Abstract: A switch lock apparatus includes a switching mechanism configured to switch a switch provided at a main body part where a cover body is rotatably provided to a lock-off state where operation can be done or a lock-on state where the operation cannot be done, and an interlocking mechanism configured to control the switching mechanism so that the switch is switched to be in the lock-on state based on the cover body being rotated to a closing position.

Abstract: A switch lock apparatus includes a switching mechanism configured to switch a switch provided at a main body part where a cover body is rotatably provided to a lock-off state where operation can be done or a lock-on state where the operation cannot be done, and an interlocking mechanism configured to control the switching mechanism so that the switch is switched to be in the lock-on state based on the cover body being rotated to a closing position.

Abstract: An electronic apparatus mounted with a disk unit, and a vibration and/or shock absorbing member which absorbs vibration and/or shock is provided between the disk unit and a lid member which covers a disk unit accommodating part provided in a housing of the electronic apparatus.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: An apparatus such as a portable computer including a microchip module constituted by a substrate and semiconductor chips mounted thereon. The microchip module is surrounded and supported by an annular frame. The microchip module and the annular frame are fixed to a motherboard by screws. A heat-radiating plate is attached to the microchip module to constitute a microchip module unit. The arrangement including the annular frame protects the microchip module from vibration and impact, and improves a grounding function, a heat radiating efficiency, and a shielding function.