Patents by Inventor Town Zhang

Town Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STAGGERED DUAL-SIDE MULTI-CHIP INTERCONNECT
    Publication number: 20230411365
    Abstract: Layout techniques for circuits on substrates are disclosed that address the multivariate problem of minimizing routing distances for high-speed I/O pins between circuits while simultaneously providing for the rapid provision of transient power demands to the circuits. The layout techniques may also enable improved thermal management for the circuits.
    Type: Application
    Filed: September 6, 2023
    Publication date: December 21, 2023
    Applicant: NVIDIA Corp.
    Inventors: Shuo Zhang, Eric Zhu, Minto Zheng, Michael Zhai, Town Zhang, Jie Ma
  • Staggered dual-side multi-chip interconnect
    Patent number: 11798923
    Abstract: Layout techniques for chip packages on printed circuit boards are disclosed that address the multivariate problem of minimizing routing distances for high-speed I/O pins between chip packages while simultaneously providing for the rapid provision of transient power demands to the chip packages. The layout techniques may also enable improved thermal management for the chip packages.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: October 24, 2023
    Assignee: NVIDIA CORP.
    Inventors: Shuo Zhang, Eric Zhu, Minto Zheng, Michael Zhai, Town Zhang, Jie Ma
  • Staggered Dual-Side Multi-Chip Interconnect
    Publication number: 20230197696
    Abstract: Layout techniques for chip packages on printed circuit boards are disclosed that address the multivariate problem of minimizing routing distances for high-speed I/O pins between chip packages while simultaneously providing for the rapid provision of transient power demands to the chip packages. The layout techniques may also enable improved thermal management for the chip packages.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 22, 2023
    Applicant: NVIDIA Corp.
    Inventors: Shuo Zhang, Eric Zhu, Minto Zheng, Michael Zhai, Town Zhang, Jie Ma