Patents by Inventor Tram Vo

Tram Vo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-component doping of copper seed layer
    Patent number: 7749361
    Abstract: A method of sputtering a copper seed layer and the target used therewith. The copper included in the sputtering target includes a first dopant reactive with copper and a second dopant unreactive with copper. Examples of the first dopant include Ti, Mg, and Al. Examples of the second dopant include Pd, Sn, In, Ir, and Ag. The amount of the first dopant may be determined by testing stress migration and that of the second dopant by testing electromigration.
    Type: Grant
    Filed: June 2, 2006
    Date of Patent: July 6, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Jie Chen, Peijun Ding, Suraj Rengarajan, Ling Chen, Tram Vo
  • Multi-component doping of copper seed layer
    Publication number: 20070278089
    Abstract: A method of sputtering a copper seed layer and the target used therewith. The copper included in the sputtering target includes a first dopant reactive with copper and a second dopant unreactive with copper. Examples of the first dopant include Ti, Mg, and Al. Examples of the second dopant include Pd, Sn, In, Ir, and Ag. The amount of the first dopant may be determined by testing stress migration and that of the second dopant by testing electromigration.
    Type: Application
    Filed: June 2, 2006
    Publication date: December 6, 2007
    Applicant: Applied Materials, Inc.
    Inventors: Jie Chen, Peijun Ding, Suraj Rengarajan, Ling Chen, Tram Vo