Patents by Inventor Toshiyuki Shimizu
Toshiyuki Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240131832Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of metal components is 30 atomic % or more and 40 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of metal components is a proportion of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).Type: ApplicationFiled: February 8, 2022Publication date: April 25, 2024Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Hiroto IIDA, Makoto HOSOKAWA, Misato MIZOGUCHI, Shinya HIRAOKA, Toshiyuki SHIMIZU
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Publication number: 20240123722Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of nitrogen is 3.0 atomic % or more and 20.0 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of nitrogen is a proportion of N in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).Type: ApplicationFiled: February 8, 2022Publication date: April 18, 2024Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Makoto HOSOKAWA, Toshiyuki SHIMIZU
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Publication number: 20240123707Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between a copper foil and a resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having a treated surface having a developed interfacial area ratio Sdr of 0.50% or more and 9.00% or less and a root mean square height Sq of 0.010 ?m or more and 0.200 ?m or less on at least one side, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The Sdr and Sq are values measured in accordance with ISO 25178 under conditions in which a cutoff wavelength of an S-filter is 0.55 ?m, and a cutoff wavelength of an L-filter is 10 ?m.Type: ApplicationFiled: February 8, 2022Publication date: April 18, 2024Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Hiroto IIDA, Makoto HOSOKAWA, Misato MIZOGUCHI, Shinya HIRAOKA, Toshiyuki SHIMIZU
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Patent number: 11863851Abstract: An imaging unit includes: a semiconductor package including an imaging device and having a back surface on which a sensor electrode is formed; a circuit substrate including a connection electrode that is connected to the sensor electrode via a bump; a surrounding part configured to cover the semiconductor package and the circuit substrate; a filler with which a space that is enclosed by the surrounding part is filled to seal a circumference of the semiconductor package and the circuit substrate; and a first cover configured to prevent the filler from infiltrating a joint between the semiconductor package and the circuit substrate.Type: GrantFiled: August 14, 2020Date of Patent: January 2, 2024Assignee: OLYMPUS CORPORATIONInventor: Toshiyuki Shimizu
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Publication number: 20230385748Abstract: A service provider server is configured to receive from a terminal of an orderer order information concerning a product provided by a store, and a type of optional processing applied to the product; determine a deliverer who has a device capable of executing the optional processing, and delivers the product from the store to a delivery destination designated by the orderer; and send to a terminal of the deliverer or the device set information for the device to execute the optional processing applied to the product in a delivery way from the store to the delivery destination.Type: ApplicationFiled: August 3, 2023Publication date: November 30, 2023Applicant: Panasonic Intellectual Property Corporation of AmericaInventors: Toshiyuki SHIMIZU, Naomi TOMIYAMA, Megumi MIZOGUCHI, Kenta MURAKAMI, Yuki TAKAOKA
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Publication number: 20230341831Abstract: An appliance control method includes: acquiring a user action of a user; predicting a plurality of action information items about future user actions of the user based on the user action, the plurality of action information items including a plurality of actions and predicted times at which the plurality of actions are predicted to be performed; determining appliance control operations corresponding to the plurality of actions based on the plurality of actions and the predicted times; and performing the appliance control operations based on the predicted times.Type: ApplicationFiled: June 29, 2023Publication date: October 26, 2023Inventors: Ryota FUJIMURA, Shigehiro IIDA, Toshiyuki SHIMIZU, Nobuhiko WAKAI, Yumiko SHINOHARA
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Publication number: 20230212306Abstract: The present invention provides a pharmaceutical composition comprising an antibody which binds specifically to human TLR7 or monkey TLR7 and does not bind to mouse TLR7 or rat TLR7, and has an activity of inhibiting a function of human TLR7 or monkey TLR7, and the like.Type: ApplicationFiled: December 27, 2022Publication date: July 6, 2023Applicants: Daiichi Sankyo Company, Limited, The University of TokyoInventors: Kensuke Miyake, Yusuke Murakami, Yuji Motoi, Atsuo Kanno, Toshiyuki Shimizu, Umeharu Ohto, Takaichi Shimozato, Atsushi Manno, Takashi Kagari, Jun Ishiguro, Kensuke Nakamura, Takashi Isobe
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Patent number: 11578138Abstract: The present invention provides a pharmaceutical composition comprising an antibody which binds specifically to human TLR7 or monkey TLR7 and does not bind to mouse TLR7 or rat TLR7, and has an activity of inhibiting a function of human TLR7 or monkey TLR7, and the like.Type: GrantFiled: July 2, 2021Date of Patent: February 14, 2023Assignees: Daiichi Sankyo Company, Limited, The University of TokyoInventors: Kensuke Miyake, Yusuke Murakami, Yuji Motoi, Atsuo Kanno, Toshiyuki Shimizu, Umeharu Ohto, Takaichi Shimozato, Atsushi Manno, Takashi Kagari, Jun Ishiguro, Kensuke Nakamura, Takashi Isobe
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Publication number: 20220403124Abstract: The invention provides a biaxially oriented polyester film having excellent impact strength and heat resistance and a method for producing same. The method comprises (A) melt-extruding a composition comprising polyester resin for which Tc?(Tg+Tm)/2 is 25?30° C. to obtain unstretched polyester resin composition sheet, which (B) is heated at Tg+5 (° C.) to Tg+40 (° C.) of the polyester resin and stretched in the machine direction at 2×-6× to obtain uniaxially oriented polyester resin composition film, which (C) is heated at Tc?46 (° C.) to Tc+25 (° C.) of the polyester resin and stretched in the transverse direction at 4×?8× to obtain biaxially oriented polyester resin composition film, which (D) undergoes relaxation at 3%-20% in the transverse direction as heated at Tm?40 (° C.) to Tm?5 (° C.) of the polyester resin.Type: ApplicationFiled: December 16, 2020Publication date: December 22, 2022Applicant: TOYOBO CO., LTD.Inventors: Toshiyuki SHIMIZU, Shota HAYAKAWA, Kenta KAWAGUCHI, Shinya HIGASHIURA
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Patent number: 11511473Abstract: It is provided that a method for producing a biaxially oriented polyester film that can be used for industrial and packaging applications. A method for producing a biaxially oriented polyester film, comprising: a step of feeding a polyester resin into an extruder, a step of extruding the molten polyester resin from an extruder to obtain a molten resin sheet at 250 to 310° C., a step of attaching the molten resin sheet closely to a cooling roll by an electrostatic application method to obtain an unstretched sheet, and a step of biaxially stretching the unstretched sheet, wherein the polyester resin fulfills the following (A) to (C): (A) the polyester resin comprises a polyethylene furandicarboxylate resin composed of a furandicarboxylic acid and ethylene glycol; (B) an intrinsic viscosity of the polyester resin is 0.50 dL/g or more; (C) a melt specific resistance value at 250° C. of the polyester resin is 3.0×107 ?·cm or less.Type: GrantFiled: February 28, 2018Date of Patent: November 29, 2022Assignees: TOYOBO CO., LTD., FURANIX TECHNOLOGIES B.V.Inventors: Shota Hayakawa, Yukihiro Numata, Katsuya Ito, Jun Inagaki, Toshiyuki Shimizu, Shoichi Gyobu, Chikao Morishige, Jesper Gabriel Van Berkel
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Publication number: 20210332149Abstract: The present invention provides a pharmaceutical composition comprising an antibody which binds specifically to human TLR7 or monkey TLR7 and does not bind to mouse TLR7 or rat TLR7, and has an activity of inhibiting a function of human TLR7 or monkey TLR7, and the like.Type: ApplicationFiled: July 2, 2021Publication date: October 28, 2021Applicants: Daiichi Sankyo Company, Limited, The University of TokyoInventors: Kensuke Miyake, Yusuke Murakami, Yuji Motoi, Atsuo Kanno, Toshiyuki Shimizu, Umeharu Ohto, Takaichi Shimozato, Atsushi Manno, Takashi Kagari, Jun Ishiguro, Kensuke Nakamura, Takashi Isobe
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Publication number: 20210320307Abstract: A lithium primary cell includes an electrode group and a non-aqueous electrolytic solution. The electrode group includes a positive electrode, a negative electrode, and a separator, in which the positive electrode and the negative electrode are wound with the separator interposed therebetween. In the electrode group, an area where the positive electrode and the negative electrode face each other is 250 cm2 or more and 350 cm2 or less. The positive electrode includes a positive electrode mixture including manganese dioxide and a boron compound. The negative electrode includes lithium metal or a lithium alloy. The non-aqueous electrolytic solution includes ethylene carbonate. A content of the boron compound in the positive electrode is 0.5 parts by mass or more and 2 parts by mass or less in terms of boron with respect to 100 parts by mass of the positive electrode mixture.Type: ApplicationFiled: April 2, 2019Publication date: October 14, 2021Inventors: KEIKO KOSUGE, FUMIO KATO, TOSHIYUKI SHIMIZU, YUSUKE KAWAHARA
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Patent number: 11091560Abstract: The present invention provides a pharmaceutical composition comprising an antibody which binds specifically to human TLR7 or monkey TLR7 and does not bind to mouse TLR7 or rat TLR7, and has an activity of inhibiting a function of human TLR7 or monkey TLR7, and the like.Type: GrantFiled: October 13, 2020Date of Patent: August 17, 2021Assignees: Daiichi Sankyo Company, Limited, The University of TokyoInventors: Kensuke Miyake, Yusuke Murakami, Yuji Motoi, Atsuo Kanno, Toshiyuki Shimizu, Umeharu Ohto, Takaichi Shimozato, Atsushi Manno, Takashi Kagari, Jun Ishiguro, Kensuke Nakamura, Takashi Isobe
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Patent number: 11074947Abstract: A semiconductor memory apparatus includes a plurality of memory dies and a logic die, which are stacked to each other. The logic die includes a memory interface for a memory apparatus to be coupled to the semiconductor memory apparatus, and a switch coupled to a plurality of channels included in a control device which controls the semiconductor memory apparatus. The switch includes a first switch element which couples one of the plurality of channels to the memory interface or one of the plurality of memory dies, and a second switch element which couples another one of the plurality of channels to another one of the plurality of memory dies. Even if some memory dies are defective, the semiconductor memory apparatus is capable to operate.Type: GrantFiled: April 1, 2020Date of Patent: July 27, 2021Assignee: FUJITSU LIMITEDInventors: Yuichiro Ajima, Toshiyuki Shimizu
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Publication number: 20210199667Abstract: An object of the present invention is to provide a technique for detecting human TLR7. Human TLR7 in a sample can be detected through an ELISA method or the like using an anti-human TLR7 antibody. The present invention enables use of human TLR7 as a marker indicating the pathological condition of an autoimmune disease.Type: ApplicationFiled: May 30, 2019Publication date: July 1, 2021Applicant: THE UNIVERSITY OF TOKYOInventors: Kensuke MIYAKE, Yusuke MURAKAMI, Yuji MOTOI, Toshiyuki SHIMIZU, Umeharu OHTO
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Patent number: 10946523Abstract: A failure diagnostic device includes a torque detector that detects disturbance torques applied to joint shafts included in a multi-axis robot, a torque grouping circuit that groups the disturbance torques according to a content of an operation executed by the multi-axis robot upon detection of each disturbance torque, a torque correction circuit that obtains a corrected disturbance torque standardized between a plurality of operations with different contents based on a representative value preliminarily set for each grouped disturbance torque and the disturbance torque detected by the torque detector, and a failure diagnostic circuit that performs a failure diagnosis on the multi-axis robot by comparing the corrected disturbance torque with a threshold.Type: GrantFiled: May 20, 2015Date of Patent: March 16, 2021Assignee: Nissan Motor Co., Ltd.Inventor: Toshiyuki Shimizu
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Publication number: 20210040225Abstract: The present invention provides a pharmaceutical composition comprising an antibody which binds specifically to human TLR7 or monkey TLR7 and does not bind to mouse TLR7 or rat TLR7, and has an activity of inhibiting a function of human TLR7 or monkey TLR7, and the like.Type: ApplicationFiled: October 13, 2020Publication date: February 11, 2021Applicants: Daiichi Sankyo Company, Limited, The University of TokyoInventors: Kensuke Miyake, Yusuke Murakami, Yuji Motoi, Atsuo Kanno, Toshiyuki Shimizu, Umeharu Ohto, Takaichi Shimozato, Atsushi Manno, Takashi Kagari, Jun Ishiguro, Kensuke Nakamura, Takashi Isobe
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Publication number: 20210016484Abstract: It is provided that a method for producing a biaxially oriented polyester film that can be used for industrial and packaging applications. A method for producing a biaxially oriented polyester film, comprising: a step of feeding a polyester resin into an extruder, a step of extruding the molten polyester resin from an extruder to obtain a molten resin sheet at 250 to 310° C., a step of attaching the molten resin sheet closely to a cooling roll by an electrostatic application method to obtain an unstretched sheet, and a step of biaxially stretching the unstretched sheet, wherein the polyester resin fulfills the following (A) to (C): (A) the polyester resin comprises a polyethylene furandicarboxylate resin composed of a furandicarboxylic acid and ethylene glycol; (B) an intrinsic viscosity of the polyester resin is 0.50 dL/g or more; (C) a melt specific resistance value at 250° C. of the polyester resin is 3.0×107 ?·cm or less.Type: ApplicationFiled: February 28, 2018Publication date: January 21, 2021Applicants: TOYOBO CO., LTD., FURANIX TECHNOLOGIES B.V.Inventors: Shota HAYAKAWA, Yukihiro NUMATA, Katsuya ITO, Jun INAGAKI, Toshiyuki SHIMIZU, Shoichi GYOBU, Chikao MORISHIGE, Jesper Gabriel VAN BERKEL
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Publication number: 20200367734Abstract: An imaging unit includes: a semiconductor package including an imaging device and having a back surface on which a sensor electrode is formed; a circuit substrate including a connection electrode that is connected to the sensor electrode via a bump; a surrounding part configured to cover the semiconductor package and the circuit substrate; a filler with which a space that is enclosed by the surrounding part is filled to seal a circumference of the semiconductor package and the circuit substrate; and a first cover configured to prevent the filler from infiltrating a joint between the semiconductor package and the circuit substrate.Type: ApplicationFiled: August 14, 2020Publication date: November 26, 2020Applicant: OLYMPUS CORPORATIONInventor: Toshiyuki SHIMIZU
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Publication number: 20200335143Abstract: A semiconductor memory apparatus includes a plurality of memory dies and a logic die, which are stacked to each other. The logic die includes a memory interface for a memory apparatus to be coupled to the semiconductor memory apparatus, and a switch coupled to a plurality of channels included in a control device which controls the semiconductor memory apparatus. The switch includes a first switch element which couples one of the plurality of channels to the memory interface or one of the plurality of memory dies, and a second switch element which couples another one of the plurality of channels to another one of the plurality of memory dies. Even if some memory dies are defective, the semiconductor memory apparatus is capable to operate.Type: ApplicationFiled: April 1, 2020Publication date: October 22, 2020Applicant: FUJITSU LIMITEDInventors: Yuichiro Ajima, Toshiyuki SHIMIZU