Patents by Inventor Trac Nguyen

Trac Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5779929
    Abstract: The specification describes a metallization system for barium nanotitanate substrates that provides a combination of high dielectric properties and excellent metal adhesion. It comprises Ti, Pd or Ti/Pd alloy, and copper.
    Type: Grant
    Filed: October 7, 1996
    Date of Patent: July 14, 1998
    Assignee: Lucent Technologies Inc.
    Inventors: Tae Yong Kim, Dennis Lyle Krause, Trac Nguyen
  • Patent number: 5622895
    Abstract: Multilayer circuit devices include a plurality of metallized patterns thereon, said patterns being separated by a polymeric dielectric film. The various metallized patterns are interconnected by means of microvias through the polymeric film or films. Each of the metallizations is a composite including in succession from the substrate or from the polymeric film, a layer of titanium (Ti), a layer of titanium and palladium alloy (Ti/Pd), a layer of copper (Cu), and a layer of titanium and palladium alloy (Ti/Pd). The Ti-Ti/Pd-Cu-Ti/Pd composite is hereinafter referred to as TCT. The adhesion between the polymeric film and the top Ti/Pd layer is better than that between the polymer and gold (Au) and comparable to that between the polymer and an adhesion promoted Au layer. Use of the TCT metallization also results in additional cost reduction due to the elimination of Ni and Au layers on top of the Cu layer.
    Type: Grant
    Filed: August 4, 1995
    Date of Patent: April 22, 1997
    Assignee: Lucent Technologies Inc.
    Inventors: Aaron L. Frank, Ajibola O. Ibidunni, Douglas B. Johnson, Dennis L. Krause, Trac Nguyen
  • Patent number: 5466972
    Abstract: Multilayer circuit devices include a plurality of metallized patterns thereon, said patterns being separated by a polymeric dielectric film. The various metallized patterns are interconnected by means of microvias through the polymeric film or films. Each of the metallizations is a composite including in succession from the substrate or from the polymeric film, a layer of titanium (Ti), a layer of titanium and palladium alloy (Ti/Pd), a layer of copper (Cu), and a layer of titanium and palladium alloy (Ti/Pd). The Ti--Ti/Pd--Cu--Ti/Pd composite is hereinafter referred to as TCT. The adhesion between the polymeric film and the top Ti/Pd layer is better than that between the polymer and gold (Au) and comparable to that between the polymer and an adhesion promoted Au layer. Use of the TCT metallization also results in additional cost reduction due to the elimination of Ni and Au layers on top of the Cu layer.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: November 14, 1995
    Assignee: AT&T Corp.
    Inventors: Aaron L. Frank, Ajibola O. Ibidunni, Douglas B. Johnson, Dennis L. Krause, Trac Nguyen