Abstract: A process (100) for the recovery of solvent (1) from solvent-containing cellulosic particles (2) is shown, the process comprising the steps: a) extracting the solvent (1) from the cellulosic particles (2) by means of a liquid extraction medium (3), thereby obtaining a solvent-enriched extraction medium (5), and b) obtaining the recovered solvent (6) from the solvent-enriched extraction medium (5). In order to improve the efficiency of the process, it is proposed that in step a) the solvent (1) is extracted from the cellulosic particles (2) in a continuous flow extraction reactor (4), wherein the extraction medium (3) continuously flows through the extraction reactor (4) to extract the solvent (1) from the cellulosic particles (2).

Abstract: A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

Abstract: A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.