Patents by Inventor Travis Kemper

Travis Kemper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Efficient method to predict integrated circuit temperature and power maps
    Patent number: 7627841
    Abstract: The temperature distribution associated with a design of an integrated circuit is calculated by convoluting a surface power usage represented by a power matrix with a heat spreading function. The heat spreading function may be calculated from a simulation of a point source on the integrated circuit using a finite element analysis model of the integrated circuit or other techniques. To account for spatial variations on the chip, the heat spreading function may be made dependent on position using a position scaling function. Steady-state or transient temperature distributions may be computed by using a steady-state or transient heat spreading function. A single heat spreading function may be convolved with various alternative power maps to efficiently calculate temperature distributions for different designs. In an inverse problem, one can calculate the power map from an empirically measured temperature distribution and a heat spreading function using various de-convolution techniques.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: December 1, 2009
    Assignee: The Regents of the University of California, Santa Cruz
    Inventors: Ali Shakouri, Travis Kemper, Yan Zhang, Peyman Milanfar, Virginia Martin Hériz, Xi Wang
  • Efficient method to predict integrated circuit temperature and power maps
    Publication number: 20080026493
    Abstract: The temperature distribution associated with a design of an integrated circuit is calculated by convoluting a surface power usage represented by a power matrix with a heat spreading function. The heat spreading function may be calculated from a simulation of a point source on the integrated circuit using a finite element analysis model of the integrated circuit or other techniques. To account for spatial variations on the chip, the heat spreading function may be made dependent on position using a position scaling function. Steady-state or transient temperature distributions may be computed by using a steady-state or transient heat spreading function. A single heat spreading function may be convolved with various alternative power maps to efficiently calculate temperature distributions for different designs. In an inverse problem, one can calculate the power map from an empirically measured temperature distribution and a heat spreading function using various de-convolution techniques.
    Type: Application
    Filed: April 12, 2007
    Publication date: January 31, 2008
    Inventors: Ali Shakouri, Travis Kemper, Yan Zhang, Peyman Milanfar, Virginia Martin Heriz, Xi Wang