Abstract: A finishing grindstone member (20) is fixed to a spindle (10) by a bolt. In the spindle (10), there is formed a tool mounting portion (25) into which a rough grindstone member can be mounted. Into the tool mounting portion (25), there can be mounted not only the rough grindstone member but also a cover member (36). After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member (20), the cover member (36) is mounted onto the tool mounting portion (25) to thereby prevent the tool mounting portion (25) from being soiled.

Abstract: A workpiece 23 formed of a circular thin plate is rotated about its center as an axis L1. Each of disk-shaped rotating grinding wheels 27 and 28, while being rotated about an axis L3 extending in a direction substantially parallel to the plane of the workpiece 23 and perpendicular to the radial direction of the workpiece 23, is made to undergo relative feeding movement on both obverse and reverse surface sides of the workpiece 23 along an outer peripheral edge portion 23a of the workpiece 23. Consequently, the outer peripheral edge portion 23a of the workpiece 23 is ground by an outer peripheral surface of each of the rotating grinding wheels 27 and 28. In this case, it is preferred that two grinding wheels 27 and 28 for rough grinding and finish grinding be provided as the disk-shaped rotating grinding wheels, and that rough grinding and finish grinding are performed by the same station.

Abstract: A workpiece receiving hole 60a for fittingly receiving a workpiece 17 is formed in the center of a rotary disk 60 which is thinner than the workpiece 17. A workpiece drive section 60b which engages a notch 17a formed for the purpose of orienting the workpiece 17 relative to crystal orientation is formed along the brim of the hole 60a. A gear 59 is rotated by a gear 62 of a motor 61, thereby rotating the rotary disk 60 and imparting torque to the workpiece 17. Accordingly, both surfaces of the workpiece are ground by means of a double disc surface grinder.

Abstract: A finishing grindstone member 20 is fixed to a spindle 10 by a bolt. In the spindle 10, there is formed a tool mounting portion 25 into which a rough grindstone member can be mounted. Into the tool mounting portion 25, there can be mounted not only the rough grindstone member but also a cover member 36. After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member 20, the cover member 36 is mounted onto the tool mounting portion 25 to thereby prevent the tool mounting portion 25 from being soiled.

Abstract: A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.

Abstract: A managing system for managing slurry, which is supplied to a wire saw. Slurry is prepared in a preparing tank and sent to the wire saw and used to cut workpieces. After usage for cutting workpieces, the slurry is sent to a separating apparatus from the wire saw. The separating apparatus separates impurities from the used slurry to recover a mixture of recyclable dispersing liquid and abrasive grains from the used slurry. The recovered mixture is returned to the preparing tank. The recovered mixture is mixed with fresh abrasive grains and dispersing liquid in the preparing tank to prepare slurry. The property (specific gravity and viscosity) of the slurry in the preparing tank is detected. The amount of fresh abrasive grains and dispersing liquid supplied to the preparing tank is adjusted in accordance with the detection results. Accordingly, slurry having properties that are optimal for the cutting of workpieces is prepared.

Abstract: A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut work 3 is split into a multiplicity of pieces over its longitudinal direction so as to obtain disk-shaped works 5 to be ground, characterized in that a retaining member 2 is used in which a retaining layer 7 which is directly bonded to the side surface of the ingot 1 by a first adhesive agent having an adhesive strength sufficient to receive a rotating force due to a grinding apparatus 6 in a subsequent grinding process, an intermediate layer 8 which is bonded to said retaining layer 7 in a superposed manner by a second adhesive agent whose adhesive strength deteriorates more than that of the first adhesive agent under a fixed condition, and a supporting layer 11 which is connected to said intermediate layer 8 and is connected to a supporting portion 10 of said

Abstract: A slurry managing system for a wire saw is disclosed. The wire saw includes a wire that has a plurality of wire lines extending in parallel to one another. The wire is supplied with slurry containing abrasive grains in dispersing liquid to cut a workpiece so as to simultaneously produce a multiplicity of wafers. A mixer device mixes the slurry prior to supplying of the slurry to the wire saw. A first supplying device supplies the grains to the mixer device. A second supplying device supplies the dispersing liquid to the mixer device. A first adjusting device adjusts the amount of the grains supplied to the mixer device from the first supplying device. A second adjusting device adjusts the amount of the liquid supplied to the mixer device from the second supplying device.

Abstract: A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.

Abstract: A slurry managing system for a wire saw is disclosed. The wire saw includes a wire that has a plurality of wire lines extending in parallel to one another. The wire is supplied with slurry containing abrasive grains in dispersing liquid to cut a workpiece so as to simultaneously produce a multiplicity of wafers. A mixer device mixes the slurry prior to supplying of the slurry to the wire saw. A first supplying device supplies the grains to the mixer device. A second supplying device supplies the dispersing liquid to the mixer device. A first adjusting device adjusts the amount of the grains supplied to the mixer device from the first supplying device. A second adjusting device adjusts the amount of the liquid supplied to the mixer device from the second supplying device.