Patents by Inventor Tosiharu Hiji

Tosiharu Hiji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for welding copper materials
    Patent number: 4134001
    Abstract: A process for welding a pair of thick copper plates which comprises welding the pair of copper plates with respective edges placed adjacent to each other on a backing support made of carbon at the adjacent edges in an atmosphere of an inert gas by melting a filler metal with the use of a direct current arc generated between the copper plates connected to the negative pole and a positive electrode with an arc voltage V (volt) and a welding current I (ampere) satisfying the conditions:V = 37 - 45 (1)vi>q (2)i.sup.2 /.sqroot.v < f (3)wherein Q and F are respectively determined from the equations:Q = Va Ia (4)F = Ib.sup.2 /.sqroot.Va (5)wherein Ia (ampere) is the minimum current at which a penetration to the underside of the copper plate is obtained and Ib (ampere) is the minimum current at which a blow hole is formed in the weld by the decomposition of the backing support at any voltage Va (volt) within the above stated range (1).
    Type: Grant
    Filed: October 11, 1977
    Date of Patent: January 9, 1979
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Yo Takeuchi, Masaki Morikawa, Chuji Tanaka, Tosiharu Hiji