Patents by Inventor Travis L. Hambach

Travis L. Hambach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for producing rectangular seeds for ingot growth
    Patent number: 9499920
    Abstract: A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the adhesive layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: November 22, 2016
    Assignee: MEMC Singapore Pte. Ltd. (UEN200614794D)
    Inventors: Jihong John Chen, Susan S. Dwyer, Shawn Wesley Hayes, Thomas E. Doane, Dale A. Witte, Linda K. Swiney, Travis L. Hambach
  • METHODS FOR PRODUCING RECTANGULAR SEEDS FOR INGOT GROWTH
    Publication number: 20150308011
    Abstract: A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the adhesive layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.
    Type: Application
    Filed: July 9, 2015
    Publication date: October 29, 2015
    Inventors: Jihong John Chen, Susan S. Dwyer, Shawn Wesley Hayes, Thomas E. Doane, Dale A. Witte, Linda K. Swiney, Travis L. Hambach
  • Methods for producing rectangular seeds for ingot growth
    Patent number: 9111745
    Abstract: A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the alignment layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: August 18, 2015
    Assignee: MEMC Singapore Pte., Ltd. (UEN200614794D)
    Inventors: Jihong John Chen, Susan S. Dwyer, Shawn Wesley Hayes, Thomas E. Doane, Dale A. Witte, Linda K. Swiney, Travis L. Hambach
  • Systems and methods for producing seed bricks
    Patent number: 8900972
    Abstract: A method of producing rectangular seed bricks for use in semiconductor or solar manufacturing is disclosed. The method includes connecting an alignment layer to a top surface of a template, drawing alignment lines on the alignment layer to demarcate a plurality of nodes, connecting cylindrical rods to the alignment layer such that a center of each rod is aligned with a corresponding node, and slicing through the rods and the alignment layer with a wire web to produce rectangular seed bricks.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: December 2, 2014
    Assignee: MEMC Singapore Pte. Ltd.
    Inventors: Dale A. Witte, Jihong John Chen, Travis L. Hambach, Linda K. Swiney
  • Systems and Methods for Producing Seed Bricks
    Publication number: 20140137395
    Abstract: A method of producing rectangular seed bricks for use in semiconductor or solar manufacturing is disclosed. The method includes connecting an alignment layer to a top surface of a template, drawing alignment lines on the alignment layer to demarcate a plurality of nodes, connecting cylindrical rods to the alignment layer such that a center of each rod is aligned with a corresponding node, and slicing through the rods and the alignment layer with a wire web to produce rectangular seed bricks.
    Type: Application
    Filed: November 19, 2012
    Publication date: May 22, 2014
    Applicant: MEMC Singapore, Pte. Ltd (UEN200614797D)
    Inventors: Dale A. Witte, Jihong John Chen, Travis L. Hambach, Linda K. Swiney