Abstract: A method for forming a MEMS structure for an inertial sensor from fused silica includes: depositing a conductive layer on one or more selected regions of a first surface of a fused silica substrate, and illuminating areas of the fused silica substrate with laser radiation in a pattern defining features of the MEMS structure for an inertial sensor. A masking layer is deposited at least on the one or more selected regions of the first surface of the fused silica substrate where the conductive layer has been deposited, such that the illuminated areas of the fused silica substrate remain exposed. A first etch of the exposed areas of the fused silica substrate is performed so as to selectively etch the pattern defining features of the MEMS structure for an inertial sensor.

Abstract: Improved fabricated adhesive microstructures and methods of fabricating adhesive microstructures incorporating deformable materials are provided. The fabricated adhesive microstructures exhibit significantly improved adhesion strengths at least at smooth surfaces such as glass, as compared to known fabricated adhesive microstructures. The adhesion strengths of fabricated microstructures of the invention for a range of smooth glass contact surfaces may be in the range of between about 125 kPa and 220 kPa in air at one atmosphere pressure and in the range of between about 25 kPa and 120 kPa in vacuum. Synthetic elastomers are used in the invention. A method of fabricating new adhesive microstructures having multiple levels of compliance with a surface has been proposed. Methods of fabricating new double-sided adhesive microstructures via moulding have further been proposed.