Abstract: A test contactor is disclosed. The test contactor includes two or more dielectric layers and a test probe embedded in the one or more dielectric layers. The test contactor traverses the one or more dielectric layers. The test probe to include an input signal port and an output signal port and the test probe to transmit a test signal from the input signal port to the output signal port.

Abstract: A pipe connection in the form of a shrinkage connection formed from a connecting piece (1) having a surface structure (11), and a pipe (2) having an inner diameter which is smaller than the outer diameter of the connecting piece (1), wherein the surface structure (11) comprises a radially projecting flange (12) and at least one circumferential groove (13a, 13b, . . . ), the pipe (2) comprises a pipe end (21) which has been expanded in environmental temperature and connected to the connecting piece (1) by back-shrinkage. A sealing ring (3) is in the circumferential groove (13a, 13b, . . . ), which sealing ring (3) has an annular profile having an inner surface (31), being engageable with a connecting piece (1), and an outer surface (32), being engageable with the pipe (2), and the outer surface (32) comprises more than one annular ridge (33a, 33b, . . . ) adjacent to each other in axial direction.

Abstract: A test probe for use with a testing apparatus. The test probe includes a first portion, a second portion, and a third portion, with hinges between the first and second portions and the second and third portions. The first portion folded at the first hinge over the second portion, the third portion folded at the second hinge over the second portion, where the second portion is stacked between the first portion and the third portion. The test probe is compressible from a first uncompressed state to a second compressed state.

Abstract: A test contactor is disclosed. The test contactor includes two or more dielectric layers and a test probe embedded in the one or more dielectric layers. The test contactor traverses the one or more dielectric layers. The test probe to include an input signal port and an output signal port and the test probe to transmit a test signal from the input signal port to the output signal port.

Abstract: A computing device includes a support structure with at least one edge. The computing device includes a cover connected to the support structure. The cover extends to or beyond the at least one edge of the support structure by no more than between 0 and 100 microns over an edge length of at least 100 mm. A fabric cover includes a cover edge and a cover surface. The cover edge and/or the cover surface include an edge feature. A method of manufacturing a computing device is described. The method includes determining an edge of a computing device and based on the edge that was determined, cutting the fabric cover between 0 and 100 microns of the edge of the computing device over an edge length of the computing device of at least 100 mm.

Abstract: A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface. A method of manufacturing a computing device is described. The method includes applying an adhesive to a cover. A support structure of a computing device is heated. The support structure is cooled. While the support structure is heated and cooled, pressure is applied to the cover.

Abstract: A test probe for use with a testing apparatus. The test probe includes a first portion, a second portion, and a third portion, with hinges between the first and second portions and the second and third portions. The first portion folded at the first hinge over the second portion, the third portion folded at the second hinge over the second portion, where the second portion is stacked between the first portion and the third portion. The test probe is compressible from a first uncompressed state to a second compressed state.

Abstract: An input device is described. The input device may include at least four key caps of a keyset and a keyboard cover surrounding the at least four key caps. Each key cap of the at least four key caps may be separated by at least one gap. The at least one gap may be between 0.075 mm and 0.525 mm. A method of manufacturing an input device is described. The method may include measuring at least four keycaps in a keyset. Each key cap of the at least four key caps may be separated on a side from a keyboard cover by a gap. The method may include cutting a substrate to fit between the at least four keycaps in the keyset such that the gap of each of the at least four keys is between 0.075 mm and 0.525 mm.

Abstract: A tattooing device is designed for ingraining a design on the skin. The tattooing device includes an electric drive motor with a rotatable motor pin. The motor pin defines an axis of rotation. A rotatable actuator cam is operatively connected to the motor pin, and comprises a cam post axially offset from the motor pin and the axis of rotation. An elongated drive shaft is operatively connected to the cam post, such that rotation of the actuator cam effects simultaneous substantially linear reciprocating movement of the drive shaft. A needle assembly is operatively connected to the drive shaft, and adapted for carrying a pointed tattooing needle for penetrating the skin.

Abstract: A set of modules from which custom passive backplanes can be assembled coplanarly couple together and are mounted on a rigid base plate which holds them coupled and coplanar. Each module has a plurality of orthogonally oriented card connectors. Preferably there is a CPU module into which is plugged a CPU card from which an ISA and a PCI originates. On one edge of the CPU module is an connector communicating with the ISA bus. This connector is for chaining together one or more ISA modules, each of which expands the ISA bus to three more ISA connectors. On an opposite edge of the CPU module is an connector communicating with the PCI bus. This connector is for chaining together one or more PCI modules, either 32-bit or 64-bit, each of which expands the PCI bus to three more PCI connectors. Power and ground can be jumpered from module to module or can be directly connected to any module.