Patents by Inventor Traian Cornel CUCU

Traian Cornel CUCU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rosin-free thermosetting flux formulations
    Patent number: 9802275
    Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: October 31, 2017
    Inventors: Morgana de Avila Ribas, Rahul Raut, Traian Cornel Cucu, Shu Tai Yong, Siuli Sarkar, Ramakrishna Hosur Katagiriyappa
  • Rosin-Free Thermosetting Flux Formulations
    Publication number: 20160318134
    Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.
    Type: Application
    Filed: December 31, 2014
    Publication date: November 3, 2016
    Applicant: Alpha Metals, Inc.
    Inventors: Morgana de Avila Ribas, Rahul Raut, Traian Cornel CUCU, Shu Tai Yong, Siuli Sarkar, Ramakrishna Hosur Katagiriyappa