Patents by Inventor Tran Long
Tran Long has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7516436Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.Type: GrantFiled: July 11, 2006Date of Patent: April 7, 2009Assignee: Seiko Epson CorporationInventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
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Publication number: 20060253826Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.Type: ApplicationFiled: July 11, 2006Publication date: November 9, 2006Applicant: Seiko Epson CorporationInventors: Chong Lin, Tatao Chuang, Tran Long, Hy Hoang
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Patent number: 7103867Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.Type: GrantFiled: October 27, 2004Date of Patent: September 5, 2006Assignee: Seiko Epson CorporationInventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
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Publication number: 20050086625Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.Type: ApplicationFiled: October 27, 2004Publication date: April 21, 2005Applicant: Seiko Epson CorporationInventors: Chong Lin, Tatao Chuang, Tran Long, Hy Hoang
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Patent number: 6842885Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.Type: GrantFiled: February 20, 2002Date of Patent: January 11, 2005Assignee: Seiko Epson CorporationInventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
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Publication number: 20020078426Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.Type: ApplicationFiled: February 20, 2002Publication date: June 20, 2002Inventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
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Patent number: 6378120Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.Type: GrantFiled: January 12, 2001Date of Patent: April 23, 2002Assignee: Seiko Epson CorporationInventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
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Publication number: 20010002318Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.Type: ApplicationFiled: January 12, 2001Publication date: May 31, 2001Inventors: Chong M. Lin, Tatao Chuang, Tran Long, Hy Hoang
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Patent number: 6233721Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.Type: GrantFiled: March 16, 1999Date of Patent: May 15, 2001Assignee: Seiko Epson CorporationInventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
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Patent number: 5909377Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.Type: GrantFiled: December 23, 1997Date of Patent: June 1, 1999Assignee: Seiko Epson CorporationInventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
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Patent number: 5726904Abstract: An automatic method of generating slits in power buses on a chip. The present invention includes three embodiments. The first embodiment is directed to a generic method of generating power slits. Once bus dimensions are identified, predetermined parameters for optimal power slit size and number are used to automatically generate a power slit layer for the mask database. The second embodiment is a continuation of the first embodiment and is directed to a method of generating power slits for an orthogonal corner case; where two buses overlap at 90.degree. angles. This is performed by locating all corner cases. Power slits are removed within a cross (corner/intersect) area of overlapping buses. At this point power slits from overlapping buses are extended across the corner/intersect area. The extension lines are logically ANDed together/resulting in points within the corner/intersect area where the extension lines intersect.Type: GrantFiled: June 19, 1996Date of Patent: March 10, 1998Assignee: Seiko Epson CorporationInventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
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Patent number: 5561789Abstract: An intersect area of an apparatus having a plurality of power buses, and a method for making the same. An intersect area is defined by an overlap region where a first and second power bus overlap. The power buses can overlap at orthogonal and non-orthogonal angles. Each power bus has a vertical and horizontal axis, along which power flows. Power slits are located along two axes. The intersect area of the apparatus is void of power slits, but has holes at intersection points of a set of pointer lines. The pointer lines are imaginary lines emanating from the power slits.Type: GrantFiled: May 31, 1995Date of Patent: October 1, 1996Assignee: Seiko Epson CorporationInventors: Chong M. Lin, Tatao Chuang, Tran Long, Hy Hoang
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Patent number: 5461578Abstract: A power bus having power slits embodied therein. The present invention includes three embodiments. The first embodiment is directed to generic power buses. Each power bus has a first axis, along which power flows, and a second axis. Each of the power slits have an identical maximum width and minimum length. Power slits located along the first axis are separated from one another by a first minimum value, and power slits located along the second axis are separated from one another by a second minimum value. The first and second minimum values are selected as a function of electron flow and photolithography. The second embodiment is a continuation of the first embodiment and is directed to an apparatus with a plurality of power buses in which two buses overlap at 90.degree. angles. The overlap area of the apparatus is void of power slits, but has holes at intersection points of a set of pointer lines. The pointer lines are imaginary lines eminating from the power slits.Type: GrantFiled: August 11, 1994Date of Patent: October 24, 1995Assignee: Seiko Epson CorporationInventors: Chong M. Lin, Tatao Chuang, Tran Long, Hy Hoang
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Patent number: 5345394Abstract: An automatic method of generating slits in power buses on a chip. The present invention includes three embodiments. The first embodiment is directed to a generic method of generating power slits. Once bus dimensions are identified, predetermined parameters for optimal power slit size and number are used to automatically generate a power slit layer for the mask database. The second embodiment is a continuation of the first embodiment and is directed to a method of generating power slits for an orthogonal corner case; where two buses overlap at 90.degree. angles. This is performed by locating all corner cases. Power slits are removed within a cross (corner/intersect) area of overlapping buses. At this point power slits from overlapping buses are extended across the corner/intersect area. The extension lines are logically ANDed together resulting in points within the corner/intersect area where the extension lines intersect.Type: GrantFiled: February 10, 1992Date of Patent: September 6, 1994Assignee: S-MOS Systems, Inc.Inventors: Chong M. Lin, Tatao Chuang, Tran Long, Hy Hoang