows, positions of the N well and the P region in the vertical direction are switched every other row. Adjacent standard cell rows share the P region or the N well. A distance from a PMOS transistor located at an end of a standard cell row to an end of an N well is greater than or equal to a width of an N well shared by standard cell rows.

Abstract: A signal is transmitted in synchronization with a clock signal that repeats H and L levels indicating a preparation period and a transmission period, respectively. A transmitting circuit includes a transmitting capacitor, an input switch for setting a voltage in accordance with an input digital signal in the transmitting capacitor at preparation period, and a transmitting switch for generating a small voltage change in the signal line at transmission period, the voltage change being in accordance with a voltage of the transmitting capacitor.

Abstract: A cell according to the present invention comprises a plurality of terminals capable of transmitting an input signal or an output signal and serving as a minimum unit in designing a semiconductor integrated circuit, wherein the plurality of terminals is located on routing grids lined in a Y direction which is a direction vertical to a power-supply wiring of the cell used in automatic placement & routing and has a shape extended in an X direction which is a direction in parallel with the power-supply wiring, more specifically such a shape that, for example, a longer-side dimension of the terminal is equal to “a routing grid interval in the X direction+a wiring width. According to the constitution, a cell area is reduced, which advantageously leads to the reduction of a chip area.

Abstract: A supplemental capacitor is formed using the large capacitance between the wirings (M11 and M12) and that between the through-holes (B11 and B12) because of downsizing of the process technique. The inter-wiring capacitor and inter-through-hole capacitor can be arranged at any optional position within the semiconductor device. The supplemental capacitor can be easily formed in the vicinity of the area where switching noise is generated, thereby effectively realizing the countermeasure for power source noise. In the process technique with advanced downsizing, a capacitor having large capacitance can be formed with a smaller area. In addition, the capacitor can be formed in the same process as the other device such as a transistor without adding any special step.

Abstract: A dummy MOSFET including a dummy gate separates nMOSFETs included in adjacent memory cells arranged in the direction in which bit lines extend. This configuration reduces a stress applied from an STI to the channel regions of the nMOSFETs. Accordingly, decrease of drive currents of the nMOSFETs is suppressed.

Abstract: A signal is transmitted in synchronization with a clock signal that repeats H and L levels indicating a preparation period and a transmission period, respectively. A transmitting circuit includes a transmitting capacitor, an input switch for setting a voltage in accordance with an input digital signal in the transmitting capacitor at preparation period, and a transmitting switch for generating a small voltage change in the signal line at transmission period, the voltage change being in accordance with a voltage of the transmitting capacitor.

Abstract: A signal is transmitted in synchronization with a clock signal that repeats H and L levels indicating a preparation period and a transmission period, respectively. A transmitting circuit includes a transmitting capacitor, an input switch for setting a voltage in accordance with an input digital signal in the transmitting capacitor at preparation period, and a transmitting switch for generating a small voltage change in the signal line at transmission period, the voltage change being in accordance with a voltage of the transmitting capacitor.

Abstract: A design technique considering a peak current is provided for high-level design of systems including LSIs. A hardware model representing the trade-off relationship between a leak current and performance is prepared in advance for functional units constituting the system. In the hardware model, the relationship between performance tpd and a source-drain leak current Pleak is described with a threshold voltage Vth as a parameter, for example. By referring to the trade-off relationship, design conditions for the functional units are determined under evaluation of the performance and power consumption of the entire system.

Abstract: A dummy MOSFET including a dummy gate separates nMOSFETs included in adjacent memory cells arranged in the direction in which bit lines extend. This configuration reduces a stress applied from an STI to the channel regions of the nMOSFETs. Accordingly, decrease of drive currents of the nMOSFETs is suppressed.

Abstract: A supplemental capacitor is formed using the large capacitance between the wirings (M11 and M12) and that between the through-holes (B11 and B12) because of downsizing of the process technique. The inter-wiring capacitor and inter-through-hole capacitor can be arranged at any optional position within the semiconductor device. The supplemental capacitor can be easily formed in the vicinity of the area-where switching noise is generated, thereby effectively realizing the countermeasure for power source noise. In the process technique with advanced downsizing, a capacitor having large capacitance can be formed with a smaller area. In addition, the capacitor can be formed in the same process as the other device such as a transistor without adding any special step.

Abstract: A design technique considering a peak current is provided for high-level design of systems including LSIs. A hardware model representing the trade-off relationship between a leak current and performance is prepared in advance for functional units constituting the system. In the hardware model, the relationship between performance tpd and a source-drain leak current Pleak is described with a threshold voltage Vth as a parameter, for example. By referring to the trade-off relationship, design conditions for the functional units are determined under evaluation of the performance and power consumption of the entire system.

Abstract: A cell library database includes function information of standard cells which are basic circuits forming a logical device, each of the standard cell comprising at least one of power supply terminal as logical terminals, the function information of the standard cell containing logical information or delay information of the power supply terminal relative to an output terminal, or function information of macro cells which are functional circuits forming a logical device, each of the macro cell comprising at least one of power supply terminals as logical terminals, the function information of the macro cell containing logical information or delay information of said power supply terminals relative to an output terminal. A design aiding system uses the cell library database to execute logical simulation, etc.

Abstract: First of all, a given logic circuit is divided into a combinational circuit portion and a register portion. The combinational circuit portion obtained by division is divided into a plurality of partial circuits having high connectivity. Each partial circuit is converted into a circuit having the transistor level. Then, a layout cell of the partial circuit having the transistor level is generated. Thereafter, arrangement and wiring are performed by using, as unit cells, a layout cell which corresponds to each register included in the register portion and the layout cell for each partial circuit in the combinational circuit so that a block layout is created. Accordingly, a layout having excellent characteristics can be created by a few kinds of cells in both circuits having the CMOS logic and the pass-transistor logic. In particular, the partial circuits having high connectivity are arranged in a cell in the circuit using the pass-transistor logic.

Abstract: First of all, a given logic circuit is divided into a combinational circuit portion and a register portion. The combinational circuit portion obtained by division is divided into a plurality of partial circuits having high connectivity. Each partial circuit is converted into a circuit having the transistor level. Then, a layout cell of the partial circuit having the transistor level is generated. Thereafter, arrangement and wiring are performed by using, as unit cells, a layout cell which corresponds to each register included in the register portion and the layout cell for each partial circuit in the combinational circuit so that a block layout is created. Accordingly, a layout having excellent characteristics can be created by a few kinds of cells in both circuits having the CMOS logic and the pass-transistor logic. In particular, the partial circuits having high connectivity are arranged in a cell in the circuit using the pass-transistor logic.