Patents by Inventor Travis Arthur ABSHERE

Travis Arthur ABSHERE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink formed from a high pipe density silicon carbide substrate
    Patent number: 11088049
    Abstract: Some embodiments may include a porous silicon carbide substrate plugged with dielectric material, the porous silicon carbide substrate including a first side to couple to a heat source and a second side to couple to an electrically conductive surface, wherein the second side is opposite the first side; wherein in the case that an opening on the area of the first side forms a channel with an opening on an area of the second side, a portion of the dielectric material located in the channel is arranged to prevent an electrical short from forming through the porous silicon carbide substrate to the electrically conductive surface. In some examples, the heat source may be one or more semiconductor laser diode chips. Other embodiments may be disclosed and/or claimed.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: August 10, 2021
    Assignee: NLIGHT INC.
    Inventor: Travis Arthur Abshere
  • HEAT SINK FORMED FROM A HIGH PIPE DENSITY SILICON CARBIDE SUBSTRATE
    Publication number: 20200126885
    Abstract: Some embodiments may include a porous silicon carbide substrate plugged with dielectric material, the porous silicon carbide substrate including a first side to couple to a heat source and a second side to couple to an electrically conductive surface, wherein the second side is opposite the first side; wherein in the case that an opening on the area of the first side forms a channel with an opening on an area of the second side, a portion of the dielectric material located in the channel is arranged to prevent an electrical short from forming through the porous silicon carbide substrate to the electrically conductive surface. In some examples, the heat source may be one or more semiconductor laser diode chips. Other embodiments may be disclosed and/or claimed.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 23, 2020
    Applicant: NLIGHT, INC.
    Inventor: Travis Arthur ABSHERE