Patents by Inventor Tracy A. Tong
Tracy A. Tong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11053604Abstract: Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.Type: GrantFiled: July 24, 2019Date of Patent: July 6, 2021Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20210173145Abstract: Photonic integrated circuit (PIC) packages include a PIC die. The PIC die includes a waveguide(s) positioned on the PIC die, and a groove(s) formed in a surface of the PIC die. The groove(s) corresponds to and is positioned directly adjacent the waveguide(s). The PIC package also includes an optical fiber(s) operatively coupled to the waveguide(s) of the PIC die. The optical fiber(s) are positioned in the groove(s) of the PIC die and include an end positioned adjacent the waveguide(s). Additionally, the PIC package includes a plate positioned over a section of the optical fiber(s), and the plate includes a first edge positioned adjacent the waveguide(s) of the PIC die, and a second edge positioned opposite the first edge. The PIC package also includes a first adhesive disposed along the second edge of the plate and a second adhesive disposed along the first edge of the plate.Type: ApplicationFiled: December 4, 2019Publication date: June 10, 2021Inventors: Benjamin V. Fasano, Jorge A. Lubguban, Sarah H. Knickerbocker, Tracy A. Tong
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Patent number: 10895017Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: GrantFiled: August 22, 2018Date of Patent: January 19, 2021Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10718062Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: GrantFiled: July 17, 2019Date of Patent: July 21, 2020Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10520679Abstract: An optical system includes a photonics chip, a bridge waveguide structure formed on the chip, and an optical fiber disposed over the chip and optically aligned with the bridge waveguide structure. A cavity between the bridge waveguide structure and the chip is at least partially filled with an adhesive resin and a filler material having a coefficient of thermal expansion (CTE) less than that of the adhesive resin. The filler material may include filler particles dispersed throughout the adhesive resin, or a discrete layer of material separate from the adhesive resin. The composite adhesive material filling the cavity has an effective coefficient of thermal expansion less than the coefficient of thermal expansion of conventional adhesive resins. This lower effective CTE improves the survivability of the overlying bridge waveguide structure following thermal cycling of the optical system.Type: GrantFiled: June 5, 2018Date of Patent: December 31, 2019Assignee: GLOBALFOUNDRIES INC.Inventors: Sarah Knickerbocker, Jorge Lubguban, Tracy Tong
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Publication number: 20190369339Abstract: An optical system includes a photonics chip, a bridge waveguide structure formed on the chip, and an optical fiber disposed over the chip and optically aligned with the bridge waveguide structure. A cavity between the bridge waveguide structure and the chip is at least partially filled with an adhesive resin and a filler material having a coefficient of thermal expansion (CTE) less than that of the adhesive resin. The filler material may include filler particles dispersed throughout the adhesive resin, or a discrete layer of material separate from the adhesive resin. The composite adhesive material filling the cavity has an effective coefficient of thermal expansion less than the coefficient of thermal expansion of conventional adhesive resins. This lower effective CTE improves the survivability of the overlying bridge waveguide structure following thermal cycling of the optical system.Type: ApplicationFiled: June 5, 2018Publication date: December 5, 2019Applicant: GLOBALFOUNDRIES INC.Inventors: Sarah Knickerbocker, Jorge Lubguban, Tracy Tong
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Publication number: 20190345627Abstract: Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.Type: ApplicationFiled: July 24, 2019Publication date: November 14, 2019Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20190338441Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: ApplicationFiled: July 17, 2019Publication date: November 7, 2019Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10450667Abstract: Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.Type: GrantFiled: October 27, 2014Date of Patent: October 22, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10392720Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: GrantFiled: August 22, 2018Date of Patent: August 27, 2019Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10314219Abstract: A device comprises a rail configured to span and detachably couple to a housing. The device includes a plate that engages the housing and a mechanism securing the tool to the housing. The housing contains a printed circuit board configured with at least one row of slots, each slot configured with a retainer mechanism. A jaw assembly slides along the rail over more than one card positioned in the row of slots. The assembly includes a pair of inserts that perform either seating or extracting more than one card positioned in more than one slot. The device includes a lever for biasing the jaw assembly, where the inserts engage a selected one of more than one card positioned in more than one slot and the retainer mechanism for performing either simultaneously seating more than one card into or simultaneously extracting more than one card from more than slot.Type: GrantFiled: January 18, 2017Date of Patent: June 4, 2019Assignee: International Business Machines CorporationInventors: Karl O. Casserly, Mark L. Monroe, Leung M. Hung, Ronny R. Shipley, Tracy A. Tong, James Verzi
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Publication number: 20180355507Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: ApplicationFiled: August 22, 2018Publication date: December 13, 2018Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20180355506Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: ApplicationFiled: August 22, 2018Publication date: December 13, 2018Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10087546Abstract: Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.Type: GrantFiled: October 24, 2014Date of Patent: October 2, 2018Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 10053794Abstract: Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.Type: GrantFiled: September 19, 2017Date of Patent: August 21, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20180016699Abstract: Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.Type: ApplicationFiled: September 19, 2017Publication date: January 18, 2018Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Patent number: 9861020Abstract: A device comprises a rail configured to span and detachably couple to a housing. The device includes a plate that engages the housing and a mechanism securing the tool to the housing. The housing contains a printed circuit board configured with at least one row of slots, each slot configured with a retainer mechanism. A jaw assembly slides along the rail over more than one card positioned in the row of slots. The assembly includes a pair of inserts that perform either seating or extracting more than one card positioned in more than one slot. The device includes a lever for biasing the jaw assembly, where the inserts engage a selected one of more than one card positioned in more than one slot and the retainer mechanism for performing either simultaneously seating more than one card into or simultaneously extracting more than one card from more than slot.Type: GrantFiled: October 8, 2015Date of Patent: January 2, 2018Assignee: International Business Machines CorporationInventors: Karl O. Casserly, Leung M. Hung, Mark L. Monroe, Ronny R. Shipley, Tracy A. Tong, James Verzi
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Patent number: 9777388Abstract: Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.Type: GrantFiled: October 24, 2014Date of Patent: October 3, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Charles L. Arvin, Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres
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Publication number: 20170123465Abstract: A device comprises a rail configured to span and detachably couple to a housing. The device includes a plate that engages the housing and a mechanism securing the tool to the housing. The housing contains a printed circuit board configured with at least one row of slots, each slot configured with a retainer mechanism. A jaw assembly slides along the rail over more than one card positioned in the row of slots. The assembly includes a pair of inserts that perform either seating or extracting more than one card positioned in more than one slot. The device includes a lever for biasing the jaw assembly, where the inserts engage a selected one of more than one card positioned in more than one slot and the retainer mechanism for performing either simultaneously seating more than one card into or simultaneously extracting more than one card from more than slot.Type: ApplicationFiled: January 18, 2017Publication date: May 4, 2017Inventors: Karl O. Casserly, Mark L. Monroe, Leung M. Hung, Ronny R. Shipley, Tracy A. Tong, James Verzi
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Patent number: 9635795Abstract: A device comprises a rail configured to span and detachably couple to a housing. The device includes a plate that engages the housing and a mechanism securing the tool to the housing. The housing contains a printed circuit board configured with at least one row of slots, each slot configured with a retainer mechanism. A jaw assembly slides along the rail over more than one card positioned in the row of slots. The assembly includes a pair of inserts that perform either seating or extracting more than one card positioned in more than one slot. The device includes a lever for biasing the jaw assembly, where the inserts engage a selected one of more than one card positioned in more than one slot and the retainer mechanism for performing either simultaneously seating more than one card into or simultaneously extracting more than one card from more than slot.Type: GrantFiled: October 23, 2012Date of Patent: April 25, 2017Assignee: International Business Machines CorporationInventors: Karl O. Casserly, Leung M. Hung, Mark L. Monroe, Ronny R. Shipley, Tracy A. Tong, James P. Verzi