Abstract: The present invention relates to a photosensitive resin composition containing (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerization initiator, (C) a thiol group-containing compound, and (E) a photopolymerizable compound, wherein the component (A) contains at least one acid-modified vinyl group-containing epoxy resin (A1) which is obtained from a bisphenol-novolak epoxy resin (a1) having a structural unit represented by a general formula (IV) or (V), and an acid-modified vinyl group-containing epoxy resin (A2) which is obtained from an epoxy resin (a2) differing from the epoxy resin (a1).

Abstract: The present invention relates to a photosensitive resin composition containing (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerization initiator, (C) a thiol group-containing compound, and (E) a photopolymerizable compound, wherein the component (A) contains at least one acid-modified vinyl group-containing epoxy resin (A1) which is obtained from a bisphenol-novolak epoxy resin (a1) having a structural unit represented by a general formula (IV) or (V), and an acid-modified vinyl group-containing epoxy resin (A2) which is obtained from an epoxy resin (a2) differing from the epoxy resin (a1).

Abstract: The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.

Abstract: The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photosensitive resin composition, characterized in comprising: (A) a polymer having a carbon hydrocarbon double bond and carboxyl group, formed by the reaction of an acid anhydride with the reaction product of an epoxy compound having a structure wherein a glycidyloxy group is bonded to a main chain comprising an aromatic ring, an alkylene group and an oxygen atom, with an unsaturated carboxyl compound having a carbon-carbon double bond and a carboxyl group, (B) a photopolymerizable monomer, (C) a radical photopolymerization initiator, and (D) a curing agent having reactivity with the functional groups of the polymer and/or the photopolymerizable monomer. Using this photosensitive resin composition, a solder resist having excellent resolution, adhesion, PCT resistance, electrical corrosion resistance, heat resistance and thermal impact resistance can be formed.

Abstract: Disclosed are a photosensitive resin composition comprising a photosensitive resin (A), a photopolymerization initiator (B), and a flame retardant (C), in which a content of halogen atoms or antimony atoms in the flame retardant is 5% or less by weight; a photosensitive element using this; a method of manufacturing a resist pattern; a resist pattern; and a resist pattern laminated substrate.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastormer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photosensitive resin composition comprising (A) a photosensitive resin having one or more carboxyl groups, (B) a special epoxy curing agent, and (C) a photopolymerization initiator is excellent in adhesiveness, heat resistance, resistance to PCT and developability and suitable as a solder resist composition.