Patents by Inventor Tracy Scott Paulsen

Tracy Scott Paulsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
    Publication number: 20190385962
    Abstract: An embodiment semiconductor structure includes a metal layer. The semiconductor structure also includes a redistribution layer (RDL) structure including an RDL platform and a plurality of RDL pillars disposed between the RDL platform and the metal layer. Additionally, the semiconductor structure includes an under-bump metal (UBM) layer disposed on the RDL platform and a solder bump disposed on the UBM layer, where the UBM layer, the RDL platform, and the RDL pillars form an electrical connection between the solder bump and the metal layer.
    Type: Application
    Filed: June 15, 2018
    Publication date: December 19, 2019
    Inventors: Indumini W. Ranmuthu, Manoj Kumar Jain, Tracy Scott Paulsen