Abstract: A thermoelectric conversion device for securely fixing a junction of a thermocouple to a top plate while ensuring heat transfer between the junction and the top plate. The thermoelectric conversion device includes a substrate having a main surface, a top plate facing the main surface of the substrate, and a plurality of series-connected thermocouples. Each thermocouple has a first end including a first junction and a second end including a second junction. The first junction of each thermocouple is fixed to the main surface of the substrate and the second junction of each thermocouple is provided with a bump for attaching the second junction to the top plate in such a way that the second junction is separated from the substrate.

Abstract: A thermoelectric conversion device that eliminates differences in the distance between two adjacent junctions. The thermoelectric conversion device includes an insulative core. A thermocouple assembly is formed spirally around the insulative core contacting the circumferential surface and includes a plurality of series-connected thermocouples. Each of the thermocouples defines a single loop of the spiral and has a first metal body, which is formed in half of the loop, and a second metal body, which is formed in the remaining half of the loop from a metal differing from the first metal body. A plurality of junctions are formed between the first metal body and the second metal body of each thermocouple. The junctions are formed at 180° intervals along the spiral thermocouple assembly.

Abstract: A thermoelectric conversion device for securely fixing a junction of a thermocouple to a top plate while ensuring heat transfer between the junction and the top plate. The thermoelectric conversion device includes a substrate having a main surface, a top plate facing the main surface of the substrate, and a plurality of series-connected thermocouples. Each thermocouple has a first end including a first junction and a second end including a second junction. The first junction of each thermocouple is fixed to the main surface of the substrate and the second junction of each thermocouple is provided with a bump for attaching the second junction to the top plate in such a way that the second junction is separated from the substrate.