Patents by Inventor Travis Hambach

Travis Hambach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140186486
    Abstract: An apparatus for producing rectangular seeds for use in semiconductor or solar material manufacturing includes a template having a top surface and parallel slots, and an adhesive layer connected to the top surface of the template. The adhesive layer includes alignment lines aligned with the parallel slots. The apparatus also includes quarter sections made of a semiconductor or solar material and connected to the alignment layer. An interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines. A wire web is adapted to slice through the interface of each quarter section to separate the rectangular seed portions from the curved wing portions to produce rectangular seeds.
    Type: Application
    Filed: December 31, 2012
    Publication date: July 3, 2014
    Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
    Inventors: Jihong John Chen, Susan S. Dwyer, Shawn Hayes, Tom Doane, Dale A. Witte, Linda K. Swiney, Travis Hambach
  • Publication number: 20140182776
    Abstract: A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the alignment layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.
    Type: Application
    Filed: December 31, 2012
    Publication date: July 3, 2014
    Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
    Inventors: Jihong John Chen, Susan S. Dwyer, Shawn Hayes, Tom Doane, Dale A. Witte, Linda K. Swiney, Travis Hambach
  • Publication number: 20140137794
    Abstract: A method of preparing a directional solidification system (DSS) furnace for use in semiconductor or solar manufacturing includes slicing a plurality of cylindrical rods to produce a plurality of rectangular seed bricks, a plurality of corner portions, and a plurality of quarter sections, and cropping the plurality of rectangular seed bricks into a plurality of rectangular seeds.
    Type: Application
    Filed: November 19, 2012
    Publication date: May 22, 2014
    Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
    Inventors: Dale A. Witte, Jihong John Chen, Travis Hambach, Linda Swiney