Patents by Inventor Toshiyuki Okuda

Toshiyuki Okuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090326140
    Abstract: An object is to provide a resin material having high strength and high vibration-damping property. A resin material includes a matrix resin and carbon nanocoils contained therein. The carbon nanocoils have electrical conductivity, so that the matrix resin containing them can easily convert a vibration energy generated in the resin material into heat and thereby damp the vibration energy in a short time. In addition, since the carbon nanocoil is in a coiled form, vibration-damping property can be enhanced in comparison with that of conductive materials such as carbon nanotube and graphite.
    Type: Application
    Filed: June 25, 2007
    Publication date: December 31, 2009
    Inventors: Yasuhito Shimada, Yasuo Kita, Toshikazu Nosaka, Yoshikazu Nakayama, Toshiyuki Okuda
  • Patent number: 6326113
    Abstract: Charge control agent comprising a base particle containing at least a charge control substance, and a granulating agent, said base particle being granulated using said granulating agent, and said granulating agent being at least one selected from the group consisting of anionic surfactants, nonionic surfactants, cationic surfactants, natural water-soluble high molecular compounds and synthetic water-soluble high molecular compounds; manufacturing process thereof; and toner for developing electrostatic images containing the charge control agent for the purpose of charge control, and also containing a coloring agent and a resin.
    Type: Grant
    Filed: June 15, 2000
    Date of Patent: December 4, 2001
    Assignees: Chukyo Yushi Co., Ltd., Orient Chemical Industries, Ltd.
    Inventors: Toshiyuki Okuda, Yoshitaka Taguchi, Akihiro Tada, Shun-ichiro Yamanaka
  • Patent number: 5545023
    Abstract: A pressure molding apparatus for molten resin in which an oil-pressurized cylinder internally holding an end of gate pin can freely move in compatibility with thermal elongation or contraction of a manifold pipe. In addition, a limit switch to be activated by the descending movement of this cylinder in correspondence with the descending movement of the gate pin is interlinked to a molten-resin supply source. By provision of these mechanisms, molten resin can smoothly be delivered to the interior of a molding unit without obstruction. Since substantial space is provided around this cylinder, pipes can easily be installed. Furthermore the inner later surface of the gate aperture on the side of the gate pin is provided with an obtuse angle wider than the tip angle of the gate pin, and a tapered hole having an adequate length and tapered diameter expanding itself from the gate aperture to the inner surface of the molding unit is provided.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: August 13, 1996
    Assignee: Hosokawa Seisakusho Co. Ltd.
    Inventors: Toshihiro Hosokawa, Kiyoshi Nakahara, Ryuichi Ishitsubo, Toshiyuki Okuda
  • Patent number: 5338182
    Abstract: This invention is directed to a pressure molding apparatus for molten resin in which an oil-pressurized cylinder internally holding an end of gate pin can freely move in compatibility with thermal elongation or contraction of a manifold pipe. In addition, a limit switch to be activated by the descending movement of this cylinder in correspondence with the descending movement of the gate pin is interlinked to a molten-resin supply source. By provision of these mechanisms, molten resin can smoothly be delivered to the interior of a molding unit without obstruction. Since substantial space is provided around this cylinder, pipes can easily be installed. Furthermore, the inner lateral surface of the gate aperture on the side of the gate pin is provided with an obtuse angle wider than the tip angle of the gate pin, and a tapered hole having an adequate length and tapered diameter expanding itself from the gate aperture to the inner surface of the molding unit is provided.
    Type: Grant
    Filed: March 24, 1992
    Date of Patent: August 16, 1994
    Assignee: Hosokawa Seisakusho Co., Ltd.
    Inventors: Toshihiro Hosokawa, Kiyoshi Nakahara, Ryuichi Ishitsubo, Toshiyuki Okuda
  • Patent number: 5238392
    Abstract: A pressure molding apparatus for supplying molten resin to a mold includes a gate unit having an aperture therein for passage of molten resin into a mold cavity of the mold, a gate pipe connected for communication with the gate unit, and a gate pin which is axially movable within the gate pipe. The gate pin has a gate pin end at one end and a tip at another end thereof, the tip being engageable with the aperture for controlling flow of molten resin through the gate unit. The apparatus also includes a manifold pipe for supplying molten resin to the gate pipe, a connection arrangement for connecting the gate pipe to the manifold pipe. The connection arrangement includes a receiving portion for receiving molten resin from the manifold pipe, the gate pin passing completely through the receiving portion and the gate pin end extending beyond the connection arrangement.
    Type: Grant
    Filed: March 18, 1992
    Date of Patent: August 24, 1993
    Assignee: Hosokawa Seisakushi Company, Ltd.
    Inventors: Toshihiro Hosokawa, Kiyoshi Nakahara, Ryuichi Ishitsubo, Toshiyuki Okuda
  • Patent number: 5234336
    Abstract: The invention provides a pressure molding apparatus for molten resin capable of efficiently maintaining the temperature of molten resin in the gate pipe, which is provided with molten-resin feeding gate pipes beneath the gate aperture of a molding unit composed of upper and lower molds in order that molten resin can be delivered to the interior of the molding unit before being pressed and molded, where the heater unit for maintaining the temperature of molten resin is disposed in the external periphery of the gate pipes in the state of being divided into two units in the vertical direction. Opposite portions of the gate pipe vertically being divided into two units are connected to each other so that length can optionally be adjusted to the extended or contracted direction, wherein the heater unit is discretely provided in the periphery of the gate pipes which are separately disposed.
    Type: Grant
    Filed: June 12, 1990
    Date of Patent: August 10, 1993
    Assignee: Hosokawa Seisakusho Co., Ltd.
    Inventors: Toshihiro Hosokawa, Kiyoshi Nakahara, Ryuichi Ishitsubo, Toshiyuki Okuda
  • Patent number: 4976529
    Abstract: A shape memory alloy is used for face-contacting parts (1, 3, 4, 5; 101) and lens-fixing parts (2) of a spectacle frame, and parts (12, 13; 103) connected thereto are formed of titanium, a titanium alloy, nickel, or a chromium alloy. These parts are suitable soldered by a soldering material (111) formed of 5-15 wt. % of palladium, 5-15 wt. % of gallium, and a balance consisting of silver.
    Type: Grant
    Filed: April 13, 1989
    Date of Patent: December 11, 1990
    Assignee: Sigma Co., Ltd.
    Inventors: Kazuo Segoshi, Toshiyuki Okuda, Kenji Okamura, Mizuo Yoshida
  • Patent number: 4953966
    Abstract: A spectacle frame comprises a face-contacting portion such as a side and a lens-fixing portion such as a rim, both the portions being made of a shape memory alloy, and connecting members to be connected with the face-contacting portion and the lens-fixing portion. The connecting member is made of a titanium alloy, preferably .beta.-phase. The face-contacting portion and the lens-fixing portion are soldered to the connecting member with a palladium-based soldering material.
    Type: Grant
    Filed: January 6, 1989
    Date of Patent: September 4, 1990
    Assignee: Sigma Co., Ltd.
    Inventors: Kazuo Segoshi, Toshiyuki Okuda, Kenji Okamura, Mizuo Yoshida