Abstract: A power conversion unit includes a plurality of arms each having a plurality of converter cells connected to each other in cascade. A converter control unit that controls the power conversion unit includes a voltage command value computing unit to compute an output voltage command value for each arm, and a gate signal generating unit to generate an on/off control signal of each switching element of each converter cell in accordance with the output voltage command value. A voltage command value computing unit is configured to generate the output voltage command value with compensation for an AC vibration component, extracted for each arm, of stored energy of power storage elements of a plurality of converter cells included in the arm.

Abstract: A control power source apparatus 100 includes: a power source board 2 accommodated in an electric component box 1 made of an incombustible material; a first power source unit PS1 provided at the power source board 2 and configured to supply electric power having an upper limit of a predetermined value; a second power source unit PS2 provided at the power source board 2 and configured to supply electric power having an upper limit of a predetermined value; a first load circuit L1 provided outside the electric component box 1 and configured to be supplied with electric power from the first power source unit PS1; and a second load circuit L2 provided outside the electric component box 1 so as to be electrically independent from the first load circuit L1, and configured to be supplied with electric power from the second power source unit PS2.

Abstract: A cartridge-based computing system includes a display stand that connects to a compute module cartridge including a first securing member, a second securing member, and a release member coupled to the second securing member. The display stand defines a securing aperture that engages the first securing member when the compute module cartridge is connected to the display stand, which causes the first securing member to engage a securing element on the display stand and move it into engagement with the second securing member to connect the compute module cartridge to the display stand. The securing element may then be engaged by the release member to move it out of engagement with the second securing member, and into engagement with the first securing member to cause the securing aperture to disengage the first securing member and disconnect the compute module cartridge from the display stand.

Abstract: A manufacturing method of a wafer includes a first and a second resin-application grinding step, and a third surface-grinding step. The first step includes: a first formation step of forming a first coating layer; a first surface-grinding step of placing the wafer so that the first coating layer contacts a reference surface of a table and surface-grinding a first surface of the wafer; and a first removal step of removing the first coating layer. The second step includes: a second formation step of forming a second coating layer; a second surface-grinding step of placing the wafer so that the second coating layer contacts the reference surface and surface-grinding the second surface; and a second removal step of removing the second coating layer. In the third step, the wafer is placed so that the last surface-ground surface contacts the reference surface and a surface opposite the contacted surface is surface-ground.

Abstract: The present invention provides a resin composition with high thermal conductivity, high insulating property, high heat resistance, and excellent handleability of a sheet; a cured product sheet; a composite molded body; and a semiconductor device. The resin composition contains an inorganic filler and a thermosetting resin, in which the amount of the inorganic filler in solid contents of the resin composition is 50% by volume or more, and the inorganic filler contains 82% by volume or more of a boron nitride filler (A), the boron nitride filler includes an aggregated filler, the thermosetting resin contains an epoxy resin having a mass-average molecular weight of 5,000 or more, a weight per epoxide equivalent (WPE) of resin components in the resin composition satisfies 100?WPE?300, and a storage modulus E? of a cured product of the resin composition satisfies 1?(E? at 270° C.)/(E? at 30° C.)?0.2.

Abstract: According to an embodiment, the information processing apparatus includes a communication interface and a processor. The processor acquires a plurality of orders from a host management apparatus through the communication interface; extracts, through the communication interface, a specific order from the plurality of orders based on label information indicating the specific order acquired from a first work station; and transmits, through the communication interface to an automated guided vehicle, a control signal for transporting one of racks that stores an article indicated by the extracted specific order to the first work station and a control signal for transporting another one of the racks that stores an article indicated by a normal order other than the specific order to one of the work stations other than the first work station.

Abstract: A tool selection unit has an analysis unit and a selection unit. The analysis unit determines a pick feed direction and the feed direction of a tool on the basis of information relating to the shape of a machining region including a double curved surface or a machining surface in the machining region, and creates parameter information in which at least a value relating to the smallest curvature radius in the machining surface and a value relating to the largest curvature radius in the pick feed direction are recorded. The selection unit selects a tool to use for machining the machining region on the basis of the parameter information, from among a plurality of tools having a bottom cutting edge and a side cutting edge formed in a curved-surface shape having a curvature radius different from a curvature radius of a curved surface of the bottom cutting edge.

Abstract: A heat dissipation sheet 10 includes cohesive inorganic filler particles 1 having a breaking strength of 20 MPa or lower and a modulus of elasticity of 48 MPa or higher and a matrix resin 2.

Abstract: Provided is an apparatus for detecting a failure in holding a tool of a machine tool that includes, in each of a plurality of tool holding mechanisms in a tool magazine, a locking member provided to have different self-displacement positions for a case where a tool is held at a proper held position between tool gripping portions of a pair of holding arms and a case where the tool is held with deviation from the proper held position, and that detects a holding failure state of the tool in the tool holding mechanism by detecting the position of a detection target portion that moves integrally with the locking member with a predetermined detector provided in the machine tool. The apparatus makes it possible to effectively prevent a risk of a breakdown of and damage to the machine tool.

Abstract: A cartridge-based computing system includes a display stand that connects to a compute module cartridge including a first securing member, a second securing member, and a release member coupled to the second securing member. The display stand defines a securing aperture that engages the first securing member when the compute module cartridge is connected to the display stand, which causes the first securing member to engage a securing element on the display stand and move it into engagement with the second securing member to connect the compute module cartridge to the display stand. The securing element may then be engaged by the release member to move it out of engagement with the second securing member, and into engagement with the first securing member to cause the securing aperture to disengage the first securing member and disconnect the compute module cartridge from the display stand.

Abstract: Provided is a reference voltage circuit including a first MOS transistor to a sixth MOS transistor, a first resistor and a second resistor, a current source circuit, and an output terminal. Five of the transistors form a differential transconductance amplifier, and an input transistor of the differential transconductance amplifier operates in the manner of weak inversion operation.

Abstract: A manufacturing method for a prosthetic apparatus for dental purpose according to one aspect of the present invention includes: acquiring scan data of a model that is a reproduction of at least a part of an inside of an oral cavity of a patient; creating shape data of a shaped body for dental purpose on a basis of the scan data; producing a shaped body on a basis of the shape data; covering at least a part of the shaped body and at least a part of a model with film, the shaped body attached to the model; releasing air in a part covered with the film to deform the film and bring the shaped body into close contact with the model; and curing the shaped body in a state where the shaped body is in close contact with the model.

Abstract: A cartridge-based computing system includes a display stand that connects to a compute module cartridge including a first securing member, a second securing member, and a release member coupled to the second securing member. The display stand defines a securing aperture that engages the first securing member when the compute module cartridge is connected to the display stand, which causes the first securing member to engage a securing element on the display stand and move it into engagement with the second securing member to connect the compute module cartridge to the display stand. The securing element may then be engaged by the release member to move it out of engagement with the second securing member, and into engagement with the first securing member to cause the securing aperture to disengage the first securing member and disconnect the compute module cartridge from the display stand.

Abstract: Described herein is a resin composition containing an inorganic filler, a thermosetting resin, and a thermosetting catalyst. The inorganic filler contains an aggregated inorganic filler; the thermosetting resin contains an epoxy resin; and the thermosetting catalyst contains two or more kinds of thermosetting catalysts having a melting point of 100° C. or higher. Also described are a resin cured product formed of the resin composition, a composite molded product including the resin cured product and a metal, and a semiconductor device including the composite molded product.

Abstract: The parameter estimation section 106 estimates a parameter for transition probability, a parameter for inflow noise, a parameter for outflow noise, and a number of moving people based on inflow data and outflow data so as to optimize an objective function. The inflow data is aggregate data made up of an inflow number of people at each time step for each of plural observation points and the outflow data is aggregate data made up of an outflow number of people at each time step for each of the plural observation points.

Abstract: A parameter estimation section 106 is configured to perform estimation, for aggregate data in which values are associated with respective regions obtained by subdividing a space and for a Gaussian process model that expresses a plurality of aggregate data of differing partition granularity. The estimation is performed based on the Gaussian process model including a spatial scale parameter of a correlation function between regions of the aggregate data and including a noise variance parameter of the correlation function, by estimating the spatial scale parameter and the noise variance parameter so as to maximize a function expressing values of the aggregate data by area integrals of a Gaussian process.

Abstract: A working fluid for a heat cycle, contains: trifluoroethylene; and a first component consisting of at least one of substance selected from carbon dioxide, fluoromethane, trifluoroiodomethane, methane, ethane, propane, helium, neon, argon, krypton, xenon, nitrogen and ammonia.

Abstract: A control power source apparatus 100 includes: a power source board 2 accommodated in an electric component box 1 made of an incombustible material; a first power source unit PS1 provided at the power source board 2 and configured to supply electric power having an upper limit of a predetermined value; a second power source unit PS2 provided at the power source board 2 and configured to supply electric power having an upper limit of a predetermined value; a first load circuit L1 provided outside the electric component box 1 and configured to be supplied with electric power from the first power source unit PS1; and a second load circuit L2 provided outside the electric component box 1 so as to be electrically independent from the first load circuit L1, and configured to be supplied with electric power from the second power source unit PS2.