Abstract: According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated on the top surface of the laminate substrate, where the antenna element is coupled to a laminate substrate bond pad. For example, the antenna element may also be coupled to the laminate substrate bond pad by a trace on the top surface of the laminate substrate. According to this exemplary embodiment, the structure further comprises a bonding wire that provides an electrical connection between the laminate substrate bond pad and a semiconductor die bond pad. For example, the input impedance of the antenna element coupled to the laminate substrate bond pad may match the output impedance at the semiconductor die bond pad. The structure may further comprise a capacitor coupled to the antenna element.

Abstract: One exemplary embodiment is a structure comprising a laminate substrate having a top surface for receiving a semiconductor die. The exemplary structure further comprises an antenna element situated on a bottom surface of the laminate substrate, where the antenna element is suitable for connection to the semiconductor die. According to this exemplary embodiment, the structure further comprises a laminate substrate reference pad in the laminate substrate, where the laminate substrate reference pad is situated over the antenna element. The exemplary structure further comprises at least one laminate substrate reference via situated at a side of the antenna element. The at least one laminate substrate reference via can be electrically connected to the laminate substrate reference pad. The at least one laminate substrate reference via can be electrically coupled to a printed circuit board reference via in a printed circuit board.

Abstract: A system provided for controlling an output frequency of a voltage controlled oscillator relative to a reference frequency. A method includes the steps of detecting a phase error between a divided output of the voltage controlled oscillator and the reference frequency, pumping a frequency control input of the voltage controlled oscillator with the phase error and adjusting a pumping gain based upon a magnitude of the frequency control input to the voltage controlled oscillator. This apparatus includes a phase detector adapted to detect the phase error between the divided output of the voltage controlled oscilator and the reference frequency and a charge pump adapted to pump the frequency control input of the voltage controlled oscillator with the phase error. The apparatus also includes a gain controller adapted to adjust the pumping gain based upon the magnitude of the frequency control input to the voltage controlled oscillator.

Abstract: A BALUN circuit comprising a lead network coupled to the positive phase output of a differential power amplifier, a negative phase output coupled to the negative phase output of the differential amplifier, and a delay element coupled in series with the lag network. The output of the lead network and the delay element are combined to form a single-ended output. The lag and lead networks may adjust the output impedances of the positive and negative phase outputs so that the output impedance of the single-ended output is set to a desired value. In one implementation, selected components of the lag and lead networks, and the delay element, comprise printed elements.

Abstract: A system provided for controlling an output frequency of a voltage controlled oscillator relative to a reference frequency. A method includes the steps of detecting a phase error between a divided output of the voltage controlled oscillator and the reference frequency, pumping a frequency control input of the voltage controlled oscillator with the phase error and adjusting a pumping gain based upon a magnitude of the frequency control input to the voltage controlled oscillator.

Abstract: A passive uniplanar double-balanced star RF mixer, comprising a substantially planar support substrate with a conductive layer of material disposed on one side and a slotline and first, second, and third coplanar waveguides formed therein which are configured to accommodate different frequencies. The first waveguide is bifurcated on one end into two waveguide branches which form first and second waveguide terminations each physically coupled to one end of the slotline. The second waveguide is electrically coupled to the first waveguide at a location spaced apart from the branches. The third waveguide is electrically coupled to the slotline at a position located approximately equi-distant from the slotline ends. A first grounding element is connected to the grounds of the first and third waveguides, and is positioned adjacent to the first branch termination. A conductive surface is enclosed by the waveguide branches and the slotline.

Abstract: A method and apparatus are disclosed for manufacturing large Monolithic Microwave Integrated Circuit (MMIC) arrays. MMIC elements are manufactured on a substrate to form a MMIC module and first conductive vias are created in the substrate at locations corresponding to contact points for the MMIC. The MMIC module is then secured to a multi-layered ceramic backplate structure for physical rigidity and electrical interconnection. The MMIC module uses a conductive material, such as chrome, to fill or coat the vias to provide electrical contact with MMIC contact pads. Each layer of the multi-layered backplate structure has an electrical interconnection circuit or network formed thereon, and conductive vias extending through the layer at locations corresponding to preselected vias in adjacent layers and electrical contacts for MMIC modules.

Abstract: A passive uniplanar double-balanced RF mixing apparatus, comprising a planar support substrate with first and second conductive layers disposed on first and second sides, and first and second linear slotlines having open terminations on a first end thereof formed in the first conductive layer. First and second coplanar waveguides are also formed in the first conductive layer with each having one end electrically coupled to first and of said first and second slotlines, respectively. A first balun comprises the first coplanar waveguide connection to the first slotline, and a second balun comprises the second coplanar waveguide connection the second slotline. An isolation gap formed in the first conductive layer adjacent to and between the first and second slotlines provided electrical isolation between the first and second baluns and waveguides for RF-toLO isolation.

Abstract: An antenna arrangement is disclosed for radiating and receiving circularly polarized radiation. A first antenna array having parallel stripline conductors is disposed on the top surface of a dielectric substrate. The stripline conductors have radiating tabs protruding outwardly therefrom in a direction about 45 degrees from the stripline conductors. A second antenna array having a second plurality of stripline conductor is disposed on the substrate. The second stripline conductors are interdigitated with the first stripline conductors. The second stripline conductors also have a plurality of outwardly protruding radiating elements which form about a 90 degree angle with the first radiating elements. The first and second antenna arrays are fed with two independent signals about 90 degrees apart and will independently radiate a horizontally linearly polarized wave and a vertically linearly polarized wave respectively, which becomes a circularly polarized wave at far field.

Abstract: A radar transceiver is disclosed which operates with circularly polarized waveforms. A single circularly polarized antenna is used to transmit and receive circularly polarized waveforms. A 3-dB directional coupler splits the signal to be transmitted into two signals 90.degree. out-of-phase for transmission by the antenna and also combines the horizontal and vertical components of any return signal.