Patents by Inventor Toshiyuki Okabe
Toshiyuki Okabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11810840Abstract: A semiconductor device includes a lead frame having a first principal surface which includes a recess, and a second principal surface opposite to the first principal surface, a relay board, disposed in the recess, and having a third principal surface, and a fourth principal surface opposite to the third principal surface, wherein the fourth principal surface opposes a bottom surface of the recess, a first semiconductor chip disposed on the third principal surface, a first conductive material connecting the lead frame and the relay board, and a second conductive material connecting the relay board and the first semiconductor chip. A distance between the second principal surface and the third principal surface is less than or equal to a distance between the second principal surface and the first principal surface.Type: GrantFiled: August 10, 2021Date of Patent: November 7, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Toshiyuki Okabe
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Publication number: 20220059438Abstract: A semiconductor device includes a lead frame having a first principal surface which includes a recess, and a second principal surface opposite to the first principal surface, a relay board, disposed in the recess, and having a third principal surface, and a fourth principal surface opposite to the third principal surface, wherein the fourth principal surface opposes a bottom surface of the recess, a first semiconductor chip disposed on the third principal surface, a first conductive material connecting the lead frame and the relay board, and a second conductive material connecting the relay board and the first semiconductor chip. A distance between the second principal surface and the third principal surface is less than or equal to a distance between the second principal surface and the first principal surface.Type: ApplicationFiled: August 10, 2021Publication date: February 24, 2022Inventor: Toshiyuki OKABE
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Patent number: 8928130Abstract: A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of the insulating resin layer.Type: GrantFiled: March 21, 2013Date of Patent: January 6, 2015Assignee: Shinko Electric Industries Co., Ltd.Inventors: Toshio Kobayashi, Hiroshi Shimizu, Toshiyuki Okabe, Yasuyuki Kimura, Kazutaka Kobayashi
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Patent number: 8890295Abstract: A package for mounting a light emitting element includes a housing and a flat plate-shaped electrode. The electrode is exposed from a lower surface of the housing. An upper surface of the electrode includes a mounting area on which the light emitting element is mounted. An insulator is arranged on the upper surface of the electrode. An element connector is connected to the insulator. A tubular reflective portion extends from the element connector to a height corresponding to the upper surface of the housing. A terminal is arranged on the side surface of the housing and connected to the reflective portion. A recess accommodates the light emitting element. The recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion.Type: GrantFiled: April 17, 2013Date of Patent: November 18, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Toshiyuki Okabe, Tsuyoshi Kobayashi, Toshio Kobayashi, Yasuyuki Kimura
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Patent number: 8786065Abstract: A substrate includes a first lead frame, a second lead frame, and a resin layer. The first lead frame includes a heat sink and a plurality of electrodes for external connection. The second lead frame is laminated on the first lead frame and includes a plurality of wirings for mounting light emitting elements. The resin layer is filled between the first lead frame and the second lead frame. The plurality of wirings are arranged above the heat sink. The plurality of electrodes and part of the plurality of wirings are joined with each other.Type: GrantFiled: November 2, 2012Date of Patent: July 22, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Yasuyuki Kimura, Tadashi Arai, Tsuyoshi Kobayashi, Toshiyuki Okabe
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Publication number: 20130277701Abstract: A package for mounting a light emitting element includes a housing and a flat plate-shaped electrode. The electrode is exposed from a lower surface of the housing. An upper surface of the electrode includes a mounting area on which the light emitting element is mounted. An insulator is arranged on the upper surface of the electrode. An element connector is connected to the insulator. A tubular reflective portion extends from the element connector to a height corresponding to the upper surface of the housing. A terminal is arranged on the side surface of the housing and connected to the reflective portion. A recess accommodates the light emitting element. The recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion.Type: ApplicationFiled: April 17, 2013Publication date: October 24, 2013Applicant: Shinko Electric Industries Co., Ltd.Inventors: Toshiyuki Okabe, Tsuyoshi Kobayashi, Toshio Kobayashi, Yasuyuki Kimura
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Patent number: 8377751Abstract: A semiconductor device manufacturing method prevents the occurrence of a short-circuit between leads caused by peeling-off of residual resin formed on lead side faces or lead lower portions. A laser beam is radiated a plurality of times from a main surface side of leads and also a plurality of times from a back surface side of the leads to intra-dam resin formed in a dam portion, the dam portion being enclosed with adjacent leads, a dam bar and a sealing body, thereby removing all the intra-dam resin formed on lead side faces and lead lower portions. The laser beam radiation of the intra-dam resin may leave behind a sealing body-side resin portion and a projecting resin portion which projects outwardly from the sealing body.Type: GrantFiled: February 10, 2011Date of Patent: February 19, 2013Assignee: Renesas Electronics CorporationInventors: Tomoji Amanai, Toshiyuki Okabe
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Publication number: 20110198739Abstract: A semiconductor device manufacturing method prevents the occurrence of a short-circuit between leads caused by peeling-off of residual resin formed on lead side faces or lead lower portions. A laser beam is radiated a plurality of times from a main surface side of leads and also a plurality of times from a back surface side of the leads to intra-dam resin formed in a dam portion, the dam portion being enclosed with adjacent leads, a dam bar and a sealing body, thereby removing all the intra-dam resin formed on lead side faces and lead lower portions. The laser beam radiation of the intra-dam resin may leave behind a sealing body-side resin portion and a projecting resin portion which projects outwardly from the sealing body.Type: ApplicationFiled: February 10, 2011Publication date: August 18, 2011Applicant: Renesas Electronics CorporationInventors: Tomoji Amanai, Toshiyuki Okabe
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Patent number: 5726119Abstract: A catalyst carrier assembly for an automobile exhaust gas purifying device includes a smooth metal sheet and a pre-corrugated metal sheet wound alternately in a roll having a number of honeycomb convolutions. Each corrugation of the web-like pre-corrugated metal sheet is welded to the flat metal sheet at a plurality of points in the transverse direction during forming of the cylindrical roll. After forming the cylindrical roll, the cylindrical roll is heated so as to solder the web-like flat metal sheet and the web-like pre-corrugated metal sheet to each other at both of their end portions.Type: GrantFiled: November 9, 1994Date of Patent: March 10, 1998Assignee: Mazda Motor CorporationInventors: Hisashi Sera, Shinobu Miyaura, Toshiyuki Okabe, Hiroshi Murakami