Patents by Inventor Toshiyuki Narumiya

Toshiyuki Narumiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7959755
    Abstract: This invention relates to a method of manufacturing a thermal laminate by laminating a first substrate film layer and a second substrate film layer through an adhesive resin layer, which involves the steps of, integrating the adhesive resin layer with the first substrate film layer, heating the surface of the adhesive resin layer by heat rays in the presence of oxygen to induce functional groups which contribute to adhesion, and then, superimposing the second substrate film layer on the adhesive resin layer to be bonded thereto with pressure. The thermal laminate has a strong laminated strength without using a solvent, and is excellent in the safety and hygiene of foods.
    Type: Grant
    Filed: April 26, 2004
    Date of Patent: June 14, 2011
    Assignees: Nakamoto Packs Co., Ltd., Nissei Chemical Co., Ltd.
    Inventors: Toshiyuki Narumiya, Isamu Asano, Hiroshi Kasahara, Ryoji Tanaka
  • Publication number: 20040261931
    Abstract: This invention relates to a method of manufacturing a thermal laminate by laminating a first substrate film layer and a second substrate film layer through an adhesive resin layer, which comprises
    Type: Application
    Filed: April 26, 2004
    Publication date: December 30, 2004
    Inventors: Toshiyuki Narumiya, Isamu Asano, Hiroshi Kasahara, Ryoji Tanaka