Patents by Inventor Touko Shiina

Touko Shiina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170048974
    Abstract: A resin composition for a permanent insulating film is provided, by which, in particular, partial through-holes obtained by partitioning a through-hole can be easily and precisely formed as designed without a deposition of catalytic species (seed) in a plating resist portion. The present invention provides a resin composition for a permanent insulating film, including a thermosetting resin, a resin filler, and a compound containing at least one atom selected from a sulfur atom and a nitrogen atom. The present invention also provides a multilayer printed wiring board in which conductive layers having a circuit pattern and insulation layers are alternately overlaid with each other, and a through-hole enabling electric conductivity among conductive layers via a through-hole. The through-hole includes a plating resist portion provided on either of an interlaminar part between the conductive layer and the insulation layer or another interlaminar part between the insulation layers, or both.
    Type: Application
    Filed: March 19, 2015
    Publication date: February 16, 2017
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Touko SHIINA, Shoji MINEGISHI
  • Publication number: 20120168215
    Abstract: Provided is a curable resin composition which exhibits improved developability even in through holes and can suppress the generation of development residue and which can yield a cured product with excellent heat resistance and hardness. A curable resin composition which comprises a carboxyl-containing resin, a photopolymerization initiator, and barium sulfate that has been pretreated with a dispersant having an acid group and/or a dispersant having a block copolymer structure, a graft polymer structure, and/or a star polymer structure.
    Type: Application
    Filed: August 27, 2010
    Publication date: July 5, 2012
    Applicant: TAIYO HOLDINGS CO., LTD
    Inventors: Touko Shiina, Masao Arima, Shuichi Yamamoto, Masato Yoshida