Patents by Inventor Toyoaki Orikasa

Toyoaki Orikasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper alloy having excellent hot rollability and excellent adhesion strength of plated surface thereof when heated
    Patent number: 5024814
    Abstract: A copper alloy consists essentially by weight percent of 0.5 to 3% Ni, 0.5 to 2.5% Sn, 0.05 to 0.9% Si, 0.1 to 2% Zn, 0.025 to 0.25% Fe, and the balance of Cu and inevitable impurities. The inevitable impurities include C in an amount of not more than 10 ppm. The obtained copper alloy possesses improved hot rollability and exhibits excellent adhesion strength of a plated surface thereof when heated, while having satisfactory strength and platability.
    Type: Grant
    Filed: November 17, 1989
    Date of Patent: June 18, 1991
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Rensei Futatasuka, Yutaka Koshiba, Shunich Chiba, Toyoaki Orikasa, Seiji Noguchi, Takuya Idoshita