Patents by Inventor Toyohiko Asai

Toyohiko Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of cutting out chips for a plurality of sensor elements from laminated body, method of manufacturing sensor element, and sensor element
    Patent number: 8734938
    Abstract: A sensor element is formed by cutting a laminated body and heating with the cutting taking place in a state where a difference in resistance on sides of a cutting component is as small as possible. That is, a uniform cutting is where resistance added to both sides of the cutting component is substantially the same. When uniform cutting cannot be performed, a nonuniform cutting in a state where resistance added to both sides of the cutting component is different is performed. Consequently, a surface perpendicular to a longitudinal direction of the sensor element is trapezoidal.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: May 27, 2014
    Assignees: NGK Insulators, Ltd., NGK Printer Ceramics Co., Ltd.
    Inventors: Hiroyuki Shindo, Toyohiko Asai
  • Measuring equipment and method for forming laminated body
    Patent number: 8359761
    Abstract: A method for improving an accuracy of measurement of the thickness of a green sheet, and additionally improving yield of a green sheet used for formation of a laminated body is provided. The thickness of each of a plurality of ceramic green sheets is measured, and an average and a variation of obtained thickness measurement values are checked against predetermined ranking criteria. Thereby, a ranking is performed in which the plurality of ceramic green sheets are classified into a plurality of ranks set in the ranking criteria. When forming the laminated body, only a ceramic green sheet belonging to at least one of the ranks which is in advance allowed to be used is used as a ceramic green sheet constituting each layer of the laminated body.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: January 29, 2013
    Assignees: NGK Insulators, Ltd., NGK Ceramic Device Co., Ltd.
    Inventors: Hiroyuki Shindo, Toyohiko Asai
  • MEASURING EQUIPMENT AND METHOD FOR FORMING LAMINATED BODY
    Publication number: 20110100523
    Abstract: A method for improving an accuracy of measurement of the thickness of a green sheet, and additionally improving yield of a green sheet used for formation of a laminated body is provided. The thickness of each of a plurality of ceramic green sheets is measured, and an average and a variation of obtained thickness measurement values are checked against predetermined ranking criteria. Thereby, a ranking is performed in which the plurality of ceramic green sheets are classified into a plurality of ranks set in the ranking criteria. When forming the laminated body, only a ceramic green sheet belonging to at least one of the ranks which is in advance allowed to be used is used as a ceramic green sheet constituting each layer of the laminated body.
    Type: Application
    Filed: October 19, 2010
    Publication date: May 5, 2011
    Applicants: NGK Insulators, Ltd., NGK Ceramic Device Co., Ltd.
    Inventors: Hiroyuki SHINDO, Toyohiko ASAI
  • METHOD OF CUTTING OUT CHIPS FOR A PLURALITY OF SENSOR ELEMENTS FROM LAMINATED BODY, METHOD OF MANUFACTURING SENSOR ELEMENT, AND SENSOR ELEMENT
    Publication number: 20090239053
    Abstract: A sensor element is formed by cutting a laminated body and heating with the cutting taking place in a state where a difference in resistance on sides of a cutting component is as small as possible. That is, a uniform cutting is where resistance added to both sides of the cutting component is substantially the same. When uniform cutting cannot be performed, a nonuniform cutting in a state where resistance added to both sides of the cutting component is different is performed. Consequently, a surface perpendicular to a longitudinal direction of the sensor element is trapezoidal.
    Type: Application
    Filed: March 18, 2009
    Publication date: September 24, 2009
    Applicants: NGK Insulators, Ltd., NGK Printer Ceramics Co., Ltd.
    Inventors: Hiroyuki Shindo, Toyohiko Asai