Patents by Inventor Trang Thai
Trang Thai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955722Abstract: A phased array system has a substrate, a plurality of elements, a beamforming IC, and a plurality of feedlines electrically coupling the plurality of elements with at least one beamforming IC. In preferred embodiments, the feedlines are non-intersecting, symmetric feedlines that mitigate cross-polarization.Type: GrantFiled: April 8, 2022Date of Patent: April 9, 2024Assignee: Anokiwave, Inc.Inventors: Trang Thai, Jason Leo Durbin
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Publication number: 20240072419Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.Type: ApplicationFiled: November 8, 2023Publication date: February 29, 2024Applicant: Intel CorporationInventors: Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, William J. Lambert, Benjamin Jann
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Patent number: 11870132Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.Type: GrantFiled: May 9, 2022Date of Patent: January 9, 2024Assignee: Intel CorporationInventors: Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, William J. Lambert, Benjamin Jann
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Patent number: 11749889Abstract: A phased array system has a substrate, a plurality of elements, and a plurality of beamforming ICs. Each beamforming IC has a first set of element interfaces and a second set of element interfaces. The first set of element interfaces may be configured to be polarized in a first polarization, while the second set of element interfaces may be configured to be polarized in a second (different) polarization. Each beamforming IC has a first common interface electrically coupled with its first set of element interfaces and, in a corresponding manner, each beamforming IC also has a second common interface electrically coupled with its second set of element interfaces. The system further has an interconnect element (e.g., a circuit trace, metallization on a PCB, etc.) electrically coupling the first common interface with the second common interface of another beamforming IC.Type: GrantFiled: April 8, 2022Date of Patent: September 5, 2023Assignee: Anokiwave, Inc.Inventors: Trang Thai, Jason L. Durbin, Vipul Jain, Michael Coolen
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Patent number: 11664596Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.Type: GrantFiled: July 13, 2021Date of Patent: May 30, 2023Assignee: Intel CorporationInventors: Sidharth Dalmia, Trang Thai, William James Lambert, Zhichao Zhang, Jiwei Sun
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Publication number: 20230035608Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.Type: ApplicationFiled: October 7, 2022Publication date: February 2, 2023Applicant: Intel CorporationInventors: Sidharth Dalmia, Trang Thai
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Patent number: 11509037Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.Type: GrantFiled: May 29, 2018Date of Patent: November 22, 2022Assignee: Intel CorporationInventors: Sidharth Dalmia, Trang Thai
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Patent number: 11502419Abstract: A patch array has a routing printed circuit board with a plurality of layers for routing signals, and a plurality of printed circuit board patches that each has at least one through-via. The plurality of patches are mounted with the routing printed circuit board. In addition, the plurality of printed circuit board patches are formed in compliance with standard printed circuit board rules.Type: GrantFiled: November 20, 2020Date of Patent: November 15, 2022Assignee: Anokiwave, Inc.Inventors: Trang Thai, Jason Leo Durbin, Peter Moosbrugger
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Publication number: 20220278439Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.Type: ApplicationFiled: May 9, 2022Publication date: September 1, 2022Applicant: Intel CorporationInventors: Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, William J. Lambert, Benjamin Jann
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Patent number: 11411307Abstract: A symmetric, multi-layer, three-way power divider that is equally balanced, with resistors placed between all combinations of legs. This three-way power divider is specifically designed to be used in millimeter wave applications (e.g., 5G in the 20 GHz-40 GHz range for both dual and single polarization), specifically in designs where a common signal is distributed to a multiple of three elements. This three-way power divider also can be useful for addressing space constraints in 5G applications, e.g., due to routing limitations.Type: GrantFiled: October 15, 2021Date of Patent: August 9, 2022Assignee: Anokiwave, Inc.Inventors: Jason Leo Durbin, Trang Thai, Peter Moosbrugger
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Patent number: 11380979Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.Type: GrantFiled: March 29, 2018Date of Patent: July 5, 2022Assignee: Intel CorporationInventors: Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, William James Lambert, Benjamin Jann
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Patent number: 11374322Abstract: Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.Type: GrantFiled: September 30, 2017Date of Patent: June 28, 2022Assignee: Intel CorporationInventors: Omer Asaf, Sidharth Dalmia, Trang Thai, Josef Hagn, Richard S. Perry, Jonathan C. Jensen, Raanan Sover
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Patent number: 11336015Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: a substrate including an antenna feed structure; an antenna patch, wherein the antenna patch is a millimeter wave antenna patch; and an air cavity between the antenna patch and the substrate.Type: GrantFiled: March 28, 2018Date of Patent: May 17, 2022Assignee: Intel CorporationInventors: Trang Thai, Sidharth Dalmia
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Publication number: 20220123462Abstract: A symmetric, multi-layer, three-way power divider that is equally balanced, with resistors placed between all combinations of legs. This three-way power divider is specifically designed to be used in millimeter wave applications (e.g., 5G in the 20 GHz-40 GHz range for both dual and single polarization), specifically in designs where a common signal is distributed to a multiple of three elements. This three-way power divider also can be useful for addressing space constraints in 5G applications, e.g., due to routing limitations.Type: ApplicationFiled: October 15, 2021Publication date: April 21, 2022Inventors: Jason Leo Durbin, Trang Thai, Peter Moosbrugger
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Publication number: 20210344116Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.Type: ApplicationFiled: July 13, 2021Publication date: November 4, 2021Applicant: Intel CorporationInventors: Sidharth Dalmia, Trang Thai, William James Lambert, Zhichao Zhang, Jiwei Sun
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Patent number: 11121468Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.Type: GrantFiled: September 8, 2020Date of Patent: September 14, 2021Assignee: Intel CorporationInventors: Sidharth Dalmia, Trang Thai, William James Lambert, Zhichao Zhang, Jiwei Sun
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Publication number: 20210234260Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.Type: ApplicationFiled: April 15, 2021Publication date: July 29, 2021Applicant: Intel IP CorporationInventors: Trang Thai, Sidharth Dalmia, Raanan Sover, Josef Hagn, Omer Asaf, Simon Svendsen
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Patent number: 11011827Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.Type: GrantFiled: May 11, 2018Date of Patent: May 18, 2021Assignee: Intel IP CorporationInventors: Trang Thai, Sidharth Dalmia, Raanan Sover, Josef Hagn, Omer Asaf, Simon Svendsen
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Publication number: 20200403316Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.Type: ApplicationFiled: September 8, 2020Publication date: December 24, 2020Applicant: Intel CorporationInventors: Sidharth Dalmia, Trang Thai, William James Lambert, Zhichao Zhang, Jiwei Sun
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Patent number: 10797394Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.Type: GrantFiled: June 5, 2018Date of Patent: October 6, 2020Assignee: Intel CorporationInventors: Sidharth Dalmia, Trang Thai, William James Lambert, Zhichao Zhang, Jiwei Sun