Patents by Inventor Tousaku Nishiyama
Tousaku Nishiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8064213Abstract: A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component 100 includes an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces. At least one wiring 20 extends from the upper surface to the lower surface through the side surface, and an electronic component 32 is disposed within the sheet substrate.Type: GrantFiled: January 27, 2005Date of Patent: November 22, 2011Assignee: Panasonic CorporationInventors: Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama
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Patent number: 7748110Abstract: A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.Type: GrantFiled: July 18, 2007Date of Patent: July 6, 2010Assignee: Panasonic CorporationInventors: Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama, Koichi Hirano, Osamu Shibata, Takeshi Nakayama, Yoshiyuki Saito
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Publication number: 20080185178Abstract: A circuit board of the present invention, includes: an electrical insulating layer including at least one layer of electrical insulating base; and a conductive portion formed in a via hole provided in the electrical insulating base. A land for mounting only is disposed on at least one surface of the electrical insulating base that is arranged at an outermost layer. According to a method for manufacturing a circuit board of the present invention, includes the steps of: forming a via hole in an electrical insulating base; filling the via hole with a conductive paste; laminating a metal foil or a releasing sheet on the electrical insulating base, and placing a jig for pressing above and below the lamination, followed by hot-pressing so as to apply heat and pressure thereto, so as to form a conductive portion made of the conductive paste in the via hole; and forming a land for mounting only on at least one surface of the electrical insulating base that is arranged at an outermost layer.Type: ApplicationFiled: January 29, 2008Publication date: August 7, 2008Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Rikiya Okimoto, Yoji Ueda, Satoru Tomekawa, Tousaku Nishiyama, Shozo Ochi
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Patent number: 7341890Abstract: A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.Type: GrantFiled: June 28, 2006Date of Patent: March 11, 2008Assignee: Matsushita Industrial Co., Ltd.Inventors: Yukihiro Ishimaru, Tousaku Nishiyama, Yasuhiro Sugaya, Toshiyuki Asahi
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Publication number: 20080047137Abstract: A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.Type: ApplicationFiled: July 18, 2007Publication date: February 28, 2008Inventors: Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama, Koichi Hirano, Osamu Shibata, Takeshi Nakayama, Yoshiyuki Saito
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Patent number: 7258549Abstract: A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.Type: GrantFiled: February 18, 2005Date of Patent: August 21, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama, Koichi Hirano, Osamu Shibata, Takeshi Nakayama, Yoshiyuki Saito
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Publication number: 20070069393Abstract: A double-sided or multilayer wiring board having high-density wiring is obtained by embedding a spherical semiconductor element in an electrically insulating substrate which composes the wiring board, and a thin electronic device can be provided using such a wiring board. Furthermore, a flexible double-sided or multilayer wiring board which is capable of being housed in a limited space while keeping a desired form can be provided by embedding the spherical semiconductor element, and a thin electronic device can be provided using a variety of such wiring boards by imparting different types of flexibility to desired parts of such a wiring board as required.Type: ApplicationFiled: July 22, 2004Publication date: March 29, 2007Inventors: Toshiyuki Asahi, Yukihiro Ishimaru, Tousaku Nishiyama, Seiichi Nakatani, Yasuhiro Sugaya
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Patent number: 7155820Abstract: The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.Type: GrantFiled: October 27, 2003Date of Patent: January 2, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Daizo Andoh, Fumio Echigo, Tadashi Nakamura, Yasuhiro Nakatani, Yoji Ueda, Tousaku Nishiyama, Shozo Ochi
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Patent number: 7136543Abstract: A mount assembly which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly. The mount assembly (100) is obtained by connecting a photo-electro conversion device (10a), spherical semiconductor devices (12a) and (12b) and an electro-photo conversion device (10b) through electrical-connection portions (14) so that a light received by the photo-electro conversion device (10a) is amplified by the spherical semiconductor devices (12a) and (12b) and then emitted from the electro-photo conversion device (10b).Type: GrantFiled: June 30, 2004Date of Patent: November 14, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tousaku Nishiyama, Yukihiro Ishimaru, Yasuhiro Sugaya, Toshiyuki Asahi, Seiji Karashima
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Publication number: 20060244119Abstract: A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern and the second external connection terminal is connected electrically to the second wiring pattern.Type: ApplicationFiled: June 28, 2006Publication date: November 2, 2006Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Yukihiro Ishimaru, Tousaku Nishiyama, Yasuhiro Sugaya, Toshiyuki Asahi
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Patent number: 7091593Abstract: A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.Type: GrantFiled: July 9, 2004Date of Patent: August 15, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yukihiro Ishimaru, Tousaku Nishiyama, Yasuhiro Sugaya, Toshiyuki Asahi
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Patent number: 7061100Abstract: A semiconductor built-in millimeter-wave band module includes: an insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a high thermal conductivity substrate made of a dielectric material having thermal conductivity higher than the insulating substrate and laminated on one surface of the insulating substrate; a plurality of wiring patterns formed on the high thermal conductivity substrate and the insulating substrate; a semiconductor device operating at millimeter-wave band, which is arranged inside of the insulating substrate, is packaged on the high thermal conductivity substrate in a face-up manner, and is connected electrically with the wiring patterns; and a distributed constant circuit element and an active element provided on the semiconductor device. In this module, a void is provided inside of the insulating substrate and in the vicinity of a surface of the distributed constant circuit element and the active element.Type: GrantFiled: April 2, 2003Date of Patent: June 13, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideki Iwaki, Yutaka Taguchi, Tetsuyosi Ogura, Yasuhiro Sugaya, Toshiyuki Asahi, Tousaku Nishiyama, Yoshinobu Idogawa
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Publication number: 20050184381Abstract: A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.Type: ApplicationFiled: February 18, 2005Publication date: August 25, 2005Inventors: Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama, Koichi Hirano, Osamu Shibata, Takeshi Nakayama, Yoshiyuki Saito
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Publication number: 20050184372Abstract: A three-dimensional mounting structure according to the present invention includes: a first main wiring board having a first wiring pattern on its surface and an electronic component mounted on the wiring pattern; a second main wiring board disposed facing the first main wiring board and having a second wiring pattern on its surface; and a lead frame connector disposed substantially perpendicular to the first main wiring board and the second main wiring board at an end portion of the two wiring bards, wherein the lead frame connector includes a plurality of lead wires made of an electrically conductive material and a resin portion to which the plurality of lead wires are fixed, wherein an end portion of each of the plurality of lead wires is exposed from the resin portion, and wherein at least two of the plurality of lead wires are each electrically connected to both the first wiring pattern of the first main wiring board and the second wiring pattern of the second main wiring board.Type: ApplicationFiled: February 16, 2005Publication date: August 25, 2005Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiyuki Asahi, Seiichi Nakatani, Tousaku Nishiyama, Kiyoshi Nakanishi, Ken Muramatsu
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Publication number: 20050168960Abstract: A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component 100 includes an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface; and an electronic component 32 which is disposed within the sheet substrate.Type: ApplicationFiled: January 27, 2005Publication date: August 4, 2005Inventors: Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama
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Publication number: 20050124197Abstract: A circuit board of the present invention, includes: an electrical insulating layer including at least one layer of electrical insulating base; and a conductive portion formed in a via hole provided in the electrical insulating base. A land for mounting only is disposed on at least one surface of the electrical insulating base that is arranged at an outermost layer. According to a method for manufacturing a circuit board of the present invention, includes the steps of: forming a via hole in an electrical insulating base; filling the via hole with a conductive paste; laminating a metal foil or a releasing sheet on the electrical insulating base, and placing a jig for pressing above and below the lamination, followed by hot-pressing so as to apply heat and pressure thereto, so as to form a conductive portion made of the conductive paste in the via hole; and forming a land for mounting only on at least one surface of the electrical insulating base that is arranged at an outermost layer.Type: ApplicationFiled: December 3, 2004Publication date: June 9, 2005Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Rikiya Okimoto, Yoji Ueda, Satoru Tomekawa, Tousaku Nishiyama, Shozo Ochi
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Patent number: 6885788Abstract: A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.Type: GrantFiled: June 20, 2003Date of Patent: April 26, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideki Iwaki, Yutaka Taguchi, Tetsuyoshi Ogura, Yasuhiro Sugaya, Toshiyuki Asahi, Tousaku Nishiyama, Yoshinobu Idogawa
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Publication number: 20050057906Abstract: There is provided a connector sheet which includes an insulation sheet substrate having a front surface and a rear surface opposing to the front surface, and electrically conductive members each passing through the sheet substrate along a thickness direction of the sheet substrate, and the front surface and the rear surface contain a thermoset resin, and have tackiness under a first condition and develop adhesiveness under a second condition which is different from the first condition.Type: ApplicationFiled: September 10, 2004Publication date: March 17, 2005Inventors: Seiichi Nakatani, Tousaku Nishiyama
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Publication number: 20050006142Abstract: A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.Type: ApplicationFiled: July 9, 2004Publication date: January 13, 2005Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Yukihiro Ishimaru, Tousaku Nishiyama, Yasuhiro Sugaya, Toshiyuki Asahi
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Publication number: 20050002608Abstract: A mount assembly with an excellent handling property which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly is provided. The mount assembly 100 is obtained by connecting a photo-electro conversion device 10a, spherical semiconductor devices 12a and 12b and an electro-photo conversion device 10b through electrical-connection portions 14 so that a light received by the photo-electro conversion device 10a is amplified by the spherical semiconductor devices 12a and 12b and then emitted from the electro-photo conversion device 10b.Type: ApplicationFiled: June 30, 2004Publication date: January 6, 2005Inventors: Tousaku Nishiyama, Yukihiro Ishimaru, Yasuhiro Sugaya, Toshiyuki Asahi, Seiji Karashima