Patents by Inventor Tozer J. BANDORAWALLA

Tozer J. BANDORAWALLA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Techniques in performance and efficiency improvements of processors in a cooling system
    Patent number: 11061460
    Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for Thermal Design Power (TDP) rebalancing among thermally-coupled processors and non-thermally-coupled processors, providing computing efficiency or homogeneity with respect to, including but not limited to, thermal requirements, power consumption, and processor operations. The TDP rebalancing may include implementing management circuitry and configuration control circuitry. Other embodiments may be described and claimed.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: July 13, 2021
    Assignee: Intel Corporation
    Inventors: Fuat Keceli, Tozer J. Bandorawalla, Grant McFarland, Jonathan M. Eastep, Federico Ardanaz
  • Temperature sensing based flow monitoring and fault detection
    Patent number: 10612980
    Abstract: An apparatus is provided which comprises: a first circuitry to receive a measurement of a first temperature of a section of a computing device during a first loading condition of the computing device, and to receive a measurement of a second temperature of the section of the computing device during a second loading condition of the computing device; and a second circuitry to detect a potential fault in a cooling system to cool the computing device, based at least in part on the first temperature and the second temperature.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: April 7, 2020
    Assignee: Intel Corporation
    Inventors: Janusz P. Jurski, Tozer J. Bandorawalla, Ramkumar Nagappan, Mariusz Oriol, Piotr Sawicki, Robin A. Steinbrecher, Shankar Krishnan
  • TECHNIQUES IN PERFORMANCE AND EFFICIENCY IMPROVEMENTS OF PROCESSORS IN A COOLING SYSTEM
    Publication number: 20190324517
    Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for Thermal Design Power (TDP) rebalancing among thermally-coupled processors and non-thermally-coupled processors, providing computing efficiency or homogeneity with respect to, including but not limited to, thermal requirements, power consumption, and processor operations. The TDP rebalancing may include implementing management circuitry and configuration control circuitry. Other embodiments may be described and claimed.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 24, 2019
    Inventors: Fuat Keceli, Tozer J. Bandorawalla, Grant McFarland, Jonathan M. Eastep, Federico Ardanaz
  • Cold plate with dam isolation
    Patent number: 10431475
    Abstract: Apparatuses, systems and methods associated with design of cold plates for cooling electrical systems are disclosed herein. In embodiments, a cold plate may include a base and a lid affixed to a side of the base via a braze joint, wherein the braze joint may extend around a perimeter of the lid. The lid may include a dam having a perimeter located inside of the perimeter of the lid, wherein the dam may be compressed against the side of the base and may be liquid-tight to the side of the base, and wherein a cavity may be located between the base and the lid within the perimeter of the dam to provide a circulation passage for a liquid coolant. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: October 1, 2019
    Assignee: Intel Corporation
    Inventors: Tozer J. Bandorawalla, Mark E. Sprenger
  • TEMPERATURE SENSING BASED FLOW MONITORING AND FAULT DETECTION
    Publication number: 20180372551
    Abstract: An apparatus is provided which comprises: a first circuitry to receive a measurement of a first temperature of a section of a computing device during a first loading condition of the computing device, and to receive a measurement of a second temperature of the section of the computing device during a second loading condition of the computing device; and a second circuitry to detect a potential fault in a cooling system to cool the computing device, based at least in part on the first temperature and the second temperature.
    Type: Application
    Filed: June 21, 2017
    Publication date: December 27, 2018
    Inventors: Janusz P. Jurski, Tozer J. Bandorawalla, Ramkumar Nagappan, Mariusz Oriol, Piotr Sawicki, Robin A. Steinbrecher, Shankar Krishnan
  • COLD PLATE WITH DAM ISOLATION
    Publication number: 20180332734
    Abstract: Apparatuses, systems and methods associated with design of cold plates for cooling electrical systems are disclosed herein. In embodiments, a cold plate may include a base and a lid affixed to a side of the base via a braze joint, wherein the braze joint may extend around a perimeter of the lid. The lid may include a dam having a perimeter located inside of the perimeter of the lid, wherein the dam may be compressed against the side of the base and may be liquid-tight to the side of the base, and wherein a cavity may be located between the base and the lid within the perimeter of the dam to provide a circulation passage for a liquid coolant. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: May 15, 2017
    Publication date: November 15, 2018
    Inventors: Tozer J. BANDORAWALLA, Mark E. SPRENGER