Patents by Inventor Tran Long

Tran Long has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7516436
    Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: April 7, 2009
    Assignee: Seiko Epson Corporation
    Inventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Publication number: 20060253826
    Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
    Type: Application
    Filed: July 11, 2006
    Publication date: November 9, 2006
    Applicant: Seiko Epson Corporation
    Inventors: Chong Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Patent number: 7103867
    Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: September 5, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Publication number: 20050086625
    Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
    Type: Application
    Filed: October 27, 2004
    Publication date: April 21, 2005
    Applicant: Seiko Epson Corporation
    Inventors: Chong Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Patent number: 6842885
    Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: January 11, 2005
    Assignee: Seiko Epson Corporation
    Inventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Publication number: 20020078426
    Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
    Type: Application
    Filed: February 20, 2002
    Publication date: June 20, 2002
    Inventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Patent number: 6378120
    Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
    Type: Grant
    Filed: January 12, 2001
    Date of Patent: April 23, 2002
    Assignee: Seiko Epson Corporation
    Inventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Publication number: 20010002318
    Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
    Type: Application
    Filed: January 12, 2001
    Publication date: May 31, 2001
    Inventors: Chong M. Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Patent number: 6233721
    Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: May 15, 2001
    Assignee: Seiko Epson Corporation
    Inventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Patent number: 5909377
    Abstract: A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: June 1, 1999
    Assignee: Seiko Epson Corporation
    Inventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Patent number: 5726904
    Abstract: An automatic method of generating slits in power buses on a chip. The present invention includes three embodiments. The first embodiment is directed to a generic method of generating power slits. Once bus dimensions are identified, predetermined parameters for optimal power slit size and number are used to automatically generate a power slit layer for the mask database. The second embodiment is a continuation of the first embodiment and is directed to a method of generating power slits for an orthogonal corner case; where two buses overlap at 90.degree. angles. This is performed by locating all corner cases. Power slits are removed within a cross (corner/intersect) area of overlapping buses. At this point power slits from overlapping buses are extended across the corner/intersect area. The extension lines are logically ANDed together/resulting in points within the corner/intersect area where the extension lines intersect.
    Type: Grant
    Filed: June 19, 1996
    Date of Patent: March 10, 1998
    Assignee: Seiko Epson Corporation
    Inventors: Chong Ming Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Patent number: 5561789
    Abstract: An intersect area of an apparatus having a plurality of power buses, and a method for making the same. An intersect area is defined by an overlap region where a first and second power bus overlap. The power buses can overlap at orthogonal and non-orthogonal angles. Each power bus has a vertical and horizontal axis, along which power flows. Power slits are located along two axes. The intersect area of the apparatus is void of power slits, but has holes at intersection points of a set of pointer lines. The pointer lines are imaginary lines emanating from the power slits.
    Type: Grant
    Filed: May 31, 1995
    Date of Patent: October 1, 1996
    Assignee: Seiko Epson Corporation
    Inventors: Chong M. Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Patent number: 5461578
    Abstract: A power bus having power slits embodied therein. The present invention includes three embodiments. The first embodiment is directed to generic power buses. Each power bus has a first axis, along which power flows, and a second axis. Each of the power slits have an identical maximum width and minimum length. Power slits located along the first axis are separated from one another by a first minimum value, and power slits located along the second axis are separated from one another by a second minimum value. The first and second minimum values are selected as a function of electron flow and photolithography. The second embodiment is a continuation of the first embodiment and is directed to an apparatus with a plurality of power buses in which two buses overlap at 90.degree. angles. The overlap area of the apparatus is void of power slits, but has holes at intersection points of a set of pointer lines. The pointer lines are imaginary lines eminating from the power slits.
    Type: Grant
    Filed: August 11, 1994
    Date of Patent: October 24, 1995
    Assignee: Seiko Epson Corporation
    Inventors: Chong M. Lin, Tatao Chuang, Tran Long, Hy Hoang
  • Patent number: 5345394
    Abstract: An automatic method of generating slits in power buses on a chip. The present invention includes three embodiments. The first embodiment is directed to a generic method of generating power slits. Once bus dimensions are identified, predetermined parameters for optimal power slit size and number are used to automatically generate a power slit layer for the mask database. The second embodiment is a continuation of the first embodiment and is directed to a method of generating power slits for an orthogonal corner case; where two buses overlap at 90.degree. angles. This is performed by locating all corner cases. Power slits are removed within a cross (corner/intersect) area of overlapping buses. At this point power slits from overlapping buses are extended across the corner/intersect area. The extension lines are logically ANDed together resulting in points within the corner/intersect area where the extension lines intersect.
    Type: Grant
    Filed: February 10, 1992
    Date of Patent: September 6, 1994
    Assignee: S-MOS Systems, Inc.
    Inventors: Chong M. Lin, Tatao Chuang, Tran Long, Hy Hoang