Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.

Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.

Abstract: A patch array has a routing printed circuit board with a plurality of layers for routing signals, and a plurality of printed circuit board patches that each has at least one through-via. The plurality of patches are mounted with the routing printed circuit board. In addition, the plurality of printed circuit board patches are formed in compliance with standard printed circuit board rules.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: A symmetric, multi-layer, three-way power divider that is equally balanced, with resistors placed between all combinations of legs. This three-way power divider is specifically designed to be used in millimeter wave applications (e.g., 5G in the 20 GHz-40 GHz range for both dual and single polarization), specifically in designs where a common signal is distributed to a multiple of three elements. This three-way power divider also can be useful for addressing space constraints in 5G applications, e.g., due to routing limitations.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: a substrate including an antenna feed structure; an antenna patch, wherein the antenna patch is a millimeter wave antenna patch; and an air cavity between the antenna patch and the substrate.

Abstract: A symmetric, multi-layer, three-way power divider that is equally balanced, with resistors placed between all combinations of legs. This three-way power divider is specifically designed to be used in millimeter wave applications (e.g., 5G in the 20 GHz-40 GHz range for both dual and single polarization), specifically in designs where a common signal is distributed to a multiple of three elements. This three-way power divider also can be useful for addressing space constraints in 5G applications, e.g., due to routing limitations.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: An RF transceiver device, for use in an RF system, includes a chip package comprising one or more circuit components, a signal cable, and an antenna block. The signal cable is configured to carry signals sent to the chip package or received from the chip package. The signal cable has a first surface and a second surface. The chip package is directly coupled to the first surface of the signal cable. The antenna block comprises one or more antennas and is directly coupled to the second surface of the signal cable. By directly coupling the chip package and antenna block to the signal cable, bulky connectors are no longer needed thus reducing the total footprint of the transceiver device and increasing signal fidelity. The arrangement may be integrated with, for example, a PCB or a communication system.

Abstract: Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

Abstract: Apparatus, systems and articles of manufacture to provide improved, dynamic wireless spectrum analysis in a healthcare environment are disclosed and described. An example apparatus includes radios to capture wireless signal information in an environment. The example apparatus includes a processor to activate and configure one or more of the radios according to a center frequency and/or a bandwidth to capture wireless signal information associated with the center frequency and/or bandwidth. The example processor is to generate a model of wireless signal activity based on the captured wireless signal information. The example model is to facilitate testing of a device according to the wireless signal activity in the environment. The example apparatus is to be portable to be positioned in the environment to capture the wireless signal information in the environment according to the one or more radios activated and configured by the processor for the environment.

Abstract: Apparatus, systems and articles of manufacture to provide improved, dynamic wireless spectrum analysis in a healthcare environment are disclosed and described. An example apparatus includes radios to capture wireless signal information in an environment. The example apparatus includes a processor to activate and configure one or more of the radios according to a center frequency and/or a bandwidth to capture wireless signal information associated with the center frequency and/or bandwidth. The example processor is to generate a model of wireless signal activity based on the captured wireless signal information. The example model is to facilitate testing of a device according to the wireless signal activity in the environment. The example apparatus is to be portable to be positioned in the environment to capture the wireless signal information in the environment according to the one or more radios activated and configured by the processor for the environment.