Patents by Inventor Tositeru Nonaka

Tositeru Nonaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the same
    Publication number: 20100276037
    Abstract: A high strength titanium copper alloy consists of Ti at 2.0% by mass or more to 3.5% by mass or less; the balance of copper and inevitable impurities; an average grain size of 20 ?m or less; and a 0.2% proof stress expressed by “b” of 800 N/mm2 or more. The alloy further comprises a bending radius ratio (bending radius/sheet thickness) not causing cracking as expressed by “a” by a W-bending test in a transverse direction to a rolling direction, wherein “a” and “b” satisfy a?0.
    Type: Application
    Filed: December 31, 2007
    Publication date: November 4, 2010
    Applicant: NIPPON MINING & METALS CO., LTD.
    Inventors: Michiharu Yamamoto, Tositeru Nonaka, Takahiro Umegaki
  • High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the same
    Publication number: 20020157741
    Abstract: A high strength titanium copper alloy consists of Ti at 2.0% by mass or more to 3.5% by mass or less; the balance of copper and inevitable impurities; an average grain size of 20 &mgr;m or less; and a 0.2% proof stress expressed by “b” of 800 N/mm2 or more. The alloy further comprises a bending radius ratio (bending radius/sheet thickness) not causing cracking as expressed by “a” by a W-bending test in a transverse direction to a rolling direction, wherein “a” and “b” satisfy a≦0.
    Type: Application
    Filed: February 19, 2002
    Publication date: October 31, 2002
    Applicant: Nippon Mining & Metals Co., Ltd.
    Inventors: Michiharu Yamamoto, Tositeru Nonaka, Takahiro Umegaki