Abstract: To easily design a communication path topology optimized in view of reducing the amount of equipment needed under the condition that availability against multiple failures in a network is maintained. A transmission path design apparatus (100) performs: a step (S14) of extracting, from the multiple base stations, a first group of base stations whose number of communication-path routes connected is large, based on transmission network model initial data (D0); a step (S16) of extracting a first group of communication paths connecting the base stations in the first group; a step (S16) of calculating a both-end path value (d_i,j) for each communication path in the first group; and steps (S18 to S24) of determining the communication path whose both-end path value satisfies a predetermined condition as a thinning-out target communication path, and generating output data Dy in which the thinning-out target communication path is reflected on the transmission network model initial data.

Abstract: [Problem] In an optical transmission system, a position and a cause of a failure are identified while avoiding tightness of processing on a network controller side. [Solution] An optical transmission system 1 includes a plurality of nodes 4i to 4k interconnected by an optical transmission line, a plurality of node controllers 3i to 3k that detect degradation of signal quality at the nodes 4i to 4k, respectively, and determine a degradation mode correlated with the signal quality, and a network controller 2 that identifies a node or a component in which failure has occurred based on a node for which the node controller 3i to 3k has detected degradation of the signal quality, the degradation mode, a network topology formed of the nodes, and an optical path set between the nodes.

Abstract: To easily design a communication path topology optimized in view of reducing the amount of equipment needed under the condition that availability against multiple failures in a network is maintained. A transmission path design apparatus (100) performs: a step (S14) of extracting, from the multiple base stations, a first group of base stations whose number of communication-path routes connected is large, based on transmission network model initial data (D0); a step (S16) of extracting a first group of communication paths connecting the base stations in the first group; a step (S16) of calculating a both-end path value (d_i,j) for each communication path in the first group; and steps (S18 to S24) of determining the communication path whose both-end path value satisfies a predetermined condition as a thinning-out target communication path, and generating output data Dy in which the thinning-out target communication path is reflected on the transmission network model initial data.

Abstract: An object is to provide a pavement condition rating system which utilizes a road surface image based on perspective and which is extracted from a moving image obtained by traveling while photographing a road surface of a road, makes it possible to use the whole of an image area of a road surface included in a road surface image for detection of damage, and is less susceptible to damage erroneous detection. By using a plurality of images obtained by combining image of damage included in a road surface still image based on perspective and definitions of the damage as damage learning data, an object detection model is built.

Abstract: When separate service apparatuses that provide various communication services to users are connected by a wiring with communication functional units interposed, if there is a wiring abnormality, the location of the abnormality is easily identified. When a wiring connection is completed between separated service apparatuses X and Y that provide various communication services to user terminals 31 and 32 with communication functional units A1 and B2 interposed, a wiring management system 10A includes a transmission network management apparatus 14A that identifies a wiring abnormality. The transmission network management apparatus 14A associates endpoint names of the service apparatuses X and Y and of the functional units A1 and B2 with opposite endpoint names on the opposite sides, defines opposite endpoint IDs of the endpoints of the functional units A1 and B2 as expected values, and saves the end points in association with the opposite endpoint IDs in a DB 14b.

Abstract: [PROBLEM TO BE SOLVED] To uninterruptedly change a band of an optical transmission path in a line IF section, which relays a signal transmitted to an optical transmission path in a client IF section to which a communication terminal is connected, to the same band as a changed band in the client IF section without suspending the communication in the line IF section. [SOLUTION] An optical transmission system 10A performs processing for changing a band of an optical fiber 15 in a line IF section (L section) that relays a signal from an optical fiber 12 in a client IF section (C section) to the same band as that in the C section.

Abstract: [Problem] It is possible to cancel out beat noises in a WDM signal to obtain a high-quality signal component, and a configuration thereof is achieved with low mounting costs. [Solution] An optical reception device converts a WDM signal rs(t) of an optical signal to electrical signals d(t)1 to d(t)n expressed as complex numbers of orthogonal phases, cancels out beat noises from the electrical signals, and then demodulates the signals to obtain signals D1 to Dn of a transmission source.

Abstract: [Problem] In an optical transmission system, a position and a cause of a failure are identified while avoiding tightness of processing on a network controller side. [Solution] An optical transmission system 1 includes a plurality of nodes 4i to 4k interconnected by an optical transmission line, a plurality of node controllers 3i to 3k that detect degradation of signal quality at the nodes 4i to 4k, respectively, and determine a degradation mode correlated with the signal quality, and a network controller 2 that identifies a node or a component in which failure has occurred based on a node for which the node controller 3i to 3k has detected degradation of the signal quality, the degradation mode, a network topology formed of the nodes, and an optical path set between the nodes.

Abstract: [PROBLEM TO BE SOLVED] To uninterruptedly change a band of an optical transmission path in a line IF section, which relays a signal transmitted to an optical transmission path in a client IF section to which a communication terminal is connected, to the same band as a changed band in the client IF section without suspending the communication in the line IF section. [SOLUTION] An optical transmission system 10A performs processing for changing a band of an optical fiber 15 in a line IF section (L section) that relays a signal from an optical fiber 12 in a client IF section (C section) to the same band as that in the C section.

Abstract: [Problem] It is possible to cancel out beat noises in a WDM signal to obtain a high-quality signal component, and a configuration thereof is achieved with low mounting costs. [Solution] An optical reception device converts a WDM signal rs(t) of an optical signal to electrical signals d(t)1 to d(t)n expressed as complex numbers of orthogonal phases, cancels out beat noises from the electrical signals, and then demodulates the signals to obtain signals D1 to Dn of a transmission source.

Abstract: [Problem] To improve the add/drop rates while suppressing the apparatus scale of the ROADM.

Abstract: When separate service apparatuses that provide various communication services to users are connected by a wiring with communication functional units interposed, if there is a wiring abnormality, the location of the abnormality is easily identified. When a wiring connection is completed between separated service apparatuses X and Y that provide various communication services to user terminals 31 and 32 with communication functional units A1 and B2 interposed, a wiring management system 10A includes a transmission network management apparatus 14A that identifies a wiring abnormality. The transmission network management apparatus 14A associates endpoint names of the service apparatuses X and Y and of the functional units A1 and B2 with opposite endpoint names on the opposite sides, defines opposite endpoint IDs of the endpoints of the functional units A1 and B2 as expected values, and saves the end points in association with the opposite endpoint IDs in a DB 14b.

Abstract: A semiconductor light emitting device includes first and second light emitting bodies, a first electrode, a second electrode and a first interconnection. The first and second light emitting bodies are disposed on a conductive substrate, and each includes first and second semiconductor layers and a light emitting layer therebetween. The first electrode is provided between the first light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer and the conductive substrate. The second electrode is provided between the second light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer. The first interconnection electrically connects the second semiconductor layer of the first light emitting body and the second electrode. The first interconnection includes a first portion extending over the first and second light emitting bodies and a second portion extending into the second light emitting body.

Abstract: In a switching power supply circuit of the invention, a low-voltage node capacitor is connected between a primary-side low-voltage stable potential node and a secondary-side low-voltage stable potential node, and a high-voltage node capacitor is connected between a primary-side high-voltage stable potential node and an anode of a rectifier element. Thereby, it is possible to provide the switching power supply circuit which achieves, with a simple configuration, both of noise reduction and potential stabilization of stable potential nodes.

Abstract: A semiconductor light emitting device includes first and second light emitting bodies, a first electrode, a second electrode and a first interconnection. The first and second light emitting bodies are disposed on a conductive substrate, and each includes first and second semiconductor layers and a light emitting layer therebetween. The first electrode is provided between the first light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer and the conductive substrate. The second electrode is provided between the second light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer. The first interconnection electrically connects the second semiconductor layer of the first light emitting body and the second electrode. The first interconnection includes a first portion extending over the first and second light emitting bodies and a second portion extending into the second light emitting body.

Abstract: A semiconductor light emitting device includes first and second light emitting bodies, a first electrode, a second electrode and a first interconnection. The first and second light emitting bodies are disposed on a conductive substrate, and each includes first and second semiconductor layers and a light emitting layer therebetween. The first electrode is provided between the first light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer and the conductive substrate. The second electrode is provided between the second light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer. The first interconnection electrically connects the second semiconductor layer of the first light emitting body and the second electrode. The first interconnection includes a first portion extending over the first and second light emitting bodies and a second portion extending into the second light emitting body.

Abstract: A semiconductor light emitting device includes first and second light emitting bodies, a first electrode, a second electrode and a first interconnection. The first and second light emitting bodies are disposed on a conductive substrate, and each includes first and second semiconductor layers and a light emitting layer therebetween. The first electrode is provided between the first light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer and the conductive substrate. The second electrode is provided between the second light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer. The first interconnection electrically connects the second semiconductor layer of the first light emitting body and the second electrode. The first interconnection includes a first portion extending over the first and second light emitting bodies and a second portion extending into the second light emitting body.

Abstract: In a switching power supply circuit (1A) of the invention, a low-voltage node capacitor (5) is connected between a primary-side low-voltage stable potential node (LN1) and a secondary-side low-voltage stable potential node (LN2), and a high-voltage node capacitor (4) is connected between a primary-side high-voltage stable potential node (HN1) and an anode of a rectifier element (31). Thereby, it is possible to provide the switching power supply circuit which achieves, with a simple configuration, both of noise reduction and potential stabilization of stable potential nodes.

Abstract: According to one embodiment, a semiconductor light emitting device includes a base body, first to sixth semiconductor layers, first to third conductive layers, a structure, and a first insulating layer. The first semiconductor layer and the structure are separated from the base body in a first direction. The second semiconductor layer is provided between the first semiconductor layer and the base body. The third semiconductor layer is provided between the first r and second semiconductor layers. The fourth semiconductor layer is separated from the base body in the first direction. The fifth semiconductor layer is provided between the fourth semiconductor layer and the base body. The sixth semiconductor layer is provided between the fourth and fifth semiconductor layers. The conductive layers are electrically connected with the semiconductor layers. A portion of the first insulating layer is provided between the third and fifth semiconductor layers.

Abstract: According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a light emitting portion, a first transparent conductive layer, and a second transparent conductive layer. The light emitting portion is provided between the first and second semiconductor layers. The second semiconductor layer is disposed between the first transparent conductive layer and the light emitting portion. The first transparent conductive layer includes oxygen. The second transparent conductive layer is provided between the second semiconductor layer and the first transparent conductive layer. The second transparent conductive layer has a refractive index higher than a refractive index of the first transparent conductive layer, and includes oxygen at a concentration higher than a concentration of oxygen included in the first transparent conductive layer.