Abstract: A method of and an apparatus for performing a collision simulation on a two-wheeled vehicle using a virtual model of a dummy developed for use on four-wheeled vehicles.

Abstract: A semiconductor device analyzer comprises a function of radiating a charged particle beam on a sample and displaying a detected secondary electron image according to detected secondary electron intensity. A charged particle beam is radiated according to a first radiation pattern onto a semiconductor device that is to be analyzed, and a charge is injected. Next, a charge accumulation state of the semiconductor device that is to be analyzed is observed. A location where the charge accumulation state is abnormal can be detected as a defect location in the semiconductor device. A defect location is identified easily.

Abstract: An analysis apparatus for a semiconductor device, capable of attaining highly efficient analysis of failure in the semiconductor device by a secondary-electron image, including: a region determination unit which determines a region constituting a secondary-electron image of a semiconductor device to be analyzed obtained by irradiating charged particle beam, based on the secondary-electron image and design data of the semiconductor device as a source of comparison; a material identification unit which identifies a material of each configuration of an image obtained by the region determination unit, based on the design data of the semiconductor device; a unit which calculates a potential in the each region identified by the material identification unit, based on the design data of the semiconductor device; a unit which colors each region of an image obtained by the material identification unit in accordance with the potential and generates a dummy good-product secondary-electron image; and a unit which displays

Abstract: Provided is an apparatus for acquiring information about the interior of a sample non-destructively and with high resolution, determining pass/fail of the sample and shortening inspection time. A sample is irradiated with an electron beam or X-rays, fluorescent X-rays from the sample are converted using a zone plate and are detected by a detector, an electric signal from the detector is converted to a digital signal by an A/D converter and the digital signal is applied to a fail decision unit, which determines pass/fail of the sample. If the sample is fail, an image processor applies image processing and presents a display on an image display unit.

Abstract: A method of and an apparatus for performing a collision simulation on a two-wheeled vehicle using a virtual model of a dummy developed for use on four-wheeled vehicles.

Abstract: A shock absorbing structure of a two-wheeled vehicle capable of sufficiently absorbing shock and desirably maintain the steerability of the two-wheeled vehicle. The structure includes a shock absorbing member projecting from a front wheel, wherein the shock absorbing member is crashed when the vehicle collides with an obstacle so as to absorb shock. A ceiling wall of the shock absorbing member is located at such a position that the ceiling wall does not block a forward viewing area for a driver. A center of a leading end contact surface of the shock absorbing member is located at a position higher than a vertical position of a center of gravity G of both a motorcycle and the driver, and right and left side surfaces of the shock absorbing member are offset to a center of a vehicular body from right and left side surfaces of the motorcycle.

Abstract: In a compact vehicle in which a vehicular component engaged with an inflated and extended air bag is arranged in the inflated and extended range of the air bag that can constrain a rider on a seat provided to the rear of a body frame from a forward direction, even if there is the vehicular component engaged with the air bag in an inflated and extended state, space for the air bag to be fully inflated and extended is secured and in addition, the inflated and extended air bag is securely supported. A vehicular component can be turned between an inactuated position in which an air bag is folded and an actuated position in which the vehicular component is displaced from the inactuated position, being engaged with and supporting a part of the inflated and extended air bag and is supported by fixed supporting means.

Abstract: An airbag apparatus for a small size vehicle that includes an airbag, for constraining a driver on a seat from forward motion through an inflation expansion, that reduces the number of parts and achieves miniaturization of the apparatus while constraining the driver on the seat. The airbag includes a main bag portion and an auxiliary bag portion communicating with the inside of the main bag portion through a connecting hole. The auxiliary bag portion is inflated and expanded with gas exhausted from the main bag portion through the connecting hole.

Abstract: A method of and an apparatus for performing a collision simulation on a two-wheeled vehicle using a virtual model of a dummy developed for use on four-wheeled vehicles.

Abstract: In order to have an external force heading from the front toward the occupant received, a bumper member extending substantially along the length of the vehicle is disposed under or by the sides of the cabin (riding space). The shock absorbing members are connected at the rear ends of the bumper member. Even in the case of the vehicle in which it is difficult to dispose the shock absorbing member at the front portion of the vehicle within the range of the length of the vehicle for example, when an impact load is exerted to such a vehicle, the impact load may be efficiently absorbed. As a consequent the riding space for an occupant can be maintained. The shock absorbing body may be constructed of an upper shock absorbing member and a lower shock absorbing member. The upper and lower shock absorbing members may be formed of two types of members having different crushing features.

Abstract: In a compact vehicle in which a vehicular component engaged with an inflated and extended air bag is arranged in the inflated and extended range of the air bag that can constrain a rider on a seat provided to the rear of a body frame from a forward direction, even if there is the vehicular component engaged with the air bag in an inflated and extended state, space for the air bag to be fully inflated and extended is secured and in addition, the inflated and extended air bag is securely supported. A vehicular component can be turned between an inactuated position in which an air bag is folded and an actuated position in which the vehicular component is displaced from the inactuated position, being engaged with and supporting a part of the inflated and extended air bag and is supported by fixed supporting means.

Abstract: An airbag apparatus for a small size vehicle that includes an airbag, for constraining a driver on a seat from forward motion through an inflation expansion, that reduces the number of parts and achieves miniaturization of the apparatus while constraining the driver on the seat. The airbag includes a main bag portion and an auxiliary bag portion communicating with the inside of the main bag portion through a connecting hole. The auxiliary bag portion is inflated and expanded with gas exhausted from the main bag portion through the connecting hole.

Abstract: There is disclosed a wafer external inspection apparatus of a dark field reflective type for irradiating an external defect on a surface of a die on a semiconductor device wafer with incoherent illumination to detect the external defect from an image captured by a one-dimensional camera, the apparatus comprising illumination means in which an azimuth angle of at least one incoherent illumination becomes a 45-degree group azimuth of about 45 degrees, about 135 degrees, about 225 degrees or about 315 degrees within the surface of the wafer with respect to an azimuth of patterns occupying a majority in the die.

Abstract: In order to have an external force heading from the front toward the occupant received, a bumper member extending substantially along the length of the vehicle is disposed under or by the sides of the cabin (riding space). The shock absorbing members are connected at the rear ends of the bumper member. Even in the case of the vehicle in which it is difficult to dispose the shock absorbing member at the front portion of the vehicle within the range of the length of the vehicle for example, when an impact load is exerted to such a vehicle, the impact load may be efficiently absorbed. As a consequent the riding space for an occupant can be maintained. The shock absorbing body may be constructed of an upper shock absorbing member and a lower shock absorbing member. The upper and lower shock absorbing members may be formed of two types of members having different crushing features.

Abstract: To provide a shock absorbing structure of a two-wheeled vehicle, which is capable of sufficiently absorbing shock and desirably maintain the steerability of the two-wheeled vehicle. A shock absorbing structure includes a shock absorbing member projecting from a front wheel, wherein the shock absorbing member is crashed when the vehicle collides with an obstacle so as to absorb shock. In the shock absorbing structure, a front end of the shock absorbing member is located in front of a front wheel or in the vicinity of the front wheel. A ceiling wall of the shock absorbing member is located at such a position that the ceiling wall does not block a forward viewing area for a driver. A center of a leading end contact surface of the shock absorbing member is located at a position higher than a vertical position of a center of gravity G of both a motorcycle and the driver.

Abstract: An apparatus for optically checking a pattern of a semiconductor wafer, includes (a) a laser beam source which radiate a laser beam to the pattern, (b) a beam collector which collects a laser beam reflected from the pattern, (c) a photodetector which detects a defect in a shape in the pattern, based on the laser beam collected by the beam collector, the laser beam source and the beam collector being movable together in an area above the semiconductor wafer.

Abstract: An image signal of a large number of patterns of the same shape on an LSI wafer obtained by an image sensor is held in a memory circuit, by using a CMOS image sensor chip incorporating a one-dimensional CMOS photodiode array, an analog-to-digital conversion circuit, a memory circuit and a processing circuit. Then, the image signal and one-cycle and two-cycle displaced image signals cyclically displaced from the image signal by the processing circuit are algebraically processed by a defect detection algorithm in the processing circuit of the CMOS image sensor. By this processing, a defect image is extracted without using a normal inspection pattern. Thus, a high-speed processing, a simplification of a configuration of an apparatus and a miniaturization of the apparatus become possible.

Abstract: A testing apparatus for an opening state of a hole in a semiconductor device includes a laser light radiating system. The semiconductor device has the conductive layer and the insulating layer formed on the conductive layer, and the hole is formed in the insulating layer at aim to reach the conductive layer. The laser light radiating system radiates to a hole, a laser light having a wave length determined based on a work function of a material of a conductive layer and a work function of a material of an insulating layer. A detector detects photoelectrons emitted through a portion of the hole to which the laser light is irradiated. A charge supplementing mechanism supplies electrons to the conductive layer.

Abstract: In a fine pattern inspection device for inspecting a fine pattern comprising a plurality of pattern elements which have the same form and which are formed on an inspection sample, the device detects a defect in the plurality of pattern elements by the use of an image derived from the fine pattern. An image obtaining unit obtains the image from the fine pattern and produces an image signal representing the image. The image signal is divided into first and second divided image signals. A processing unit extracts a defect image and an inverted defect image that is inverted in lightness of the defect image, by carrying out a first process that gives a predetermined delay to the first divided image signal and then inverts the lightness thereof to obtain a processed image signal and carrying out a second process that adds the processed image signal and the second divided image signal to obtain a difference image signal representing a difference image which includes the defect image and the inverted defect image.

Abstract: In a fault analysis of large-scale integrated (LSI) circuits, a potential distribution image of a non-defective product and another potential distribution image of a defective product are displayed alternately and continuously in time, so that it is possible to acquire in real time an image of any location within a whole surface of the LSI chip. As a result, it can be viewed as if the potential distribution image of the non-defective product and the potential distribution image of the defective product are overlapped or superimposed with over time. Accordingly, a different portion between the non-defective and defective potential distribution images can be seen distinguishably from a coincident portion between the non-defective and defective potential distribution images, so that it is possible to trace the different portion in real time.