Patents by Inventor Toyomitsu SEKI

Toyomitsu SEKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250223495
    Abstract: The disclosure aims to provide a composition capable of suppressing fluororesin agglomeration, which may lead to strands with a poor appearance, even when the proportion of the fluororesin is increased, and also aims to provide a molded article, a laminate, and a resin. The disclosure relates to a composition containing: a fluororesin A; and a resin B other than the fluororesin A, the resin B having a melt flow rate of 30 g/10 min or higher at a melting point +12° C., at least one of the fluororesin A or the resin B containing a group (I) represented by the following formula: wherein R1 and R2 are the same as or different from each other, are each hydrogen or an organic group, and optionally bond to each other to form a ring structure; and a double line composed of a solid line and a dotted line represents a single bond or a double bond.
    Type: Application
    Filed: March 27, 2025
    Publication date: July 10, 2025
    Applicants: National University Corporation Yamagata University, DAIKIN INDUSTRIES, LTD.
    Inventors: Tatsuhiro Takahashi, Takuya Nukui, Yuma Tomizawa, Shuhei Yamaguchi, Toshiyuki Fukushima, Toyomitsu Seki, Masaji Komori, Ken Okanishi, Akiyoshi Yamauchi
  • Publication number: 20250223494
    Abstract: The disclosure aims to provide a composition capable of suppressing fluororesin agglomeration, which may lead to strands with a poor appearance, even when the proportion of the fluororesin is increased, and also aims to provide a molded article, a laminate, and a method for producing a composition. The disclosure relates to a composition containing a fluororesin A; and a resin B other than the fluororesin A, the resin B having a melt flow rate of 30 g/10 min or higher at a melting point +8° C., the fluororesin A being a resin satisfying a ratio (a MFR of the fluororesin A)/(a MFR of the resin B)=0.2 to 10.
    Type: Application
    Filed: March 27, 2025
    Publication date: July 10, 2025
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Shuhei YAMAGUCHI, Toshiyuki FUKUSHIMA, Toyomitsu SEKI, Masaji KOMORI, Ken OKANISHI, Akiyoshi YAMAUCHI
  • Publication number: 20250153289
    Abstract: A robot system includes an end effector configured to hold a workpiece, an operation device connected to the end effector and configured to operate the end effector, and a control device configured to control an operation of the operation device. The control device controls: a step of assembling the workpiece in a form in which a pressing-target object is sandwiched by arranging the pressing-target object on a first plate jig arranged at a set position and thereafter placing a second plate jig on the first plate jig through operating the end effector; and a step of conveying the workpiece to press position at which the pressing-target object is pressed by holding the pressing-target object, the first plate jig, and the second plate jig altogether as the workpiece with the end effector.
    Type: Application
    Filed: January 17, 2025
    Publication date: May 15, 2025
    Inventors: Yuki ASANO, Junichiro SHIOMI, Kei OKADA, Satoru YONEDA, Masahiro HIGASHI, Yosuke KISHIKAWA, Shigehito SAGISAKA, Toyomitsu SEKI
  • Publication number: 20230260672
    Abstract: An insulated wire including a conductor (A) and an insulating layer (B) around the conductor (A). The insulating layer (B) contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II) and has a melt viscosity at 60 sec?1 and 390° C. of 0.40 to 0.75 kPa·s. The aromatic polyetherketone resin (I) has a melt viscosity at 60 sec?1 and 390° C. of 0.30 kPa·s or lower. The insulating layer (B) has a thickness of 30 to 300 ?m.
    Type: Application
    Filed: March 28, 2023
    Publication date: August 17, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Takuma MARUHASHI, Koji NAKANISHI, Toyomitsu SEKI, Hideki KONO
  • Publication number: 20230242771
    Abstract: A composition for three-dimensional printing which contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The composition satisfies a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238. Also disclosed is a three-dimensionally printed article obtained by three-dimensional printing of the composition for three-dimensional printing.
    Type: Application
    Filed: March 28, 2023
    Publication date: August 3, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Koji NAKANISHI, Toyomitsu SEKI, Takuma MARUHASHI, Hideki KONO
  • Publication number: 20230235182
    Abstract: A powder composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The powder composition has a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Koji NAKANISHI, Toyomitsu SEKI, Takuma MARUHASHI, Noriko IMADA, Hideki KONO
  • Publication number: 20230174780
    Abstract: A film containing a resin composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The fluorine-containing copolymer (II) defines a dispersed phase at an average dispersed particle size of 5 µm or smaller. The aromatic polyetherketone resin (I) has a crystallinity of lower than 6%.
    Type: Application
    Filed: February 6, 2023
    Publication date: June 8, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Toyomitsu SEKI, Takuma MARUHASHI, Koji NAKANISHI, Hideki KONO
  • Publication number: 20220010131
    Abstract: A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238. Also disclosed is a pellet obtained by molding the resin composition and a molded article formed from the resin composition or the pellet.
    Type: Application
    Filed: September 23, 2021
    Publication date: January 13, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Koji NAKANISHI, Toyomitsu SEKI, Hideki KONO