Abstract: A probe-type test handler includes a measurement module for performing electrical characteristic tests on an IC, a performance board electrically connected to the measurement module in an interchangeable manner that allows the type of the performance board to be selected according to the type of the IC to be measured, a probe card having a probe needle connected to the performance board, and a pressure mechanism that allows the tip of the linear portion of the probe needle to be pressed into contact with the lead projected out of the IC package near its IC package body. A test method using the test handler is also disclosed.