Patents by Inventor Toshizaki Mochizuki

Toshizaki Mochizuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9700951
    Abstract: The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: July 11, 2017
    Assignee: HAKKO CORPORATION
    Inventors: Kenji Matsuzaki, Hitoshi Takeuchi, Toshizaki Mochizuki
  • Publication number: 20170028497
    Abstract: The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.
    Type: Application
    Filed: December 18, 2014
    Publication date: February 2, 2017
    Applicant: Hakko Corporation
    Inventors: Kenji Matsuzaki, Hitoshi Takeuchi, Toshizaki Mochizuki