Abstract: Semiconductor devices and multiply-accumulate operation devices are disclosed. In one example, a semiconductor device includes synapses in which a nonvolatile variable resistance element taking a first resistance value and a second resistance value lower than the first resistance value and a fixed resistance element having a resistance value higher than the second resistance value are connected in series. An output line outputs a sum of currents flowing through the plurality of synapses.

Abstract: A power fluctuation mitigation system for use in a power supply system that supplies AC power to a load includes an inverter unit including a first converter connected to an AC power supply to perform DC/AC conversion, a DC intermediate condenser, and an inverter connected to the first converter through the DC intermediate condenser to perform DC/AC conversion, and a power fluctuation mitigating device including a second converter connected to the AC power supply to perform AC/DC conversion, a capacitive storage device configured to be charged by an output of the second converter, and a charging unit to charge the DC intermediate condenser with power stored in the capacitive storage device, wherein the charging unit supplies power from the capacitive storage device to the DC intermediate condenser upon occurrence of fluctuation in an output of the inverter unit occurring in response to fluctuation in the load.

Abstract: A power fluctuation mitigation system includes a first converter coupled to an AC power supply to perform AC-to-DC conversion, an inverter coupled to the first converter via a DC intermediate condenser to perform DC-to-AC conversion to supply power to an AC load, a second converter coupled to the AC power supply to perform AC-to-DC conversion, an electric storage device configured to be charged by a DC output power of the second converter, and a DC/DC converter coupled between the DC intermediate condenser and the electric storage device to perform DC power conversion, wherein a DC power obtained by activating the DC/DC converter is supplied to the DC intermediate condenser as a compensating power upon a change in an output of the inverter occurring due to fluctuation of the AC load.

Abstract: A power fluctuation mitigation system for use in a power supply system that supplies AC power to a load includes an inverter unit including a first converter connected to an AC power supply to perform DC/AC conversion, a DC intermediate condenser, and an inverter connected to the first converter through the DC intermediate condenser to perform DC/AC conversion, and a power fluctuation mitigating device including a second converter connected to the AC power supply to perform AC/DC conversion, a capacitive storage device configured to be charged by an output of the second converter, and a charging unit to charge the DC intermediate condenser with power stored in the capacitive storage device, wherein the charging unit supplies power from the capacitive storage device to the DC intermediate condenser upon occurrence of fluctuation in an output of the inverter unit occurring in response to fluctuation in the load.

Abstract: [Problem] To provide a method that can determine a thermal property of a substrate in a short time and a method that can determine a thermal process condition of an open-loop step. [Solving Means] In accordance with the substrate thermal property determining method of the present invention in a rapid thermal processing apparatus 1 comprising lamps 9 for heating a wafer W and temperature sensors T1 to T7 arranged so as to oppose the lamps 9, temperature data sequentially outputted from the temperature sensors T1 to T7 is obtained, while subjecting the wafer W arranged between the lamps 9 and temperature sensors T1 to T7 to pulsed heating with the lamps 9. Thereafter, the thermal property of the wafer W is determined by using the temperature data.

Abstract: [Problem] To provide a method that can determine a thermal property of a substrate in a short time and a method that can determine a thermal process condition of an open-loop step. [Solving Means] In accordance with the substrate thermal property determining method of the present invention in a rapid thermal processing apparatus 1 comprising lamps 9 for heating a wafer W and temperature sensors T1 to T7 arranged so as to oppose the lamps 9, temperature data sequentially outputted from the temperature sensors T1 to T7 is obtained, while subjecting the wafer W arranged between the lamps 9 and temperature sensors T1 to T7 to pulsed heating with the lamps 9. Thereafter, the thermal property of the wafer W is determined by using the temperature data.

Abstract: In a cleaning device for a vehicle lamp for jetting a cleaning liquid to a front surface of a vehicle lamp by a piston and a cylinder, the piston is urged in the direction in which it is retracted into the cylinder by a tensile spring arranged between the piston and the cylinder and passing through the inside of the piston.

Abstract: A process for the abatement of a ClF.sub.x containing gas such as exhaust gases from a reactor wherein at least one step of the manufacture of integrated circuit is carried out, wherein the ClF.sub.x containing gas is passed through a bed of adsorbent comprising sodalime having a moisture content of less than 3% by weight, to substantially remove all of the ClF.sub.x compound from the ClF.sub.x containing gas with substantially no generation of byproducts.

Abstract: A process for reducing corrosion in a gas distribution network of ultra high purity gas or any part of said distribution network, including:(a) Wet cleaning the gas distribution network or at least one part thereof with a wet cleaning agent,(b) Liquid drying the gas distribution network or the at least one part thereof with an H.sub.2 O desorbing liquid drying agent selected from the group consisting of acetone dimethylacetal DMP, 2.2 dichloropropane DCP or 2.2 dibromopropane DBP, mixtures thereof and any equivalent thereof,(c) purging said gas distribution network or any part thereof with a dry high purity gas comprising less than 1 ppm of any impurity, and(d) evacuating the gas distribution network or any part thereof at a pressure which is lower than 5.times.10.sup.4 Pascal(e) exposing the gas distribution network or any part thereof to an atmosphere including an ultra high purity corrosive gas or air.

Abstract: A process for distributing ultra high purity gases with minimized contamination and particulates including; (a) purging said distribution network or any part thereof with dry inert high purity gas comprising less than 1 ppm of any impurity; (b) evacuating said distribution network or any part thereof at a pressure which is lower than 5.times.10.sup.4 Pascal; (b') optionally wet cleaning a gas distribution network or any part thereof with a wet cleaning agent, thereafter (c) liquid drying the gas distribution network or any part thereof with an H.sub.2 O desorbing liquid drying agent selected from the group including acetone dimethylacetal DMP, 2-2 dichloropropane DCP or 2-2 dibromopropane DBP, mixtures thereof and any equivalent thereof, and (d) distributing an ultra high purity gas through the distribution network or any part thereof.

Abstract: A power window device in which a drive pulley around which a wire to open and close a window is wound is disposed within a case of a power window drive section and a wire guide for guiding the wire is mounted on the case. The wire guide is composed of a first wire guide for guiding one end of the wire and a second wire guide for guiding the other end of the wire. The second wire guide is removably coupled to the first wire guide. A wire guide angle .theta..sub.0 between the wire guides can be changed merely by exchanging the second wire guide. Even when a different wire guide angle is required, the size of the component to be replaced can be reduced, as can the cost to manufacture.