Patents by Inventor Toyoaki Hirata

Toyoaki Hirata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10479873
    Abstract: Provided is a method of producing a polymer-impregnated base resin which is excellent in providing low adsorption of proteins and blood cells such as platelets. The method of producing a polymer-impregnated base resin includes impregnating a base resin with a polymer solution that includes a solvent able to swell the base resin.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: November 19, 2019
    Assignees: SUMITOMO RUBBER INDUSTRIES, LTD., KYUSHU UNIVERSITY, NATIONAL UNVIERSITY CORPORATION
    Inventors: Yasuhisa Minagawa, Keiji Tanaka, Hisao Matsuno, Toyoaki Hirata
  • Publication number: 20180327560
    Abstract: Provided is a method of producing a polymer-impregnated base resin which is excellent in providing low adsorption of proteins and blood cells such as platelets. The method of producing a polymer-impregnated base resin includes impregnating a base resin with a polymer solution that includes a solvent able to swell the base resin.
    Type: Application
    Filed: April 16, 2018
    Publication date: November 15, 2018
    Applicants: SUMITOMO RUBBER INDUSTRIES, LTD., KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
    Inventors: Yasuhisa MINAGAWA, Keiji TANAKA, Hisao MATSUNO, Toyoaki HIRATA
  • Publication number: 20080308417
    Abstract: A sputtering apparatus includes target holders 4a and 4b for mounting targets thereon to constitute a cathode, a substrate holder 30 for holding a substrate 8, and magnets 51a and 51b for generating magnetic fields around the surface of the targets. A voltage is applied to backing plates 42 of the target holders 4a and 4b using a direct-current power supply 6 to generate plasma. An anode is made of an electrically-conductive material that is not molten by the retained, heated plasma with a high density. The anode 9 is connected to the ground electrical potential. At least a portion of the anode 9 is placed in or near the region where plasma is retained. During sputtering, electrons discharged from the target flow to the ground potential through the heated portion of the anode 9 being heated by the plasma, thereby keeping the direct-current power supply circuit closed.
    Type: Application
    Filed: March 14, 2005
    Publication date: December 18, 2008
    Inventors: Toyoaki Hirata, Masami Nakasone
  • Patent number: 6649036
    Abstract: A mirrortron sputtering apparatus for sputtering on a substrate includes a vacuum chamber for placing therein a pair of targets spaced apart from each other with inner surfaces thereof facing each other and outer surfaces thereof positioned opposite to the inner surfaces, and magnets respectively disposed closer to the outer surfaces of the targets for forming a magnetic field between said pair of targets. The magnetic field has a magnetic field distribution with a peripheral region having a high magnetic flux density and a center region having a low magnetic flux density. In this arrangement, the substrate is set alongside a space between the pair of targets as facing said magnetic field.
    Type: Grant
    Filed: February 8, 2001
    Date of Patent: November 18, 2003
    Inventors: Toyoaki Hirata, Masahiko Naoe
  • Publication number: 20010013470
    Abstract: A mirrortron sputtering apparatus for sputtering on a substrate includes a vacuum chamber for placing therein a pair of targets spaced apart from each other with inner surfaces thereof facing each other and outer surfaces thereof positioned opposite to the inner surfaces, and magnets respectively disposed closer to the outer surfaces of the targets for forming a magnetic field between said pair of targets. The magnetic field has a magnetic field distribution with a peripheral region having a high magnetic flux density and a center region having a low magnetic flux density. In this arrangement, the substrate is set alongside a space between the pair of targets as facing said magnetic field.
    Type: Application
    Filed: February 8, 2001
    Publication date: August 16, 2001
    Inventors: Toyoaki Hirata, Masahiko Naoe