Patents by Inventor Toyofumi Asano
Toyofumi Asano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7678433Abstract: An objective of this application is to provide a sealant for liquid crystals witch is extremely less apt to contaminate liquid crystals and has high adhesion strength. This application discloses a sealant for liquid crystals comprising as essential ingredients (a) a radiation-curable resin represented by the general formula (1): wherein R1 represents a hydrogen atom or a methyl group, R2 represents a hydrogen atom, a halogen atom, a hydroxyl group, a linear, branch or cyclic monovalent alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, m represents an integer of 1 to 4, and may be the same or different, R3 represents a hydrogen atom or a methyl group, and the number n of the repeating units is a positive number in the range of 0 to 20; (b) a photopolymerization initiator; and (c) an inorganic filler having an average particle diameter of 3 ?m or less.Type: GrantFiled: May 18, 2004Date of Patent: March 16, 2010Assignee: Nippon Kayaku Kabushiki KaishaInventors: Naoyuki Ochi, Toyofumi Asano, Masahiro Imaizumi, Masaru Kudo, Eiichi Nishihara, Hiroo Koyanagi, Sumio Ichimura, Masahiro Hirano
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Publication number: 20090188616Abstract: Disclosed is a sealing material for liquid crystals having high adhesion strength and excellent gap-forming power at bonding of panels. Also disclosed are a method for producing such a sealing material and a method for producing a liquid crystal display cell which is improved in productivity, high-speed response and reliability. The sealing material for liquid crystals is produced through a step wherein fine particles (D) having an average particle size of not more than 3 ?m are dispersed, using a wet dispersion unit (A), in a reactive resin (C) having an epoxy group and/or a (meth)acryloyl group which resin has been dissolved in a solvent (B) and a following step wherein the solvent (B) is removed.Type: ApplicationFiled: March 20, 2009Publication date: July 30, 2009Inventors: Masahiro Imaizumi, Naoyuki Ochi, Toyofumi Asano, Eiichi Nishihara, Masahiro Hirano, Takumi Kobayashi
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Publication number: 20090114272Abstract: Disclosed is a sealing agent for photoelectric converters which enables to easily bond upper and lower conductive supporting bodies during production of a photoelectric converter while forming a sealed portion having excellent adhesion strength, moisture resistance reliability, flexibility and the like. Specifically, a photocuring and thermosetting resin composition containing an epoxy resin (a), a thermosetting agent (b), an epoxy(meth)acrylate (c) and a photopolymerization initiator (d), and additionally if necessary, a filler (e), a silane coupling agent (f) and an ion capturing agent (g) is used as a sealing agent for photoelectric converters.Type: ApplicationFiled: July 7, 2006Publication date: May 7, 2009Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Teruhisa Inoue, Takayuki Hoshi, Toyofumi Asano, Kouichiro Shigaki, Masayoshi Kaneko, Teppei Tsuchida
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Patent number: 7521100Abstract: The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 ?m.Type: GrantFiled: April 6, 2004Date of Patent: April 21, 2009Assignee: Nippon Kayaku Kabushiki KaishaInventors: Masahiro Imaizumi, Toyofumi Asano, Naoyuki Ochi, Masahiro Hirano, Sumio Ichimura, Masaru Kudo, Katsuhiko Oshimi, Masataka Nakanishi, Yasumasa Akatsuka, Eiichi Nishihara, Masayuki Itai
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Patent number: 7517553Abstract: The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.Type: GrantFiled: May 11, 2004Date of Patent: April 14, 2009Assignee: Nippon Kayaku Kabushiki KaishaInventors: Makoto Uchida, Toyofumi Asano
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Publication number: 20080063816Abstract: Disclosed is a sealing material for liquid crystals having high adhesion strength and excellent gap-forming power at bonding of panels. Also disclosed are a method for producing such a sealing material and a method for producing a liquid crystal display cell which is improved in productivity, high-speed response and reliability. The sealing material for liquid crystals is produced through a step wherein fine particles (D) having an average particle size of not more than 3 ?m are dispersed, using a wet dispersion unit (A), in a reactive resin (C) having an epoxy group and/or a (meth)acryloyl group which resin has been dissolved in a solvent (B) and a following step wherein the solvent (B) is removed.Type: ApplicationFiled: March 11, 2005Publication date: March 13, 2008Inventors: Masahiro Imalzumi, Naoyuki Ochi, Toyofumi Asano, Eiichi Nishihara, Masahiro Hirano, Takumi Kobayashi
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Publication number: 20070026227Abstract: The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.Type: ApplicationFiled: May 11, 2004Publication date: February 1, 2007Applicant: Nippon Kayaku Kabushiki KaishaInventors: Makoto Uchida, Toyofumi Asano
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Publication number: 20070020405Abstract: An objective of this application is to provide a sealant for liquid crystals witch is extremely less apt to contaminate liquid crystals and has high adhesion strength. This application discloses a sealant for liquid crystals comprising as essential ingredients (a) a radiation-curable resin represented by the general formula (1): wherein R1 represents a hydrogen atom or a methyl group, R2 represents a hydrogen atom, a halogen atom, a hydroxyl group, a linear, branch or cyclic monovalent alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, m represents an integer of 1 to 4, and may be the same or different, R3 represents a hydrogen atom or a methyl group, and the number n of the repeating units is a positive number in the range of 0 to 20; (b) a photopolymerization initiator; and (c) an inorganic filler having an average particle diameter of 3 ?m or less.Type: ApplicationFiled: May 18, 2004Publication date: January 25, 2007Inventors: Naoyuki Ochi, Toyofumi Asano, Masahiro Imaizumi, Masaru Kudo, Eiichi Nishihara, Hiroo Koyanagi, Sumio Ichimura, Masahiro Hirano
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Publication number: 20060208219Abstract: The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 ?m.Type: ApplicationFiled: April 6, 2004Publication date: September 21, 2006Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Masahiro Imaizumi, Toyofumi Asano, Naoyuki Ochi, Masahiro Hirano, Sumio Ichimura, Masaru Kudo, Katsuhiro Oshimi, Masataka Nakanishi, Yasumasa Akatsuka, Eiichi Nishihara, Masayuki Itai
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Patent number: 6956100Abstract: An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.Type: GrantFiled: October 18, 2001Date of Patent: October 18, 2005Assignee: Nippon Kayaku Kabushiki KaishaInventors: Masahiro Imaizumi, Toyofumi Asano, Masaki Shinmoto
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Patent number: 6794031Abstract: A cover-lay film comprising a heat-resistant film and an adhesive layer, wherein the adhesive layer is formed of an epoxy resin composition containing (a) an epoxy resin, (b) a curing agent, (c) a phenolic hydroxyl-containing polyamide-poly(butadiene-acrylonitrile) copolymer, and (d) an ion capturing agent and having a glass transition temperature of 80° C. or higher after cure, and the heat-resistant film mainly comprises a polyimide containing a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component and has a specific coefficient of linear thermal expansion and a specific tensile modulus in both machine and transverse directions.Type: GrantFiled: September 24, 2002Date of Patent: September 21, 2004Assignees: Ube Industries, Ltd., Nippon Kayaku Co., Ltd.Inventors: Tooru Murakami, Toyofumi Asano, Masahiro Imaizumi
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Publication number: 20040166326Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product.Type: ApplicationFiled: February 26, 2004Publication date: August 26, 2004Inventors: Yasumasa Akatsuka, Toyofumi Asano, Masahiro Imaizumi, Katsuhiko Oshimi, Syouichi Tomida
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Patent number: 6723801Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product. The present invention comprises a polyphenol compound obtained by reacting to condense phenol with bischloromethyl biphenyl or bismethoxymethyl biphenyl, removing unreacted phenol and then reacting with BCMB again, wherein the polyphenol compound has a weight-average molecular weight of 3,000 or more as determined by GPC, and using the polyphenol compound as an agent for curing an epoxy resin.Type: GrantFiled: May 31, 2002Date of Patent: April 20, 2004Assignee: Nippon Kayaku Kabushiki KaishaInventors: Yasumasa Akatsuka, Toyofumi Asano, Masahiro Imaizumi, Katsuhiko Oshimi, Syouichi Tomida
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Publication number: 20040024124Abstract: An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.Type: ApplicationFiled: April 16, 2003Publication date: February 5, 2004Inventors: Masahiro Imaizumi, Toyofumi Asano, Masaki Shimoto
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Publication number: 20030166796Abstract: The present invention is intended to provide cured articles which has excellent heat resistance and excellent flexibility, excellent adhesion, excellent dielectric properties and excellent toughness suitable laminates, metal foil-clad laminates, insulating materials for build-up substrates, flexible printed wiring boards, materials for flexible printed wiring boards, etc.Type: ApplicationFiled: February 3, 2003Publication date: September 4, 2003Inventors: Masahiro Imaizumi, Toyofumi Asano, Masaki Shinmoto
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Publication number: 20030091842Abstract: A cover-lay film comprising a heat-resistant film and an adhesive layer, wherein the adhesive layer is formed of an epoxy resin composition containing (a) an epoxy resin, (b) a curing agent, (c) a phenolic hydroxyl-containing polyamide-poly(butadiene-acrylonitrile) copolymer, and (d) an ion capturing agent and having a glass transition temperature of 80° C. or higher after cure, and the heat-resistant film mainly comprises a polyimide containing a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component and has a specific coefficient of linear thermal expansion and a specific tensile modulus in both machine and transverse directions.Type: ApplicationFiled: September 24, 2002Publication date: May 15, 2003Applicant: UBE INDUSTRIES, LTD.Inventors: Tooru Murakami, Toyofumi Asano, Masahiro Imaizumi
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Publication number: 20030009001Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product.Type: ApplicationFiled: May 31, 2002Publication date: January 9, 2003Inventors: Yasumasa Akatsuka, Toyofumi Asano, Masahiro Imaizumi, Katsuhiko Oshimi, Syouichi Tomida