Abstract: The present invention provides a mounting device for a chip component, allowing short operating time for mounting a chip component after cutting, and capable of reliably mounting only an undamaged, non-defective chip component. The mounting device comprises carriers 10, 16 and 24, which transport a chip component 6a, peeled from a holding sheet 4 for holding cut individual chip components 6a, to a mounting substrate 20, and mount the chip component 6a thereon. The carriers 16 and 24 are provided with measuring terminals 18 and 26 for measuring electric properties of the chip component 6a during transporting. A control circuit is provided with the mounting device for controlling the carriers 16 and 24 so as to mount the chip component 6a on the mounting substrate 20 only when a measurement of the chip component 6a determined through measuring terminals 18 and 26 satisfies mountable conditions.

Abstract: A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed consists of the same material and has the same thickness as the under bump metal.

Abstract: A circuit device comprises at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed is consisted of the same material and also the same thickness as the under bump metal.

Abstract: In an electronic component having a piezo-electric resonator 10 formed on an element substrate 11 and obtaining a signal having a predetermined resonant frequency by a bulk wave propagating within a piezo-electric film 15, a mounting substrate 19 on which the piezo-electric resonator 10 is mounted by face-down bonding through N bumps 18, when a maximum diameter of said N bumps 18 is defined as D ?m, die shear strength of said N bumps 18 is not smaller than ND/6 (g), preferably, not smaller than ND/3.6 (g).

Abstract: In an electronic component having a piezo-electric resonator 10 formed on an element substrate 11 and obtaining a signal having a predetermined resonant frequency by a bulk wave propagating within a piezo-electric film 15, a mounting substrate 19 on which the piezo-electric resonator 10 is mounted by face-down bonding through N bumps 18, when a maximum diameter of said N bumps 18 is defined as D ?m, die shear strength of said N bumps 18 is not smaller than ND/6 (g), preferably, not smaller than ND/3.6 (g).

Abstract: In an electronic component having a piezo-electric resonator 10 formed on an element substrate and obtaining a signal having a predetermined resonant frequency by a bulk wave propagating through a piezo-electric film, a packaging substrate 19 on which the piezo-electric resonator 10 is mounted by face-down bonding through bumps 18, and a lid 21 fixed on the packaging substrate 19 and sealing the piezo-electric resonator 10, a distance between a surface of the piezo-electric resonator 10 facing said packaging substrate 19 and a surface of the packaging substrate 19 facing the piezo-electric resonator 10 is not larger than 100 ?m. A maximum diameter of the bump 18 is not larger than 150 ?m, when the bump 18 is connected to the packaging substrate 19. A distance between a surface of the piezo-electric resonator 10 facing the lid 21 and a surface of the lid 21 facing the piezo-electric resonator 10 is not larger than 150 ?m.

Abstract: A method for soldering an electronic component capable of accomplishing satisfactory soldering of an electronic component using paste solder even in an oven constructed into a non-closed structure which causes flowing of an ambient atmosphere. Dehumidified air is introduced through a dehumidified air inlet section into the oven to keep a dehumidified atmosphere in the oven, to thereby prevented activity of flux contained in the paste flux from being deteriorated.