Abstract: A cutting machine for cutting a vegetable product includes a multi-knife cutting plate mounted in-line along a product flow path and a drive motor, whereby the cutting plate moves in an orbital motion in a plane substantially perpendicular to the flow path, thereby moving the cutting knives sequentially and repeatedly across the product flow path. A system for cutting vegetable products includes a transport system configured for transporting vegetable products in single file toward an outlet, a plurality of cutting machines, a collection system disposed downstream of the cutting machines and configured to collect the vegetables after cutting, and a selection device configured to selectively couple the outlet of the transport system to one or more of the cutting machines. The plurality of cutting machines may be mounted upon a transport device to selectively move one of the cutting machines into communication with the outlet of the transport system.

Abstract: A cutting machine for cutting a vegetable product includes a frame, supporting a product flow path, at least three links, pivotally attached to the frame, a cutting plate, pivotally attached to each of the three links at three pivot points and oriented substantially perpendicular to the flow path, a plurality of cutting knives, carried by the cutting plate, each having a generally corrugated configuration defining adjacent peaks and troughs, the cutting knives oriented angularly with respect to each other, and a drive motor, coupled to rotationally drive at least one of the links with respect to the frame, whereby the cutting plate moves in an orbital motion in a plane substantially perpendicular to the flow path, thereby moving the cutting knives sequentially and repeatedly across the product flow path.

Abstract: A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.

Abstract: A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.