Patents by Inventor Toyoaki Tanaka

Toyoaki Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12091536
    Abstract: A resin composition including a 4-methyl-1-pentene copolymer (A) that satisfies particular requirements and a 4-methyl-1-pentene copolymer (B) that satisfies particular requirements, in which the content of the copolymer (A) is 10 to 95 parts by mass and the content of the copolymer (B) is 90 to 5 parts by mass with respect to 100 parts by mass of the total content of the copolymers (A) and (B).
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: September 17, 2024
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hisanori Hashimoto, Masahiko Okamoto, Makoto Nakano, Toyoaki Sasaki, Masakazu Tanaka
  • Patent number: 8120040
    Abstract: A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: February 21, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Motoo Asai, Hiroaki Kodama, Toyoaki Tanaka
  • Patent number: 8076782
    Abstract: An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: December 13, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Motoo Asai, Hiroaki Kodama, Toyoaki Tanaka
  • Patent number: 7881423
    Abstract: An X-ray CT apparatus is adapted for switchover between a CT mode to obtain a tomographic image of a subject and a transmission mode to obtain a transmission image of the subject, depending upon projection data acquired in an imager system thereof. The apparatus includes an image-data storage device that stores image data of the subject in a three-dimensional region, a three-dimensional image processor that performs a three-dimensional image processing on the image data and generates three-dimensional image data, for display, corresponding to a line-of-sight direction inputted from an input device, and a transmission-image generator that generates the transmission image as to the image-taking direction, from data acquired in the imager system aligned by the CPU.
    Type: Grant
    Filed: August 28, 2006
    Date of Patent: February 1, 2011
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Medical Systems Corporation
    Inventors: Masaharu Tsuyuki, Toyoaki Tanaka
  • Publication number: 20100232744
    Abstract: A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.
    Type: Application
    Filed: May 24, 2010
    Publication date: September 16, 2010
    Applicant: IBIDEN CO., LTD.
    Inventors: Motoo ASAI, Hiroaki Kodama, Toyoaki Tanaka
  • Patent number: 7783141
    Abstract: The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: August 24, 2010
    Assignee: Ibiden Co., Ltd.
    Inventors: Hiroaki Kodama, Toyoaki Tanaka, Kazuhito Yamada
  • Publication number: 20080247703
    Abstract: The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 9, 2008
    Applicant: IBIDEN CO., LTD
    Inventors: Hiroaki KODAMA, Toyoaki Tanaka, Kazuhito Yamada
  • Patent number: 7231073
    Abstract: A medical image processing apparatus processes a medical image resulting from a medical image equipment. The apparatus comprises an interface, a processor, and a calculator. The interface is configured to obtain the medical image. The processor is configured to determine a smooth line along an embowed part of a specimen in the medical image obtained by the interface. The calculator is configured to calculate a bow scale of the embowed part based on the smooth line determined by the processor.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: June 12, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Toyoaki Tanaka
  • Publication number: 20070053478
    Abstract: An X-ray CT apparatus is adapted for switchover between a CT mode to obtain a tomographic image of a subject and a transmission mode to obtain a transmission image of the subject, depending upon projection data acquired in an imager system thereof. The apparatus includes an image-data storage device that stores image data of the subject in a three-dimensional region, a three-dimensional image processor that performs a three-dimensional image processing on the image data and generates three-dimensional image data, for display, corresponding to a line-of-sight direction inputted from an input device, and a transmission-image generator that generates the transmission image as to the image-taking direction, from data acquired in the imager system aligned by the CPU.
    Type: Application
    Filed: August 28, 2006
    Publication date: March 8, 2007
    Applicants: Kabushiki Kaisha Toshiba, TOSHIBA MEDICAL SYSTEMS CORPORATION
    Inventors: Masaharu Tsuyuki, Toyoaki Tanaka
  • Publication number: 20060012967
    Abstract: An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.
    Type: Application
    Filed: March 28, 2003
    Publication date: January 19, 2006
    Applicant: IBIDEN CO., LTD.
    Inventors: Motoo Asai, Hiroaki Kodama, Toyoaki Tanaka
  • Publication number: 20030215122
    Abstract: A medical image processing apparatus processes a medical image resulting from a medical image equipment. The apparatus comprises an interface, a processor, and a calculator. The interface is configured to obtain the medical image. The processor is configured to determine a smooth line along an embowed part of a specimen in the medical image obtained by the interface. The calculator is configured to calculate a bow scale of the embowed part based on the smooth line determined by the processor.
    Type: Application
    Filed: April 3, 2003
    Publication date: November 20, 2003
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Toyoaki Tanaka
  • Patent number: 6554976
    Abstract: A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.
    Type: Grant
    Filed: June 6, 2000
    Date of Patent: April 29, 2003
    Assignee: TDK Corporation
    Inventors: Satoshi Inoue, Toyoaki Tanaka, Yoshiro Nakagawa
  • Patent number: 6184613
    Abstract: An electrode assembly including a first cathode member provided with a hole enclosed by a frame portion. The frame portion surrounding the hole has a contact surface that comes into contact with an object to be plated at one of its surfaces, and an insulating member is provided with holes and enclosed by a frame portion, with one surface of the frame portion placed on top of another surface of the frame portion of the first cathode member. A second cathode member also provided with a hole enclosed by a frame portion, with one surface of the frame portion placed on top of one surface of the other frame portion of the insulating member. The smallest bore diameter at the hole of the second cathode member is larger than the smallest bore diameter at the holes and of the insulating member.
    Type: Grant
    Filed: September 14, 1998
    Date of Patent: February 6, 2001
    Assignee: TDK Corporation
    Inventors: Satoshi Inoue, Toyoaki Tanaka
  • Patent number: 6181057
    Abstract: An electrode assembly, including a cathode member is provided with a hole enclosed by a frame portion and a contact surface that comes into contact with an object to be plated at one surface of the frame portion. The cathode member include a conductive material such as copper plate. The cathode member is provided with a lead conductor. An insulating member is provided with holes and enclosed by frame portions, with the frame portions and placed on another surface of the frame portion of the cathode member. The frame portion of the first insulating member covers the internal circumferential edge of the cathode member over a width W1.
    Type: Grant
    Filed: September 14, 1998
    Date of Patent: January 30, 2001
    Assignee: TDK Corporation
    Inventors: Satoshi Inoue, Toyoaki Tanaka
  • Patent number: 6090260
    Abstract: A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: July 18, 2000
    Assignee: TDK Corporation
    Inventors: Satoshi Inoue, Toyoaki Tanaka, Yoshiro Nakagawa
  • Patent number: 5700381
    Abstract: After applying a metal film on a surface of a substrate, the metal film is patterned in such a manner that the surface of the substrate is exposed in a pattern that corresponds to the pattern of the required indented portion. Then, the substrate is immersed in an etchant which etches the substrate selectively to form the indented portion in the surface of the substrate using the metal film as a mask.The method makes it possible to define the depth and the pattern of an indented portion where a magnetic transducer is provided with a high degree of accuracy, to prevent a reduction in pattern accuracy due to re-adhering and to advance industrial productivity.
    Type: Grant
    Filed: September 7, 1995
    Date of Patent: December 23, 1997
    Assignee: TDK Corporation
    Inventors: Fujimi Kimura, Toyoaki Tanaka, Akihiko Dobashi, Takashi Abe
  • Patent number: 5143786
    Abstract: The present invention uses, as a base material, a multi-layer film comprising more than two layers and formed from thermoplastic resins different in melting point from one another. A sectional construction of the multi-layer film or a tape obtained from the multi-layer film is applied to a sectional construction of a fibre without modification, the multi-layer film or tape being formed into the fibre. The invention provides a composite fibre which is much more excellent as compared to a conventional heat adhesive composite fibre by melt spinning, a water-absorbing material using the composite fibre as a base material and a method for the production of the same by the stated simple means.
    Type: Grant
    Filed: May 31, 1991
    Date of Patent: September 1, 1992
    Assignee: Showa Denko Kabushiki Kaisha
    Inventors: Toyoaki Tanaka, Akira Nakamura, Yoshisuke Kamei, Akihiro Hashimoto
  • Patent number: 5071705
    Abstract: The present invention uses, as a base material, a multi-layer film comprising more than two layers and formed from thermoplastic resins different in melting point from one another. A sectional construction of the multi-layer film or a tape obtained from the multi-layer film is applied to a sectional construction of a fibre without modification, the multi-layer film or tape being formed into the fibre. The invention provides a composite fibre which is much more excellent as compared to a conventional heat adhesive composite fibre by melt spinning, a water-absorbing material using the composite fibre as a base material and a method for the production of the same by the stated simple means.
    Type: Grant
    Filed: June 29, 1987
    Date of Patent: December 10, 1991
    Assignee: Showa Denko K.K.
    Inventors: Toyoaki Tanaka, Akira Nakamura, Yoshisuke Kamei, Akihiro Hashimoto
  • Patent number: 4966809
    Abstract: Disclosed is a water-absorbing composite body comprising a tape-shaped laminate having at least one layer of a high-melting-point synthetic resin and at least one layer of a low-melting-point synthetic resin, in which at least a part of the low-melting-point synthetic resin layer is exposed to the surface, a split fiber obtained by splitting this tape-shaped laminate or a composite fibrous body having a laminate structure as described above, and a powdery polymeric water absorber fusion-bonded to the outer surface of the low-melting-point synthetic resin layer exposed to the surface. This water-absorbing composite body has a high water-absorbing capacity and retains a good mechanical strength.
    Type: Grant
    Filed: December 2, 1987
    Date of Patent: October 30, 1990
    Assignee: Showa Denko Kabushiki Kaisha
    Inventors: Toyoaki Tanaka, Katuzi Ohira, Akira Nakamura, Ryosuke Kamei, Akihiro Hashimoto
  • Patent number: 4931005
    Abstract: An apparatus for the preparation of an elastic absorbent composed of a mixed web. Elements of the apparatus can include two supply hoppers for separately supplying pulverized pulp and staple fibers of a synthetic fiber split yarn at a constant mixing ratio with each hopper having a pair of confronting moving belts, two guide mechanisms located below the hoppers, a pair of nip rollers located below the guide mechanisms, a garnet roll located below the pair of nip rollers, a vacuum device located below the garnet roll, and a mesh belt located between the vacuum device and the garnet roll. Each guide mechanism in the apparatus may include at least two gear guides arranged in series. The apparatus operates by feeding the pulverized pulp and the staple fibers of the split yarn from the hoppers to the nip rolls via the guide mechanisms. The nip rolls compress the material, which is then disintegrated and mixed by the garnet roll. The mixture is pulled onto the mesh belt by the vacuum device.
    Type: Grant
    Filed: January 31, 1989
    Date of Patent: June 5, 1990
    Assignee: Showa Denko Kabushiki Kaisha
    Inventors: Toyoaki Tanaka, Katuzi Ohira, Akira Nakamura, Ryosuke Kamei, Akihiro Hashimoto