Patents by Inventor Touta Maitani

Touta Maitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming bump electrodes
    Patent number: 6656828
    Abstract: A CSP in which bump electrodes (2) arranged in an area on a chip (1A) and bonding pads (BP) are electrically connected to each other via Cu interconnections (6), wherein the surface of the Cu interconnection (6) is covered with a barrier layer (14) to thereby prevent diffusion of Cu from the CU interconnection (6) into a polyimide resin layer (3) by a heat treatment during the manufacturing process.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: December 2, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Touta Maitani, Shinji Nishihara